H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1987
11/19/1987	DE3616773A1 Hearing aid
11/18/1987	CN87102667A Connection constitution of flat cable
11/18/1987	CN87102495A Pretreatment method of printed circuit board before plating through holes
11/17/1987	US4707773 Parallel light moving type exposure apparatus
11/17/1987	US4707763 Molded electronic circuit device
11/17/1987	US4707671 Electrical transmission line
11/17/1987	US4707586 Electro conductive film system for aircraft windows
11/17/1987	US4707565 Epoxy impregnated glass fibers
11/17/1987	US4707394 Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby
11/17/1987	US4707378 Method and apparatus for controlling the organic contamination level in an electroless plating bath
11/17/1987	US4707377 Copper plating
11/17/1987	US4707116 For the contact print of circuit patterns on printed circuit boards
11/17/1987	US4706811 Surface mount package for encapsulated tape automated bonding integrated circuit modules
11/17/1987	US4706379 Parts mounting apparatus
11/17/1987	CA1229425A1 Contact array assembly for a computer-controlled printed circuit board testing apparatus
11/17/1987	CA1229266A1 Process for preparing a substrate for subsequent electroless deposition of a metal
11/12/1987	DE3615888A1 Device for machining workpieces
11/12/1987	DE3615417A1 Anzeigevorrichtung fuer informationen auf lc-display Display device for information on lc-display
11/12/1987	DE3615307A1 Air-cored coils for automatic SMD fitting
11/11/1987	EP0245188A2 Soldering process of surface components on a printed board
11/11/1987	EP0245166A1 Ribbon type electrical connector cable with controlled thermal and electric resistances
11/11/1987	EP0245016A2 Metallized polymers
11/11/1987	EP0244699A2 Substrate for a printed circuit board
11/11/1987	EP0244696A2 Method of fabricating a multilayered ceramic substrate having solid non-porous metal conductors
11/11/1987	EP0244666A2 Balltape structure for tape automated bonding, multilayer packaging and universal chip interconnection
11/11/1987	EP0244535A1 Improved electroless plating process
11/11/1987	CN87103295A Xeroprinting with photopolymer master
11/10/1987	USRE32540 Terminal positioning method and construction
11/10/1987	US4706167 Printed circuits, high density
11/10/1987	US4706165 Multilayer circuit board
11/10/1987	US4706162 Multilayer capacitor elements
11/10/1987	US4706097 Near-linear spring connect structure for flexible interconnect circuits
11/10/1987	US4705917 Microelectronic package
11/10/1987	US4705647 Copper-type conductive coating composition
11/10/1987	US4705606 Thin-film electrical connections for integrated circuits
11/10/1987	US4705592 Process for producing printed circuits
11/10/1987	US4705205 Resilient connection; circuit boards
11/10/1987	US4705081 System for sensing and forming objects such as leads of electronic components
11/10/1987	US4704792 Components feeding apparatus
11/10/1987	US4704791 Process for providing a landless through-hole connection
11/10/1987	US4704790 Method and apparatus for attaching components to substrates
11/05/1987	WO1987006771A1 A contact means
11/05/1987	WO1987006767A1 Surface mountable diode
11/05/1987	WO1987006760A1 Flat multi-conductor power cable with two insulating layers
11/04/1987	EP0244259A1 Method of detecting the presence or absence of defect of transparent circuit board having fine transparent electric conductive circuit
11/04/1987	EP0244040A2 Method to separate non-crystalline objects, in particular thick-film substrates
11/04/1987	EP0243998A1 Contact strip
11/04/1987	EP0243934A2 Xeroprinting with photopolymer master
11/04/1987	EP0243794A1 Electroless plating method
11/04/1987	EP0243764A2 Device for introducing gases
11/04/1987	EP0243709A1 A Method of forming a substrate for printed circuitry
11/04/1987	EP0243707A2 A method of establishing a conductive via path
11/04/1987	EP0243626A2 Method of making multilayered ceramic structures having an internal distribution of copper-based conductors
