Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/1988
11/30/1988EP0292543A1 Method of making an electronic component
11/29/1988US4788577 Substrate surface deflecting device
11/29/1988US4788404 Self-soldering flexible circuit connector
11/29/1988US4788403 Apparatus for automatic soldering
11/29/1988US4788270 Process for preparing a urethane coating comprising freezing a premix of an isocyanate and a polyol in a solvent
11/29/1988US4788165 Copper-exuding, boroaluminosilicate glasses
11/29/1988US4787957 Plasma
11/29/1988US4787854 Connector for flat connections
11/29/1988US4787853 Printed circuit board with through-hole connection
11/29/1988US4787550 Automatic soldering apparatus
11/29/1988US4787548 Nozzle structure for soldering and desoldering
11/29/1988US4787510 Carrier strip for electrical components
11/29/1988CA1245795A1 Adhesive mixtures and articles bonded therewith
11/29/1988CA1245774A1 Process for providing a landless through-hole connection
11/29/1988CA1245418A1 Method of restoring the surface of a thermoplastic substrate
11/24/1988EP0277118A4 Removable commoning bar.
11/24/1988DE3715596A1 Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB
11/23/1988EP0292304A2 Soluble tape and film and masking method using them
11/23/1988EP0292219A2 Printed circuit board fabrication
11/23/1988EP0292125A1 Multi-layer superconducting circuit substrate and process for manufacturing same
11/23/1988EP0292079A1 An apparatus for the application of a conductive adhesive such as solder to a board with printed circuitry
11/23/1988EP0291977A2 Patterned metal interlayer in a matrix
11/23/1988EP0291786A2 Removal of residual catalyst from a dielectric substrate
11/23/1988EP0291743A1 Method for protecting copper from corrosion
11/23/1988EP0291629A2 Continuous process for making ribbonlike material
11/23/1988EP0291620A2 Solderless, pushdown connectors for rf and dc
11/23/1988EP0291602A1 Contact elements for miniature inductor
11/23/1988CN88102545A Multi-layer superconducting circuit substrate and process for manufacturing same
11/22/1988US4786674 Diffusion isolation layer for maskless cladding process
11/22/1988US4786579 Heat-resistant photosensitive resin composition
11/22/1988US4786576 Printed circuit boards
11/22/1988US4786569 Adhesively bonded photostructurable polyimide film
11/22/1988US4786528 Humidity, dimensional stability
11/22/1988US4786523 Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals
11/22/1988US4786381 Anodizing
11/22/1988US4786358 Method for forming a pattern of a film on a substrate with a laser beam
11/22/1988US4786216 Printed circuit board drilling machine
11/22/1988US4785990 Electronic component with lead terminals and method of manufacturing said electronic component
11/22/1988US4785698 Separating device for plates
11/22/1988US4785533 Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same
11/22/1988CA1245137A1 Method of regenerating permanganate etch bath
11/17/1988WO1988009068A1 Solder connector device
11/17/1988EP0291445A2 Process and apparatus for regenerating permanganate etch solutions
11/17/1988EP0291444A1 Production of polymer-metal compounds by precipitation in glow discharge areas
11/17/1988EP0290821A2 Multiple electrical connections for mechanical timers
11/17/1988EP0290670A2 Pattern production process
11/17/1988EP0290598A1 Ceramic/organic multilayer interconnection board.
11/17/1988EP0290578A1 Tungsten paste for co-sintering with pure alumina and method for producing same.
11/17/1988EP0290577A1 An improved photo-selective plating method
11/17/1988EP0290539A1 Process for the chemical treatment of ceramic parts and subsequent metallization.
11/17/1988DE3814209A1 Method for soldering the connections of an electronic component, and a film for carrying out the method
11/15/1988US4785277 Narrowly-adjustable resistor
11/15/1988US4785156 Soldering method using localized heat source
11/15/1988US4785141 In a printed circuit board
11/15/1988US4785137 Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices
11/15/1988US4784936 Multilayer photoresists, nonionic surfactant
11/15/1988US4784920 Lamination, pressing, heat treatment
11/15/1988US4784910 Method for giving electric conductivity to molded polymer article
11/15/1988US4784881 Process for the adhesion of poly-p-xylylene to substrates by means of phosphoric acid ester primers
11/15/1988US4784872 Multilayer semiconductor, hermetic sealing
11/15/1988US4784785 Copper etchant compositions
11/15/1988US4784615 Direct contact flexible circuit interconnect system and method
11/15/1988US4784613 Apparatus for joining conductors to circuit boards
11/15/1988US4784582 Fluid dispensing pump
11/15/1988US4784377 Apparatus for locating and supporting ceramic substrates
11/15/1988US4784310 Method for screen printing solder paste onto a substrate with device premounted thereon
11/15/1988US4784169 Apparatus for treating articles with solution to remove solids and then filtering the solution
11/15/1988CA1244704A1 Use of photosensitive compositions of matter for electroless deposition of metals
11/10/1988DE3713988A1 Arrangement for the surface joining of thermally incompatible materials
11/09/1988EP0290254A2 Computer aided printed circuit board wiring
11/09/1988EP0290222A2 A multilayer interconnection system for multichip high performance semiconductor packaging
11/09/1988EP0290210A2 Dielectric block plating process and a plating apparatus for carrying out the same
11/09/1988EP0290171A1 Sealed electrical components and method of making same
11/09/1988EP0290148A2 Surface coating with very high rf loss for microwave components
11/09/1988EP0289956A2 Sealing structure for an electronic component
11/09/1988EP0289654A2 Method of soldering the terminals of an electronic component together, and foil for carrying out this method
11/08/1988US4783815 Manufacturing miniature hearing aid having a multi-layer circuit arrangement
11/08/1988US4783722 Interboard connection terminal and method of manufacturing the same
11/08/1988US4783697 Leadless chip carrier for RF power transistors or the like
11/08/1988US4783642 Hybrid integrated circuit substrate and method of manufacturing the same
11/08/1988US4783579 Thermoplastic elastomer exterior and jonomer interior
11/08/1988US4783359 Heat sealing circuit with low dielectric bonding layer
11/08/1988US4783358 Ceramic wiring substrate
11/08/1988US4783247 Method and manufacture for electrically insulating base material used in plated-through printed circuit panels
11/08/1988US4783244 Method of and device for guiding plate-shaped objects
11/08/1988US4783243 Articles comprising metal-coated polymeric substrates and process
11/08/1988US4782751 Silk-screen printing apparatus with optical reading device for registration
11/08/1988US4782545 Apparatus for operating and controlling machines cleaning thin metal or metal coated sheets and boards
11/08/1988CA1244532A1 Circuit terminating clip
11/08/1988CA1244324A1 Process and structure for etching copper
11/03/1988WO1988008660A1 Power circuit board and manufacturing method
11/03/1988WO1988008360A1 Process for manufacturing a structured ceramic film or a ceramic object composed of such films
11/03/1988WO1988008337A1 Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
11/03/1988DE3811160A1 Frame bar
11/03/1988DE3713298A1 Plastic packaging for semiconductor components with spacing projections
11/02/1988EP0289421A2 Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate
11/02/1988EP0289197A2 Electro-optical device
11/02/1988EP0289195A2 Method and apparatus for continuous throughput in a vacuum environment
11/02/1988EP0289194A2 Method for feeding and coating articles in a controlled atmosphere
11/02/1988EP0289137A2 Manufacturing printed-circuit components