| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/14/1987 | US4657719 Forming thin film of resin an hardening |
| 04/14/1987 | US4657632 Use of immersion tin coating as etch resist |
| 04/14/1987 | US4657589 Solder cream |
| 04/14/1987 | US4657452 Contouring machine for printed circuits |
| 04/14/1987 | US4657322 Microwave interconnect |
| 04/14/1987 | US4657172 Apparatus and method of solder coating integrated circuit leads |
| 04/14/1987 | US4657169 Non-contact detection of liquefaction in meltable materials |
| 04/14/1987 | EP0139662A4 Improved socket terminal positioning method and construction. |
| 04/14/1987 | CA1220513A1 Battery holder for coin cells |
| 04/09/1987 | WO1987002213A1 Method and device for cleaning and drying electronic printed circuits |
| 04/09/1987 | DE3535709A1 Process for applying a layer of electrically conductive polymers to other materials |
| 04/08/1987 | EP0217678A2 Chip carrier alignment device and alignment method |
| 04/08/1987 | EP0217588A1 Method and apparatus for fuse-bonding articles |
| 04/08/1987 | EP0217584A2 Highly thermoconductive ceramic substrate |
| 04/08/1987 | EP0217471A1 Semiconductor power device for surface mounting |
| 04/08/1987 | EP0217324A2 Photopolymer films containing microencapsulated sensitometric adjuvants |
| 04/08/1987 | EP0217156A1 Electrically conductive member for plating and electrolyzing |
| 04/08/1987 | EP0217019A2 Method of manufacturing interconnection circuit boards |
| 04/08/1987 | EP0216955A1 Method for preparing an electrolyte solution for electroplating tin or tin-lead alloys |
| 04/07/1987 | US4656442 Hybrid circuit device |
| 04/07/1987 | US4656314 Ultraviolet reactive ink is applied to translucence substrate, partial curing then deposition of metallic particles |
| 04/07/1987 | US4656050 Polyimides |
| 04/07/1987 | US4656048 Drawing nozzle with slit opening |
| 04/07/1987 | US4655524 Solderless connection apparatus |
| 04/07/1987 | US4655517 Electrical connector |
| 04/07/1987 | US4655516 Chip carrier connector and method of making same |
| 04/07/1987 | US4655382 Water soluble laminate of paper and polymer coating |
| 04/07/1987 | US4654967 Method and device for aligning and straightening flexible, insulated conductors |
| 04/07/1987 | US4654965 Method of manufacturing liquid crystal display unit |
| 04/07/1987 | US4654964 Sensor for component plug-in |
| 04/07/1987 | US4654956 Drill apparatus for use with computer controlled plotter |
| 04/07/1987 | CA1220253A1 Lamp socket assembly for mounting on printed circuit board |
| 04/07/1987 | CA1220252A1 Adhesive electrical interconnecting means |
| 04/07/1987 | CA1220251A1 Electrical interconnection means |
| 04/02/1987 | DE3535008A1 Foil circuit |
| 04/02/1987 | DE3533642A1 Battery holder |
| 04/01/1987 | EP0216581A2 Via profiling in integrated circuits |
| 04/01/1987 | EP0216531A1 Use of immersion tin and tin alloys as a bonding medium for multilayer circuits |
| 04/01/1987 | EP0216513A2 Treatment of drilled copper-clad thermoplastic laminates |
| 04/01/1987 | EP0216466A2 Stamped circuitry assembly |
| 04/01/1987 | EP0216447A2 Mounting a hybrid circuit to a circuit board |
| 04/01/1987 | EP0216363A2 Electric component part having lead terminals |
| 04/01/1987 | EP0216086A2 Automatic conveying and handling device for articles, especially printed circuit boards |
| 04/01/1987 | CN86105385A Method and device for the cleaning, activation and/or metallization of holes drilled in horizontally guided circuit boards |
| 04/01/1987 | CN86103221A Multilayer ceramic circuit board |
| 03/31/1987 | US4654752 Terminal assembly and method of making terminal assembly |
| 03/31/1987 | US4654502 Method for reflow soldering of surface mounted devices to printed circuit boards |
| 03/31/1987 | US4654472 Electronic component package with multiconductive base forms for multichannel mounting |
| 03/31/1987 | US4654275 Storage life of Pb-In-Ag solder foil by Sn addition |
| 03/31/1987 | US4654248 Layers with different coefficient of expansion bonded together |
| 03/31/1987 | US4654116 Redeposition, oxidizers |
| 03/31/1987 | US4654115 Process for removing contaminant |
| 03/31/1987 | US4654102 Adding electrical connections |
