| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/20/1988 | EP0274805A1 Acid catalysts and methods of use |
| 07/20/1988 | CN86108870A Welding of conductive wire onto glassy conducting diaphragm and preparation of metallic electrode on diaphragm |
| 07/19/1988 | US4758927 Method of mounting a substrate structure to a circuit board |
| 07/19/1988 | US4758922 High frequency circuit having a microstrip resonance element |
| 07/19/1988 | US4758782 Method and apparatus for inspecting printed circuit board |
| 07/19/1988 | US4758459 Molded circuit board |
| 07/19/1988 | US4758187 Contact pin for an electrical circuit board |
| 07/19/1988 | US4758168 Contact device composed of a plug and a corresponding socket |
| 07/19/1988 | US4757780 Apparatus for solder removal |
| 07/19/1988 | US4757759 Multilayer ceramic bar printing and assembling apparatus |
| 07/19/1988 | US4757610 Surface mount network and method of making |
| 07/14/1988 | WO1988005252A1 Method for the manufacture of multilayer printed circuit boards |
| 07/14/1988 | WO1988005251A1 High density electronic package comprising stacked sub-modules |
| 07/14/1988 | WO1988005250A1 Method and apparatus for soldering electronic component |
| 07/14/1988 | WO1988005217A1 Pressure connector for flexible cables and the like |
| 07/14/1988 | WO1988004977A1 Improved grinding guide and method |
| 07/14/1988 | WO1988004962A1 Apparatus and method for determining surface ionic contamination levels of electronic assemblies such as printed circuit assemblies |
| 07/13/1988 | EP0274318A2 Process for the anionic polymerization of acrylic monomers and vinyl comonomers |
| 07/13/1988 | EP0274262A2 Mounting panel for a lamp socket assembly |
| 07/13/1988 | EP0274261A2 Lamp socket assembly |
| 07/13/1988 | CN87107655A Manafacturing multilayer circuit and its elements by receiver with catalyst |
| 07/12/1988 | US4756994 Ethylenically unsaturated monomer, photopolymerizable monomer, polymerization inhibitor, nitrogen-containing compound |
| 07/12/1988 | US4756988 Multilayer dry-film negative-acting photoresist |
| 07/12/1988 | US4756940 Flexible circuit strain relief |
| 07/12/1988 | US4756930 Subjecting thru-hole to desmearing to remove resin, treating with solvent, then with alkaline permanganate solution |
| 07/12/1988 | US4756929 High density printing wiring |
| 07/12/1988 | US4756923 Method of controlling resistivity of plated metal and product formed thereby |
| 07/12/1988 | US4756848 Curable mixture with epoxy resin, hardener, curing catalyst |
| 07/12/1988 | US4756795 For making circuitry patterns for attachment of electronic components on printed circuit boards |
| 07/12/1988 | US4756756 Forming of thick-layer, hybrid electronic printed circuits |
| 07/12/1988 | US4756696 Solder joint inspection feature for surface mount connectors |
| 07/12/1988 | US4756694 Dual row connector for low profile package |
| 07/12/1988 | US4756195 Modulus of elasticity tester apparatus particularly adapted for testing compliant materials |
| 07/12/1988 | US4756077 Assembly platform for an equipping of printed circuit boards |
| 07/12/1988 | US4756073 Machines for handling electrical components |
| 07/07/1988 | DE3644249A1 Method for protecting electrical contact surfaces during soldering processes |
| 07/06/1988 | EP0273792A1 Process for making spaced elements |
| 07/06/1988 | EP0273729A2 Solder resist ink composition |
| 07/06/1988 | EP0273721A2 A booster type driving device for a press-machine |
| 07/06/1988 | EP0273703A2 An adaptive lithography method and system |
| 07/06/1988 | EP0273690A2 Knockout device for punching a work plate in a press-machine |
| 07/06/1988 | EP0273415A2 Adhesive for surface mounting components |
| 07/06/1988 | EP0273376A1 Embedded catalyst receptors for metallization of dielectrics |
| 07/06/1988 | EP0273374A2 Method for making multilayer circuits using embedded catalyst receptors |
| 07/06/1988 | EP0273294A2 Process for removal of cured epoxy |
| 07/06/1988 | EP0273227A2 A method of improving bond strength between a metal layer and a non-metallic substrate |
| 07/06/1988 | EP0273131A1 Method and transfer plate for applying solder to component leads |
| 07/06/1988 | EP0116073B1 Solder bearing edge clip |
| 07/06/1988 | CN87106520A Method for guiding plate-like articles, apparatus therefor |
| 07/05/1988 | US4755911 Multilayer printed circuit board |
| 07/05/1988 | US4755785 Surface mounted fuse assembly |
