Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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11/30/1988 | EP0292543A1 Method of making an electronic component |
11/29/1988 | US4788577 Substrate surface deflecting device |
11/29/1988 | US4788404 Self-soldering flexible circuit connector |
11/29/1988 | US4788403 Apparatus for automatic soldering |
11/29/1988 | US4788270 Process for preparing a urethane coating comprising freezing a premix of an isocyanate and a polyol in a solvent |
11/29/1988 | US4788165 Copper-exuding, boroaluminosilicate glasses |
11/29/1988 | US4787957 Plasma |
11/29/1988 | US4787854 Connector for flat connections |
11/29/1988 | US4787853 Printed circuit board with through-hole connection |
11/29/1988 | US4787550 Automatic soldering apparatus |
11/29/1988 | US4787548 Nozzle structure for soldering and desoldering |
11/29/1988 | US4787510 Carrier strip for electrical components |
11/29/1988 | CA1245795A1 Adhesive mixtures and articles bonded therewith |
11/29/1988 | CA1245774A1 Process for providing a landless through-hole connection |
11/29/1988 | CA1245418A1 Method of restoring the surface of a thermoplastic substrate |
11/24/1988 | EP0277118A4 Removable commoning bar. |
11/24/1988 | DE3715596A1 Base for carrying surface mounted device - has inbuilt clips to locate device and connect it electrically to PCB |
11/23/1988 | EP0292304A2 Soluble tape and film and masking method using them |
11/23/1988 | EP0292219A2 Printed circuit board fabrication |
11/23/1988 | EP0292125A1 Multi-layer superconducting circuit substrate and process for manufacturing same |
11/23/1988 | EP0292079A1 An apparatus for the application of a conductive adhesive such as solder to a board with printed circuitry |
11/23/1988 | EP0291977A2 Patterned metal interlayer in a matrix |
11/23/1988 | EP0291786A2 Removal of residual catalyst from a dielectric substrate |
11/23/1988 | EP0291743A1 Method for protecting copper from corrosion |
11/23/1988 | EP0291629A2 Continuous process for making ribbonlike material |
11/23/1988 | EP0291620A2 Solderless, pushdown connectors for rf and dc |
11/23/1988 | EP0291602A1 Contact elements for miniature inductor |
11/23/1988 | CN88102545A Multi-layer superconducting circuit substrate and process for manufacturing same |
11/22/1988 | US4786674 Diffusion isolation layer for maskless cladding process |
11/22/1988 | US4786579 Heat-resistant photosensitive resin composition |
11/22/1988 | US4786576 Printed circuit boards |
11/22/1988 | US4786569 Adhesively bonded photostructurable polyimide film |
11/22/1988 | US4786528 Humidity, dimensional stability |
11/22/1988 | US4786523 Substrate having a pattern of an alloy of gold and a noble and a base metal with the pattern isolated by oxides of the noble and the base metals |
11/22/1988 | US4786381 Anodizing |
11/22/1988 | US4786358 Method for forming a pattern of a film on a substrate with a laser beam |
11/22/1988 | US4786216 Printed circuit board drilling machine |
11/22/1988 | US4785990 Electronic component with lead terminals and method of manufacturing said electronic component |
11/22/1988 | US4785698 Separating device for plates |
11/22/1988 | US4785533 Hybrid integrated circuit device, and method of and lead frame for use in manufacturing same |
11/22/1988 | CA1245137A1 Method of regenerating permanganate etch bath |
11/17/1988 | WO1988009068A1 Solder connector device |
11/17/1988 | EP0291445A2 Process and apparatus for regenerating permanganate etch solutions |
11/17/1988 | EP0291444A1 Production of polymer-metal compounds by precipitation in glow discharge areas |
11/17/1988 | EP0290821A2 Multiple electrical connections for mechanical timers |
11/17/1988 | EP0290670A2 Pattern production process |
11/17/1988 | EP0290598A1 Ceramic/organic multilayer interconnection board. |
11/17/1988 | EP0290578A1 Tungsten paste for co-sintering with pure alumina and method for producing same. |
11/17/1988 | EP0290577A1 An improved photo-selective plating method |
11/17/1988 | EP0290539A1 Process for the chemical treatment of ceramic parts and subsequent metallization. |
11/17/1988 | DE3814209A1 Method for soldering the connections of an electronic component, and a film for carrying out the method |
