Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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08/17/1988 | EP0278413A2 Method for making a connection between a bonding wire and a contact pad in hybrid thick-film circuits |
08/17/1988 | EP0278077A2 Assembly with temperature sensitive devices |
08/17/1988 | CN88100545A Transfer for automatic application |
08/17/1988 | CN87108226A Photopolymerizable composition having superior adhesion, articles and processes |
08/16/1988 | US4764848 Surface mounted array strain relief device |
08/16/1988 | US4764846 High density electronic package comprising stacked sub-modules |
08/16/1988 | US4764791 Work alignment apparatus for double-sided exposure of a work |
08/16/1988 | US4764659 Thermal head |
08/16/1988 | US4764485 Method for producing via holes in polymer dielectrics |
08/16/1988 | US4764449 Support membrane in contact with photoresist and adhesive layer |
08/16/1988 | US4764416 Electric element circuit using oxidation-reduction substances |
08/16/1988 | US4764401 Process for activating substrate surfaces for electroless metallization |
08/16/1988 | US4764341 Bonding of pure metal films to ceramics |
08/16/1988 | US4764327 Process of producing plastic-molded printed circuit boards |
08/16/1988 | US4764233 Sheets from mixtures of silica of different crystal forms scurried with binder; lamination, firing |
08/16/1988 | US4763829 Soldering of electronic components |
08/16/1988 | US4763408 Method of making a compliant retention section on an electrical terminal |
08/16/1988 | US4763403 Method of making an electronic component |
08/16/1988 | CA1240747A1 Electrical connector |
08/11/1988 | WO1988005990A1 Cladding of substrates with thick metal circuit patterns |
08/11/1988 | WO1988005959A1 Ceramic substrate with conductively-filled vias and method for producing |
08/10/1988 | EP0277828A2 Thin film artwork compounds |
08/10/1988 | EP0277653A2 Pancake armature |
08/10/1988 | EP0277325A1 Method of and coating material for producing a printed conductive pattern on an insulated substrate |
08/10/1988 | EP0277209A1 Wave solder finger shield apparatus. |
08/10/1988 | EP0277148A1 Method for manufacture of printed circuit boards |
08/10/1988 | EP0277118A1 Removable commoning bar. |
08/10/1988 | EP0144374B1 Component leg bending device |
08/10/1988 | EP0028657B1 Hollow multilayer printed wiring board, and method of fabricating same |
08/10/1988 | CN87105998A Embedded catalyst receptors for metallization of dielectrics |
08/09/1988 | US4763308 Battery housing for an electronic watch |
08/09/1988 | US4763227 Aluminum electrolytic capacitor package with stabilizing third lead |
08/09/1988 | US4763223 Display apparatus |
08/09/1988 | US4763157 For transfer of a developed image |
08/09/1988 | US4763041 Dot array fluorescent tube for writing optical information in optical printer |
08/09/1988 | US4762747 Good adhesion to polyimides |
08/09/1988 | US4762732 Patters of silver solders in curable polymers |
08/09/1988 | US4762606 Mini chip carrier slotted array |
08/09/1988 | US4762578 Tip is advanced to preferred spacing without overshooting or contact |
08/09/1988 | US4762560 Copper colloid and method of activating insulating surfaces for subsequent electroplating |
08/09/1988 | US4761881 Single step solder process |
08/09/1988 | US4761880 Method of obtaining surface mount component planarity |
08/09/1988 | US4761876 High speed precision drilling system |
08/09/1988 | CA1240412A1 Machines for handling electrical components |
08/09/1988 | CA1240404A1 Infrared process and apparatus for infrared soldering components on circuit boards |
08/09/1988 | CA1240377A1 Electrical terminal for flexible printed circuits |
08/09/1988 | CA1240373A1 Surface mountable microwave ic package |
08/04/1988 | DE3703728C1 Arrangement for mounting heat-generating electrical circuit elements on a circuit board |
08/03/1988 | EP0276965A1 Transfer for automatic application |
08/03/1988 | EP0276725A1 Apparatus for electroplating plate-like work pieces, particularly circuit boards |
08/03/1988 | EP0276518A1 Lead immersion bath and method of supplificially exchanging a tin layer for a lead layer |
08/03/1988 | EP0276386A1 Process for depositing a solder layer on metallic or metallized surfaces of components |
