Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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11/02/1988 | EP0289078A1 Poly-1,2-azepine and method of producing a film thereof on a substrate |
11/02/1988 | EP0289026A2 External circuit connecting method and packaging structure |
11/02/1988 | EP0288851A2 Addition products of alkylene oxide for fluxes and remelt liquids for the manufacture of circuit boards |
11/02/1988 | EP0288848A1 Alkylene oxide adducts as fluxes and remelt fluids in producing printed circuits |
11/02/1988 | EP0288807A2 Conductive structures in polymers |
11/02/1988 | EP0288767A2 Method for forming a shielded transmission line |
11/02/1988 | EP0288753A1 Bonding of pure metal films to ceramics |
11/02/1988 | EP0288507A1 Process for preparing multilayer printed circuit boards. |
11/02/1988 | EP0288491A1 Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein. |
11/02/1988 | EP0148209B1 Oxidizing accelerator |
11/01/1988 | US4782193 Polygonal wiring for improved package performance |
11/01/1988 | US4782007 Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists |
11/01/1988 | US4781991 Production of dielectric boards |
11/01/1988 | US4781990 Quaternary ammonium salt before electroless deposition of metal |
11/01/1988 | US4781968 Micro-electronics devices and methods of manufacturing same |
11/01/1988 | US4781960 Structure for mounting indicator lights on a printed circuit board, and manufacturing method |
11/01/1988 | US4781943 Process for pretreatment before plating through-holes of printed circuit boards |
11/01/1988 | US4781811 Device for feeding gas into a liquid |
11/01/1988 | US4781788 Process for preparing printed circuit boards |
11/01/1988 | US4781601 Header for an electronic circuit |
11/01/1988 | US4781600 Junction box and a process of assembling the same |
11/01/1988 | US4781495 Dry lubricant drilling of thru-holes in printed circuit boards |
11/01/1988 | US4781205 Product guide for processing equipment |
11/01/1988 | US4780957 Method for producing rigid-type multilayer printed wiring board |
11/01/1988 | CA1243907A1 Process for selective transfer of metallic foils to xerographic images |
10/27/1988 | DE3716531A1 Process for the continuous production of strip-shaped base material |
10/27/1988 | DE3712331A1 Device for sealing off an air chamber |
10/27/1988 | DE3708368C1 Process for the production of a stamping tool |
10/26/1988 | EP0288214A2 Coated products |
10/26/1988 | EP0287986A2 Punching device for thin plates and punching units used with punching device |
10/26/1988 | EP0287870A2 Package for integrated devices |
10/26/1988 | EP0287859A2 Method and apparatus for forming pins of an extrudable material in a substrate |
10/26/1988 | EP0287843A1 Process for manufacturing printed-circuit boards |
10/26/1988 | EP0287753A1 Process for electroless plating a metal on non-conductive materials |
10/26/1988 | EP0287681A1 Multi-layer printed circuit board and a method of fabricating the same |
10/25/1988 | US4780794 Insulated layer; non short circuiting |
10/25/1988 | US4780371 Electrically conductive composition and use thereof |
10/25/1988 | US4780332 Forming spinel intemediate layer |
10/25/1988 | US4780177 Excimer laser patterning of a novel resist |
10/25/1988 | US4780098 Conductive lead arrangement |
10/25/1988 | US4779790 Job oriented method and apparatus utilizing molten solder for procedures such as soldering and desoldering |
10/25/1988 | US4779565 Apparatus for through hole substrate printing |
10/25/1988 | US4779340 Programmable electronic interconnect system and method of making |
10/25/1988 | US4779339 Method of producing printed circuit boards |
10/25/1988 | US4779338 Method of mounting LSI |
10/25/1988 | CA1243736A1 Polymer film with conductive pattern and method of manufacturing the same |
10/20/1988 | WO1988008043A1 Surface treatment of polymers |
10/20/1988 | WO1988007983A1 Ceramic base and process for its production |
10/20/1988 | WO1988007937A1 Pattern forming sheet and formed pattern fixing process |
10/20/1988 | DE3711551A1 Optimisation of PCB etching - by sliding contacts and ohm-meters indicating start of through etching |