11/15/1988 | US4785277 Narrowly-adjustable resistor |
11/15/1988 | US4785156 Soldering method using localized heat source |
11/15/1988 | US4785141 In a printed circuit board |
11/15/1988 | US4785137 Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices |
11/15/1988 | US4784936 Multilayer photoresists, nonionic surfactant |
11/15/1988 | US4784920 Lamination, pressing, heat treatment |
11/15/1988 | US4784910 Method for giving electric conductivity to molded polymer article |
11/15/1988 | US4784881 Process for the adhesion of poly-p-xylylene to substrates by means of phosphoric acid ester primers |
11/15/1988 | US4784872 Multilayer semiconductor, hermetic sealing |
11/15/1988 | US4784785 Copper etchant compositions |
11/15/1988 | US4784615 Direct contact flexible circuit interconnect system and method |
11/15/1988 | US4784613 Apparatus for joining conductors to circuit boards |
11/15/1988 | US4784582 Fluid dispensing pump |
11/15/1988 | US4784377 Apparatus for locating and supporting ceramic substrates |
11/15/1988 | US4784310 Method for screen printing solder paste onto a substrate with device premounted thereon |
11/15/1988 | US4784169 Apparatus for treating articles with solution to remove solids and then filtering the solution |
11/15/1988 | CA1244704A1 Use of photosensitive compositions of matter for electroless deposition of metals |
11/10/1988 | DE3713988A1 Arrangement for the surface joining of thermally incompatible materials |
11/09/1988 | EP0290254A2 Computer aided printed circuit board wiring |
11/09/1988 | EP0290222A2 A multilayer interconnection system for multichip high performance semiconductor packaging |
11/09/1988 | EP0290210A2 Dielectric block plating process and a plating apparatus for carrying out the same |
11/09/1988 | EP0290171A1 Sealed electrical components and method of making same |
11/09/1988 | EP0290148A2 Surface coating with very high rf loss for microwave components |
11/09/1988 | EP0289956A2 Sealing structure for an electronic component |
11/09/1988 | EP0289654A2 Method of soldering the terminals of an electronic component together, and foil for carrying out this method |
11/08/1988 | US4783815 Manufacturing miniature hearing aid having a multi-layer circuit arrangement |
11/08/1988 | US4783722 Interboard connection terminal and method of manufacturing the same |
11/08/1988 | US4783697 Leadless chip carrier for RF power transistors or the like |
11/08/1988 | US4783642 Hybrid integrated circuit substrate and method of manufacturing the same |
11/08/1988 | US4783579 Thermoplastic elastomer exterior and jonomer interior |
11/08/1988 | US4783359 Heat sealing circuit with low dielectric bonding layer |
11/08/1988 | US4783358 Ceramic wiring substrate |
11/08/1988 | US4783247 Method and manufacture for electrically insulating base material used in plated-through printed circuit panels |
11/08/1988 | US4783244 Method of and device for guiding plate-shaped objects |
11/08/1988 | US4783243 Articles comprising metal-coated polymeric substrates and process |
11/08/1988 | US4782751 Silk-screen printing apparatus with optical reading device for registration |
11/08/1988 | US4782545 Apparatus for operating and controlling machines cleaning thin metal or metal coated sheets and boards |
11/08/1988 | CA1244532A1 Circuit terminating clip |
11/08/1988 | CA1244324A1 Process and structure for etching copper |
11/03/1988 | WO1988008660A1 Power circuit board and manufacturing method |
11/03/1988 | WO1988008360A1 Process for manufacturing a structured ceramic film or a ceramic object composed of such films |
11/03/1988 | WO1988008337A1 Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists |
11/03/1988 | DE3811160A1 Frame bar |
11/03/1988 | DE3713298A1 Plastic packaging for semiconductor components with spacing projections |
11/02/1988 | EP0289421A2 Non-contact sensing and controlling of spacing between a depositing tip and each selected depositing location on a substrate |
11/02/1988 | EP0289197A2 Electro-optical device |
11/02/1988 | EP0289195A2 Method and apparatus for continuous throughput in a vacuum environment |
11/02/1988 | EP0289194A2 Method for feeding and coating articles in a controlled atmosphere |
11/02/1988 | EP0289137A2 Manufacturing printed-circuit components |