| 03/31/1987 | US4653682 Method and apparatus for bonding connector terminals to circuit boards |
| 03/31/1987 | US4653365 Method for punching ceramic green sheet |
| 03/31/1987 | US4653186 Method of manufacturing film-covered terminal |
| 03/31/1987 | CA1219963A1 Shaped solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads |
| 03/31/1987 | CA1219962A1 Shaped solder pad for reflow soldering of surface mounting cylindrical devices on a circuit board |
| 03/31/1987 | CA1219961A1 Peelable solder mask |
| 03/31/1987 | CA1219838A1 Masking tape for electroplating processes |
| 03/26/1987 | WO1987001827A2 Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method |
| 03/26/1987 | WO1987001651A1 Press-autoclave, for example for laminating printed circuits |
| 03/26/1987 | DE3620767A1 Electrically conductive metal glue |
| 03/26/1987 | DE3532646A1 Fixing device for a potentiometer on a printed circuit board in a telephone set |
| 03/25/1987 | EP0215667A2 Vent hole assembly |
| 03/25/1987 | EP0215638A1 Metallizing composition for sintered ceramic article |
| 03/25/1987 | EP0215577A2 Circuit panel connector, panel system using the connector, and method for making the panel system |
| 03/25/1987 | EP0215557A2 Copper-chromium-polyimide composite |
| 03/25/1987 | EP0215392A2 Double band press for continuously making copper-clad electrolaminates |
| 03/25/1987 | EP0215358A2 Method and device employing input and output staging chamber devices for reduced pressure lamination |
| 03/25/1987 | EP0215175A1 A copper-foiled flexible base for printed circuit board |
| 03/25/1987 | EP0215031A1 Method for selectively forming at least a coating strip of a metal or alloy on a substrate of another metal. |
| 03/25/1987 | EP0215024A1 Solder-bearing terminal. |
| 03/25/1987 | EP0057232B1 Method for continuous metal deposition from a non-autocatalytic electroless plating bath using electric potential |
| 03/25/1987 | CN85106487A Module board, module made of this board and process thereof |
| 03/24/1987 | US4652975 Mounting arrangement for circuit breaker current sensing transformers |
| 03/24/1987 | US4652974 Method and structure for effecting engineering changes in a multiple device module package |
| 03/24/1987 | US4652848 Overvoltage protection for a ceramic printed circuit board |
| 03/24/1987 | US4652734 Method of and device for feeding information about articles to be processed in galvanizing installations |
| 03/24/1987 | US4652513 Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method |
| 03/24/1987 | US4652346 Apparatus and process for the continuous plating of wide delicate metal foil |
| 03/24/1987 | US4652345 Method of depositing a metal from an electroless plating solution |
| 03/24/1987 | US4652311 Polymer complex |
| 03/24/1987 | US4652065 Method and apparatus for providing a carrier termination for a semiconductor package |
| 03/24/1987 | US4651916 Soldering apparatus |
| 03/24/1987 | US4651417 Method for forming printed circuit board |
| 03/24/1987 | US4651416 Printed circuits |
| 03/18/1987 | EP0214916A1 Process for making an interconnection substrate for electronic components |
| 03/18/1987 | EP0214628A2 Process for the manufacture of substrates to interconnect electronic components and articles made by said process |
| 03/18/1987 | EP0214596A2 Method for manufacturing printing plates |
| 03/18/1987 | EP0214573A2 Integration process of resistances in chemically disposed conductor networks |
| 03/18/1987 | EP0214465A1 Plating process for an electronic part |
| 03/18/1987 | EP0214461A2 Apparatus to strip the protection layer from a printed circuit coated with an exposed photoresist |
| 03/18/1987 | EP0214396A1 Process for joining a workpiece to a substrate |
| 03/18/1987 | CN86106250A Automatic device for the transport and treatment of products, in particular circuit boards |
| 03/18/1987 | CN86104933A Article heat cohesive device |
| 03/17/1987 | US4650951 Method of welding laminates each having the structure of metal layer/thermally softenable insulating layer/metal layer |
| 03/17/1987 | US4650950 Soldering apparatus |
| 03/17/1987 | US4650548 Lead layer between copper and lead-tin alloy |
| 03/17/1987 | US4650545 Polyimide embedded conductor process |