Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1988
11/02/1988EP0289078A1 Poly-1,2-azepine and method of producing a film thereof on a substrate
11/02/1988EP0289026A2 External circuit connecting method and packaging structure
11/02/1988EP0288851A2 Addition products of alkylene oxide for fluxes and remelt liquids for the manufacture of circuit boards
11/02/1988EP0288848A1 Alkylene oxide adducts as fluxes and remelt fluids in producing printed circuits
11/02/1988EP0288807A2 Conductive structures in polymers
11/02/1988EP0288767A2 Method for forming a shielded transmission line
11/02/1988EP0288753A1 Bonding of pure metal films to ceramics
11/02/1988EP0288507A1 Process for preparing multilayer printed circuit boards.
11/02/1988EP0288491A1 Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein.
11/02/1988EP0148209B1 Oxidizing accelerator
11/01/1988US4782193 Polygonal wiring for improved package performance
11/01/1988US4782007 Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
11/01/1988US4781991 Production of dielectric boards
11/01/1988US4781990 Quaternary ammonium salt before electroless deposition of metal
11/01/1988US4781968 Micro-electronics devices and methods of manufacturing same
11/01/1988US4781960 Structure for mounting indicator lights on a printed circuit board, and manufacturing method
11/01/1988US4781943 Process for pretreatment before plating through-holes of printed circuit boards
11/01/1988US4781811 Device for feeding gas into a liquid
11/01/1988US4781788 Process for preparing printed circuit boards
11/01/1988US4781601 Header for an electronic circuit
11/01/1988US4781600 Junction box and a process of assembling the same
11/01/1988US4781495 Dry lubricant drilling of thru-holes in printed circuit boards
11/01/1988US4781205 Product guide for processing equipment
11/01/1988US4780957 Method for producing rigid-type multilayer printed wiring board
11/01/1988CA1243907A1 Process for selective transfer of metallic foils to xerographic images
10/1988
10/27/1988DE3716531A1 Process for the continuous production of strip-shaped base material
10/27/1988DE3712331A1 Device for sealing off an air chamber
10/27/1988DE3708368C1 Process for the production of a stamping tool
10/26/1988EP0288214A2 Coated products
10/26/1988EP0287986A2 Punching device for thin plates and punching units used with punching device
10/26/1988EP0287870A2 Package for integrated devices
10/26/1988EP0287859A2 Method and apparatus for forming pins of an extrudable material in a substrate
10/26/1988EP0287843A1 Process for manufacturing printed-circuit boards
10/26/1988EP0287753A1 Process for electroless plating a metal on non-conductive materials
10/26/1988EP0287681A1 Multi-layer printed circuit board and a method of fabricating the same
10/25/1988US4780794 Insulated layer; non short circuiting
10/25/1988US4780371 Electrically conductive composition and use thereof
10/25/1988US4780332 Forming spinel intemediate layer
10/25/1988US4780177 Excimer laser patterning of a novel resist
10/25/1988US4780098 Conductive lead arrangement
10/25/1988US4779790 Job oriented method and apparatus utilizing molten solder for procedures such as soldering and desoldering
10/25/1988US4779565 Apparatus for through hole substrate printing
10/25/1988US4779340 Programmable electronic interconnect system and method of making
10/25/1988US4779339 Method of producing printed circuit boards
10/25/1988US4779338 Method of mounting LSI
10/25/1988CA1243736A1 Polymer film with conductive pattern and method of manufacturing the same
10/20/1988WO1988008043A1 Surface treatment of polymers
10/20/1988WO1988007983A1 Ceramic base and process for its production
10/20/1988WO1988007937A1 Pattern forming sheet and formed pattern fixing process
10/20/1988DE3711551A1 Optimisation of PCB etching - by sliding contacts and ohm-meters indicating start of through etching
10/19/1988EP0287412A2 Microlithographic process for circuits using organic conductive films sensitive to electromagnetic radiations and to charged particles
10/19/1988EP0287274A2 Semiconductor hybrid device
10/19/1988EP0287111A2 Method for manufacturing an electronic part
10/19/1988EP0287071A2 Tool change arrangement for co-ordinate boring machines for printed circuit boards
10/19/1988EP0286961A2 Pull-raising member and pull-raising unit for peeling thin film
10/19/1988EP0286854A1 Method for making a multilayer thin-film circuit
10/19/1988EP0286829A2 Electronic device comprising a polyimide layer, and method for its production
10/19/1988EP0286710A1 Drilling unit
10/18/1988US4778950 Alternate conductive metals sheets separated by dielectric sheet
10/18/1988US4778693 Photolithographic mask repair system
10/18/1988US4778635 Method and apparatus for fabricating anisotropically conductive material
10/18/1988US4778560 Method for production of thin film transistor array substrates
10/18/1988US4778556 Stitching pad is heat bonded by adhesive layer; other surface is weldable
10/18/1988US4778552 Alarm tag and method of making and deactivating it
10/18/1988US4778546 Heat setting while stretching; accurate stencils for printed circuits
10/18/1988US4777721 Thermo-vacuum apparatus
10/18/1988US4777718 Method of forming and connecting a resistive layer on a pc board
10/18/1988CA1243417A1 Printed circuit board laminating apparatus
10/18/1988CA1243416A1 Method of imaging resist patterns of high resolution on the surface of a conductor
10/18/1988CA1243415A1 Vent hole assembly
10/13/1988DE3710190A1 Process for applying a solderable conductor pattern
10/13/1988DE3710189A1 Process for applying a solderable conductive layer and production of a solder connection between this conductive layer and a metallic conductor tape
10/13/1988DE3710184A1 Electric component
10/13/1988DE3709770A1 Circuit board, conductor foil, multilayer inner laminate or conductor substrate with through-connections and a production process
10/12/1988EP0286594A2 Process for the production of photographically structurable coatings
10/12/1988EP0286422A2 Electrical connector terminal for a flexible printed circuit board
10/12/1988EP0286258A2 Hybrid interconnect lead frame for thermal ink jet printhead and methods of manufacture and connection
10/12/1988EP0286018A2 Exposure mask for materials coated with a photosensitive layer
10/12/1988EP0285900A2 Process for making printed circuits
10/12/1988EP0285850A2 Improved screen printing method for producing lines of uniform width and height
10/12/1988EP0285831A1 Electrical connections for the rear of printed circuits
10/12/1988EP0285820A2 Method and structure for identifying non-functional chip connect pads
10/12/1988EP0285701A1 Printed wiring board
10/12/1988EP0163677B1 Plant for tinning printed circuit boards
10/12/1988EP0148820B1 Electronic circuit chip connection assembly and method
10/11/1988US4777606 Method for deriving an interconnection route between elements in an interconnection medium
10/11/1988US4777564 Leadform for use with surface mounted components
10/11/1988US4777562 Wire wrap single in-line package
10/11/1988US4777558 Electronic device
10/11/1988US4777304 Heat exchangers, vapor phase soldering, gas transportation, test fluids
10/11/1988US4777201 Homo-or copolymer of 4-methyl-1-pentene; printed circuits
10/11/1988US4777081 Transfer metallizing film
10/11/1988US4777078 Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating
10/11/1988US4776939 Device for the electroplating treatment of plate-shaped objects
10/11/1988US4776810 Socket for an electronic component
10/11/1988US4776651 Socket contacts
10/11/1988US4776508 Electronic component lead tinning device
10/11/1988US4776271 Silk-screen printing method using predistorted second screen
10/11/1988US4776087 For forming a shielded transmission line
10/11/1988CA1242917A1 Multilayer dry-film positive-acting photoresist