11/04/1987	EP0243621A2 Bonding method and apparatus
11/04/1987	EP0243507A1 Flexible laminate for printed circuit board and process for its production
11/04/1987	EP0243478A1 Mass soldering system
11/03/1987	US4704505 Electrical apparatus configured for predetermined encoding
11/03/1987	US4704348 Adjustment of temperature and humidity to keep water content constant
11/03/1987	US4704325 Polymeric films
11/03/1987	US4704320 Semiconductors, gap between ceramic base and conductor layer relieves stress
11/03/1987	US4704319 Apparatus and method for fabricating modules comprising stacked circuit-carrying layers
11/03/1987	US4704305 Automatic solder paste application to circuit boards
11/03/1987	US4704304 Method for repair of opens in thin film lines on a substrate
11/03/1987	US4704090 Mounting panel for a lamp socket assembly
11/03/1987	US4703984 Flexible access connector with miniature slotted pads
11/03/1987	US4703714 Apparatus for removing solder from the drill holes of empty printed circuit boards coated with solder
11/03/1987	CA1228933A1 High density multi-layer circuit arrangement
11/03/1987	CA1228932A1 Injection molded multi-layer circuit board and method of making same
10/1987
10/29/1987	DE3705828A1 Device for connecting an integrated circuit, whose connection is incompatible, to a printed circuit board
10/29/1987	DE3614366A1 Arrangement for avoiding undesired solder links on printed circuits
10/29/1987	DE3614269A1 Device for holding optical fibres on a printed circuit board
10/28/1987	EP0242682A2 Device for mounting electrical components on a supporting plate
10/28/1987	EP0242583A1 Selective electrolytic stripping of metal coatings from base metal substrates
10/28/1987	EP0242558A2 Screenable paste for use as a barrier layer on a substrate during maskless cladding
10/28/1987	EP0242530A2 Method for analyzing additive concentration
10/28/1987	EP0242369A1 Surface mountable integrated circuit packages having solder bearing leads.
10/28/1987	EP0083631B1 Method of preserving the solderability of copper
10/28/1987	CN87102767A Process for treatment of thin metal film by photoetching
10/27/1987	US4703393 Mounting structure of flat-lead package-type electronic component
10/27/1987	US4703392 Microstrip line and method for fabrication
10/27/1987	US4702793 Rapid formation of uniform metal oxide layer
10/27/1987	US4702792 Applying polymer to substrate, patterning, applying conductive material
10/27/1987	US4702789 Method for applying a portion of a photosensitive film to at least one face of a flat plate having a surface area greater than said portion
10/27/1987	US4702785 Stack of laminate layers and prepregs fastened, heating, pressing and curing
10/27/1987	CA1228631A1 Circuit board mounting arrangement
10/27/1987	CA1228513A1 Composition and process for treating plastics with alkaline permanganate solutions
10/27/1987	CA1228475A1 Thick film conductor compositions
10/22/1987	WO1987006167A1 High speed precision drilling system
10/21/1987	EP0242303A2 Anisotropic elastomeric interconnecting system
10/21/1987	EP0242025A1 Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
10/21/1987	EP0242020A2 Electrical circuits
10/21/1987	EP0241876A2 Substrates coated with solvated clusters of metal particles
10/21/1987	EP0241754A1 Process for the adhesive metal-coating of polyether imide
10/21/1987	EP0241739A1 Method of modifying surfaces and application of the method in forming layered structures
10/21/1987	EP0241718A2 Process for removing contaminant from holes
10/21/1987	EP0241675A2 Electrical component part with synthetic covering and process for its manufacture
10/21/1987	CN87101985A Bonding of microelectronic circuits
10/21/1987	CN87101876A Apparatus and method for installing circuit components on printed circuit board
10/20/1987	US4701723 Connection construction for electronic component
10/20/1987	US4701497 Reacting polyallylamine with cinnamic acid derivatives

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