08/03/1988 | EP0276276A1 Method for manufacture of printed circuit boards. |
08/03/1988 | CN87100490A Multi-layer circuit board fabrication process |
08/03/1988 | CN87100339A Method of patterning resist for printed wiring boards |
08/03/1988 | CN86106985A Method for integration of resistors in chemically deposited conductor networks |
08/02/1988 | US4761561 Laser beam scanning pattern generation system with positional and dimensional error correction |
08/02/1988 | US4761517 Electrical connections with controlled thermal and electrical resistances |
08/02/1988 | US4761363 UV curable compositions for making improved solder mask coatings |
08/02/1988 | US4761345 Aluminum nitride substrate |
08/02/1988 | US4761332 Silicon nitride deposition |
08/02/1988 | US4761325 Copper conductors separated by glass-ceramic insulating layers |
08/02/1988 | US4761304 Electroless deposition of metals, lamination, images |
08/02/1988 | US4761303 Dielectrics masking, applying copper |
08/02/1988 | US4761213 Treatment facility particularly for printed circuit boards to be treated while in a horizontal plane |
08/02/1988 | US4760948 Leadless chip carrier assembly and method |
08/02/1988 | US4760639 Apparatus for equipping circuit boards |
08/02/1988 | CA1240072A1 Metal cored circuit board with baked-on polymer layer |
08/02/1988 | CA1240071A1 Housing for an electronic device |
07/29/1988 | EP0177571A4 Double planarization process for multilayer metallization of int egrated circuit structures. |
07/28/1988 | WO1988005559A1 Method of patterning resist |
07/28/1988 | WO1988005428A1 Method for connecting leadless chip packages and articles |
07/28/1988 | DE3701310A1 Contact-making device for making contact with surface-mounted integrated circuits |
07/28/1988 | DE3701108A1 Method for joining two metal parts |
07/28/1988 | DE3701013A1 Method for microscopic soldering |
07/27/1988 | EP0276062A2 Method of mounting a substrate structure to a circuit board |
07/27/1988 | EP0276004A2 Multilayer ceramic substrate and method for making the same |
07/27/1988 | EP0275891A2 Bonding compositions for the manufacture of additive printed wiring boards and printed wiring boards made with the bonding composition |
07/27/1988 | EP0275686A1 Improved multi-layer printed circuit boards, and methods of manufacturing such boards |
07/27/1988 | EP0275512A1 Immersion process and apparatus for electroplating plates, particularly printed-circuit boards |
07/27/1988 | EP0275433A1 Method for mounting electronic components on a substrate, foil to carry out the method and method to produce the foil |
07/27/1988 | CN88100085A Photosensitive compositions containing microcapsules concentrated in surface layer |
07/27/1988 | CN87108179A Method for inspecting printed circuit boards for missing or misplaced components |
07/27/1988 | CN87105952A Conductive pattern producing method and its applications |
07/27/1988 | CN87100302B Manufacture method of flexible circuit board |
07/26/1988 | US4760242 Fused eyeletting machine |
07/26/1988 | US4759986 Associated with covellite copper sulfide |
07/26/1988 | US4759970 Electronic carrier devices and methods of manufacture |
07/26/1988 | US4759965 Ceramic, preparation thereof and electronic circuit substrate by use thereof |
07/26/1988 | US4759952 Selectively catalyzing non-imaged areas of printed ciruit with a catalyst having specific charge |
07/26/1988 | US4759809 Method for forming alignment holes in a film to be laminated to a substrate having positioning holes |
07/26/1988 | US4759491 Method and apparatus for applying bonding material to component leads |
07/26/1988 | US4759490 Method for soldering electronic components onto a printed wiring board using a solder paste |
07/26/1988 | CA1239685A1 Microwave detection system |
07/21/1988 | DE3700611A1 Method of applying conductor tracks to cutting attachments made of mechanically resistant materials |
07/20/1988 | EP0275071A2 Adherent coating for copper |
07/20/1988 | EP0275070A2 Multilayer printed wiring board and method for making same |
07/20/1988 | EP0275052A2 Method for making a ceramic multilayer structure having internal copper conductors |
07/20/1988 | EP0275044A2 Photosensitive compositions containing microcapsules concentrated in surface layer |
07/20/1988 | EP0274915A1 A dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors |