| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 04/05/1988 | US4735925 Fluorides of calcium, magnesium, lithium, aluminium, manganese or strontium increase mechanical strength and decrease firing temperature |
| 04/05/1988 | US4735891 Printed multilayer circuits by coating metal foil, exposure, and development |
| 04/05/1988 | US4735847 Bonding through molten metal powders |
| 04/05/1988 | US4735820 Removal of residual catalyst from a dielectric substrate |
| 04/05/1988 | US4735694 Method for manufacture of printed circuit boards |
| 04/05/1988 | US4735678 Electrode with negative image cut into end is submerged in dielectric pool; controlled frequency pulsations |
| 04/05/1988 | US4735676 Method for forming electric circuits on a base board |
| 04/05/1988 | US4735587 Circuit board pin |
| 04/05/1988 | US4735582 Soldered cable transition connector |
| 04/05/1988 | US4735497 Apparatus for viewing printed circuit boards having specular non-planar topography |
| 04/05/1988 | US4735354 Method of soldering component on printed circuit board |
| 04/05/1988 | US4734980 Printed circuit board wiring method |
| 04/05/1988 | CA1234908A1 Method and apparatus for real-time high-speed inspection of objects for identifying defects |
| 04/05/1988 | CA1234888A1 Solder-bearing terminal |
| 04/05/1988 | CA1234887A1 Multiple-connector adhesive tape |
| 03/31/1988 | DE3732825A1 Deaktivierbare anhaenger bzw. etiketten fuer die verwendung in einem elektronischen artikel-ueberwachungssystem sowie verfahren zu ihrer herstellung Deactivateable anhaenger or labels for the use in an electronic article-supervision system and method for its manufacture |
| 03/31/1988 | DE3633253A1 Method and device for fitting solder rings onto pins |
| 03/31/1988 | DE3631963A1 Method for producing a printed circuit board assembly |
| 03/30/1988 | EP0261986A2 High density flex connector system |
| 03/30/1988 | EP0261816A2 A work ordering routine for use in a method of routing |
| 03/30/1988 | EP0261527A2 Apparatus and method for producing a high density of electrical interconnections |
| 03/30/1988 | EP0261457A1 Pin retention method and apparatus |
| 03/30/1988 | EP0261424A2 Metal plating process |
| 03/30/1988 | EP0261400A2 Lift-off process for forming wiring on a substrate |
| 03/30/1988 | EP0261372A1 Process and apparatus for conveying platelike articles |
| 03/30/1988 | EP0261334A2 Process for depositing an adherent metallic coating on ceramics |
| 03/30/1988 | EP0261307A2 Modular casing protected against explosion |
| 03/30/1988 | EP0261301A2 Process for the preparation of circuit-printed board having plated through-hole |
| 03/30/1988 | EP0261141A1 Automatic printed circuit board imaging system |
| 03/30/1988 | EP0114857B1 Pad for correcting printed circuit boards and method of use thereof |
| 03/30/1988 | CN87106227A Photopolymerizable compositions containing inorganic fillers |
| 03/30/1988 | CN87100440A Process of metal brush-plating on non-conductive material |
| 03/29/1988 | US4734825 Integrated circuit stackable package |
| 03/29/1988 | US4734818 Decoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packages |
| 03/29/1988 | US4734672 Variable resistor circuit module and method of manufacture |
| 03/29/1988 | US4734300 Methods for removing parylene coatings from predetermined, desired areas of a substrate |
| 03/29/1988 | US4734299 Amide solution of compound of palladium, silver, copper or nickel |
| 03/29/1988 | US4734296 Electroless plating of through-holes using pressure differential |
| 03/29/1988 | US4734233 Sintered conductive layer of tungsten and oxides of silicon, aluminum, magnesium |
| 03/29/1988 | US4734174 Electrochemical formation of thin-film electrodes |
| 03/29/1988 | US4734156 Method for forming electrically conductive circuits on a base board |
| 03/29/1988 | US4733462 Apparatus for positioning circuit components at predetermined positions and method therefor |
| 03/29/1988 | US4733461 Method of stacking printed circuit boards |
| 03/29/1988 | US4733459 Electronic part insertion apparatus |
| 03/29/1988 | CA1234608A1 Card edge connector |
| 03/24/1988 | WO1988002183A1 Trimming passive components buried in multilayer structures |
| 03/24/1988 | WO1988002035A1 Electroless plating process using chromium mask |
| 03/24/1988 | WO1988001938A1 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products |
| 03/24/1988 | DE3631383A1 Method of generating fine structures in a substrate and device for carrying out the method |