10/19/1988 | EP0287412A2 Microlithographic process for circuits using organic conductive films sensitive to electromagnetic radiations and to charged particles |
10/19/1988 | EP0287274A2 Semiconductor hybrid device |
10/19/1988 | EP0287111A2 Method for manufacturing an electronic part |
10/19/1988 | EP0287071A2 Tool change arrangement for co-ordinate boring machines for printed circuit boards |
10/19/1988 | EP0286961A2 Pull-raising member and pull-raising unit for peeling thin film |
10/19/1988 | EP0286854A1 Method for making a multilayer thin-film circuit |
10/19/1988 | EP0286829A2 Electronic device comprising a polyimide layer, and method for its production |
10/19/1988 | EP0286710A1 Drilling unit |
10/18/1988 | US4778950 Alternate conductive metals sheets separated by dielectric sheet |
10/18/1988 | US4778693 Photolithographic mask repair system |
10/18/1988 | US4778635 Method and apparatus for fabricating anisotropically conductive material |
10/18/1988 | US4778560 Method for production of thin film transistor array substrates |
10/18/1988 | US4778556 Stitching pad is heat bonded by adhesive layer; other surface is weldable |
10/18/1988 | US4778552 Alarm tag and method of making and deactivating it |
10/18/1988 | US4778546 Heat setting while stretching; accurate stencils for printed circuits |
10/18/1988 | US4777721 Thermo-vacuum apparatus |
10/18/1988 | US4777718 Method of forming and connecting a resistive layer on a pc board |
10/18/1988 | CA1243417A1 Printed circuit board laminating apparatus |
10/18/1988 | CA1243416A1 Method of imaging resist patterns of high resolution on the surface of a conductor |
10/18/1988 | CA1243415A1 Vent hole assembly |
10/13/1988 | DE3710190A1 Process for applying a solderable conductor pattern |
10/13/1988 | DE3710189A1 Process for applying a solderable conductive layer and production of a solder connection between this conductive layer and a metallic conductor tape |
10/13/1988 | DE3710184A1 Electric component |
10/13/1988 | DE3709770A1 Circuit board, conductor foil, multilayer inner laminate or conductor substrate with through-connections and a production process |
10/12/1988 | EP0286594A2 Process for the production of photographically structurable coatings |
10/12/1988 | EP0286422A2 Electrical connector terminal for a flexible printed circuit board |
10/12/1988 | EP0286258A2 Hybrid interconnect lead frame for thermal ink jet printhead and methods of manufacture and connection |
10/12/1988 | EP0286018A2 Exposure mask for materials coated with a photosensitive layer |
10/12/1988 | EP0285900A2 Process for making printed circuits |
10/12/1988 | EP0285850A2 Improved screen printing method for producing lines of uniform width and height |
10/12/1988 | EP0285831A1 Electrical connections for the rear of printed circuits |
10/12/1988 | EP0285820A2 Method and structure for identifying non-functional chip connect pads |
10/12/1988 | EP0285701A1 Printed wiring board |
10/12/1988 | EP0163677B1 Plant for tinning printed circuit boards |
10/12/1988 | EP0148820B1 Electronic circuit chip connection assembly and method |
10/11/1988 | US4777606 Method for deriving an interconnection route between elements in an interconnection medium |
10/11/1988 | US4777564 Leadform for use with surface mounted components |
10/11/1988 | US4777562 Wire wrap single in-line package |
10/11/1988 | US4777558 Electronic device |
10/11/1988 | US4777304 Heat exchangers, vapor phase soldering, gas transportation, test fluids |
10/11/1988 | US4777201 Homo-or copolymer of 4-methyl-1-pentene; printed circuits |
10/11/1988 | US4777081 Transfer metallizing film |
10/11/1988 | US4777078 Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating |
10/11/1988 | US4776939 Device for the electroplating treatment of plate-shaped objects |
10/11/1988 | US4776810 Socket for an electronic component |
10/11/1988 | US4776651 Socket contacts |
10/11/1988 | US4776508 Electronic component lead tinning device |
10/11/1988 | US4776271 Silk-screen printing method using predistorted second screen |
10/11/1988 | US4776087 For forming a shielded transmission line |
10/11/1988 | CA1242917A1 Multilayer dry-film positive-acting photoresist |