| 07/05/1988 | US4755704 Automatic clock de-skewing apparatus |
| 07/05/1988 | US4755551 Electrodeposition resinous paint composition |
| 07/05/1988 | US4755446 Storage stable photopolymerizable element wound in roll; on support of strippable flexible film |
| 07/05/1988 | US4755424 Polyimide film having improved adhesive properties |
| 07/05/1988 | US4755417 Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method |
| 07/05/1988 | US4755271 Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
| 07/05/1988 | US4755265 Processes for the deposition or removal of metals |
| 07/05/1988 | US4755257 Applying supporting sheet to surface of metal sheet, applying photoresist, exposing pattern images, developing, etching, removing photoresist and supporting sheet |
| 07/05/1988 | US4755252 Double-band press for continuous production of copper-lined laminates with auxiliary cleaning equipment |
| 07/05/1988 | US4755249 Mounting base pad means for semiconductor devices and method of preparing same |
| 07/05/1988 | US4755147 Flex head connector with ground plane |
| 07/05/1988 | CA1238985A1 Pick and place method and apparatus for handling electrical components |
| 07/05/1988 | CA1238959A1 Area-bonding tape |
| 06/30/1988 | WO1988004881A1 Solder thickness measurement method and apparatus |
| 06/30/1988 | WO1988004878A1 Method of making an electronic component |
| 06/30/1988 | WO1988004877A1 Multilayer circuit board fabrication process |
| 06/30/1988 | WO1988004843A1 Dual row connector for low profile package |
| 06/30/1988 | WO1988004839A1 Solderable lead |
| 06/30/1988 | WO1988004838A1 Terminals for connecting electronic components |
| 06/30/1988 | WO1988004797A1 Method of patterning resist for printed wiring board |
| 06/30/1988 | WO1988004702A1 Oriented polymer substrate for printed wire board |
| 06/30/1988 | WO1988004700A1 Process and device for the electrolytic dip-coating of plates, in particular electric printed circuit boards |
| 06/30/1988 | DE3642926A1 Arrangement and method for identifying displacement of the internal layers of multilayer printed circuit boards |
| 06/29/1988 | EP0273003A1 Potentially adhesive electrically conductive composition |
| 06/29/1988 | EP0272840A2 Apparatus and method of automatically punching hole patterns in sheets of material |
| 06/29/1988 | EP0272823A2 Electrical circuit |
| 06/29/1988 | EP0272707A2 Flexible printed circuit board terminal structure |
| 06/29/1988 | EP0272678A2 Conductive pattern producing method and its applications |
| 06/29/1988 | EP0272420A2 Photopatterned aromatic polymeric substrates, method for making same and use |
| 06/29/1988 | CN87108030A Mullite ceramic multi-layered substrate and process for producing same |
| 06/29/1988 | CN87104909A Device for electrolytic treatment of board-shaped objects |
| 06/29/1988 | CN87101846B Copper base thick-film conductor and the process thereof |
| 06/29/1988 | CN87101184A Method for temporarily sealing holes in printed circuit boards |
| 06/29/1988 | CN87101179A Apparatus and method for temporarily sealing holes in printed circuit boards |
| 06/28/1988 | US4754370 Electrical component with added connecting conducting paths |
| 06/28/1988 | US4754366 Decoupling capacitor for leadless surface mounted chip carrier |
| 06/28/1988 | US4754164 Method for providing automatic clock de-skewing on a circuit board |
| 06/28/1988 | US4754009 Cladding, optical fibers, electronics, films, molding materials |
| 06/28/1988 | US4753865 Photosensitive compositions containing microgels |
| 06/28/1988 | US4753860 Urethane acrylates, printed circuits |
| 06/28/1988 | US4753847 Thin film of cured acrylated oligomer |
| 06/28/1988 | US4753821 Using sparingly soluble silver compounds deposited from soluble complexes |
| 06/28/1988 | US4753820 Alignment to ensure registration of bond pads with leads |
| 06/28/1988 | US4753819 Method for applying a moistureproof insulator coating on packaged circuit boards |
| 06/28/1988 | US4753694 Process for forming multilayered ceramic substrate having solid metal conductors |
| 06/28/1988 | US4753617 Electrical device having flexible electrical contacts |
| 06/28/1988 | US4753601 Circuit board thickness compensator |
| 06/28/1988 | US4753005 Multiconductor electrical cable terminations and methods and apparatus for making same |
| 06/28/1988 | CA1238559A1 Process for producing copper through-hole printed circuit board |