| 03/23/1988 | EP0260967A1 Connector with compliant retainer |
| 03/23/1988 | EP0260857A2 Multilayer wiring substrate |
| 03/23/1988 | EP0260729A1 Method for determining the transportation speed of circuit boards in soldering machines, and transportation equipment for carrying out this method |
| 03/23/1988 | EP0260681A2 Circuit board |
| 03/23/1988 | EP0260590A2 Lamination of photopolymerizable film onto a substrate employing an intermediate nonphotosensitive liquid layer |
| 03/23/1988 | EP0260539A2 Apparatus for spray coating |
| 03/23/1988 | EP0260516A1 Photoselective metal deposition process |
| 03/23/1988 | EP0260514A1 Photoselective metal deposition process |
| 03/23/1988 | EP0260490A1 Bonding sheet for electronic component and method of bonding electronic component using the same |
| 03/23/1988 | EP0260483A2 Circuit board with a sheet-like metallic core, and method of making it |
| 03/23/1988 | EP0260410A2 Process for selective physical vapour deposition |
| 03/23/1988 | EP0260316A1 Solder delivery systems. |
| 03/23/1988 | CN85100133B Process for manufacturing micro-foil resistance strain gauge |
| 03/22/1988 | US4733039 Method of laser soldering |
| 03/22/1988 | US4732843 Irradiation cross-linkable thermostable polymer system, for microelectronic applications |
| 03/22/1988 | US4732831 Monomers, toners, chain transfer agents |
| 03/22/1988 | US4732829 Polymer printing |
| 03/22/1988 | US4732798 Multilayer ceramic substrate and method of making the same |
| 03/22/1988 | US4732780 Firing, coating with metal |
| 03/22/1988 | US4732649 Method for manufacture of printed circuit boards |
| 03/22/1988 | US4732636 Cutting warp between curing stages |
| 03/22/1988 | US4732173 Printed circuit board chemical processing system |
| 03/22/1988 | EP0252139A4 A process and apparatus for electroplating copper foil. |
| 03/22/1988 | EP0204767A4 Method for fabricating modules comprising stacked circuit-carrying layers. |
| 03/22/1988 | CA1234254A1 Solution for preliminary treatment of polyimide |
| 03/21/1988 | EP0245500A4 Apparatus and method for rapidly removing organic materials from films by heating in an electric field. |
| 03/17/1988 | DE3716196A1 Anordnung aus einem elektronische bauelemente tragenden keramiksubstrat und einer waermeabfuehreinrichtung Assembly of electronic components supporting a ceramic substrate and a heat rejection |
| 03/17/1988 | DE3630952A1 Method for producing a switching film for mat-type keyboards |
| 03/16/1988 | EP0260141A2 Liquid crystal apparatus |
| 03/16/1988 | EP0259925A1 A method of interconnecting metal strips for use in electrical components, and electrical component comprising strips thus interconnected |
| 03/16/1988 | EP0259897A1 Electrical junction system |
| 03/16/1988 | EP0259874A2 A coupling plate having a plurality of electric coupling points, a method of producing such a plate and a use of the coupling plate as a planning board |
| 03/16/1988 | EP0259853A2 Lamination of photopolymerizable film onto a substrate employing an intermediate photosensitive layer |
| 03/16/1988 | EP0259812A2 Photopolymerizable compositions containing inorganic fillers |
| 03/16/1988 | EP0259785A2 Self-shielding multi-layer circuit boards |
| 03/16/1988 | EP0259784A2 Photo-imaged dielectric layer |
| 03/16/1988 | EP0259776A2 Screen printing machine |
| 03/16/1988 | EP0259754A2 Flexible circuits |
| 03/16/1988 | EP0259716A2 Method and apparatus for dividing metal-coated laminated strips into plates |
| 03/16/1988 | EP0259709A2 Method for producing conductive and/or resistive paths on a substrate, and potentiometer manufactured thereby |
| 03/16/1988 | EP0259613A1 Process for making impregnated-layer components |
| 03/16/1988 | CN87104293A Copper foil with double rough surface |
| 03/16/1988 | CN87100995A Long racks for removable attachment of printed circuit boards to be electroplated as well as respective circuit boards |
| 03/15/1988 | US4731704 Arrangement for modifying electrical printed circuit boards |
| 03/15/1988 | US4731699 Mounting structure for a chip |
| 03/15/1988 | US4731693 Connection apparatus for integrated circuit |
| 03/15/1988 | US4731503 Connector with a flexible circuit support |
| 03/15/1988 | US4731282 Anisotropic-electroconductive adhesive film |
| 03/15/1988 | US4731156 Plasma processes for surface modification of fluoropolymers using ammonia |
| 03/15/1988 | US4731154 Method and apparatus for quantitative measurement of organic contaminants remaining on cleaned surfaces |
| 03/15/1988 | US4731130 Soldering composition |