Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/1989
01/25/1989EP0300186A1 Process for producing a multilayer ceramic substrate
01/24/1989US4800461 Multilayer combined rigid and flex printed circuits
01/24/1989US4800459 Capacitors
01/24/1989US4800397 Metal transfer to form printing master plate or printed circuit board
01/24/1989US4800001 Method and apparatus for continuously galvanizing flat workpieces, and especially printed circuit boards
01/24/1989US4799996 Papermaking procedures
01/24/1989US4799984 Method for fabricating multilayer circuits
01/24/1989US4799983 Multilayer ceramic substrate and process for forming therefor
01/24/1989US4799616 Solder leveling method and apparatus
01/24/1989US4799450 Tinning system for surface mount components
01/24/1989US4799284 Plate cleaning apparatus and cleaning roller therefor
01/24/1989CA1249379A1 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
01/24/1989CA1249351A1 Apparatus and method for protection of a substrate
01/24/1989CA1249347A1 Plastic chip capacitor for surface mounting
01/24/1989CA1249188A1 Process for conditioning the surface of plastic substrates prior to metal plating
01/24/1989CA1249187A1 Electrical printed circuit boards
01/18/1989EP0299702A1 Controlled depth laser drilling system
01/18/1989EP0299641A2 A curable composition
01/18/1989EP0299595A2 A multilayer circuit board
01/18/1989EP0299454A1 Manufacturing method of printed circuit boards in rigid or rigid-flexible multilayer technique
01/18/1989EP0299453A1 Manufacturing method of printed circuit boards
01/18/1989EP0299136A2 Method of making a circuit board
01/18/1989CN1030435A Silicone composition
01/17/1989US4799175 System for inspecting pattern defects of printed wiring boards
01/17/1989US4799129 Flat cable connecting device
01/17/1989US4799128 Multilayer printed circuit board with domain partitioning
01/17/1989US4798918 For coupling devices
01/17/1989US4798782 Poly(acetylene) films having localized zones of a low conductivity material
01/17/1989US4798646 Film peeling apparatus having film end detector
01/17/1989US4798439 Optical component mounting
01/17/1989US4798218 Cleaning apparatus for electronic components and/or precision parts of machinery
01/17/1989CA1249069A1 Mass solderng system
01/17/1989CA1249066A1 Mass solderng system
01/17/1989CA1249065A1 Process for forming silver conductors on a substrate
01/17/1989CA1249064A1 Process for application of overlay conductors to surface of printed circuit board assemblies
01/17/1989CA1248910A1 Anode structure for a plating cell
01/12/1989WO1989000374A1 A method for producing a circuit board and a circuit-board preform for use in carrying out the method
01/12/1989WO1989000373A1 Process for manufacturing an object with conductive tracks and embossed foil for carrying out the process
01/12/1989WO1989000346A1 Plated plastic castellated interconnect for electrical components
01/12/1989WO1989000311A1 Automatic clock de-skewing on a circuit board
01/12/1989DE3822766A1 Method for producing printed circuit boards, device for producing printed circuit boards, and a printed circuit board
01/12/1989DE3822403A1 Verfahren zur herstellung von gedruckten leiterplatten Process for the preparation of printed circuit boards
01/11/1989EP0298855A1 Connecting process between a printed circuit and a metallic substrate
01/11/1989EP0298668A2 High temperature adhesive for polyimide films and its use
01/11/1989EP0298422A2 Wiring method
01/11/1989EP0298410A1 Electrical component with contact pins
01/11/1989EP0298345A2 Method for preparing substrates for subsequent electroless metallization
01/11/1989EP0298298A2 Electroplating process and Article of Manufacture
01/11/1989EP0298211A2 Ceramic card assembly having enhanced power distribution and cooling
01/11/1989EP0298204A2 Plasma etching with a large molecular mass inert gas
01/11/1989EP0298200A2 Process for the separation of attached or superposed foils
01/10/1989US4797785 Circuit arrangement and resonant label, and a process for its production
01/10/1989US4797530 Irradiation a dielectric to form electroconductive segment
01/10/1989US4797508 Coating with epoxy resin rubber blend and curing, etching then metallization
01/10/1989US4797307 Process for the preparation of polyimide film
01/10/1989US4797178 Carbon tetrafluoride and oxygen as a process gas
01/10/1989US4797113 Board to board flexible pin
01/10/1989US4797110 Printed circuit board with integral electrical connector and method for making it using wave soldering
01/10/1989US4796977 Unitary LCD display holder
01/10/1989US4796796 Soldering apparatus
01/10/1989US4796795 Flux fume removal device
01/10/1989US4796560 Automatic solder paste application to circuit boards
01/10/1989US4796349 Method of repairing a binding post
01/10/1989CA1248641A1 Method for producing coplanar multi-level metal/insulator films on a substrate and for forming patterned conductive lines simultaneously with stud vias
01/10/1989CA1248311A1 Protectively coating electrical equipment
01/04/1989EP0298034A2 Substituted anthraquinones and their use in epoxy resins
01/04/1989EP0298032A2 Anthrachinoylcarboxylic acid hydrazide, curable compositions and their use
01/04/1989EP0298031A1 Substituted anthraquinones and curable compositions
01/04/1989EP0297732A2 Method for patterned tin oxide thin film element
01/04/1989EP0297678A1 Conductive metallization of substrates without developing agents
01/04/1989EP0297677A1 Conductive metallization of substrates via developing agents
01/04/1989EP0297511A2 Connection structure between components for semiconductor apparatus
01/04/1989EP0297388A1 Electric switch, in particular a steering wheel switch for a motor vehicle
01/04/1989EP0297236A2 Printed circuit board
01/03/1989US4796159 Explosion protected modular housing
01/03/1989US4796156 Self packaging chip mount
01/03/1989US4796132 Thin film magnetic head having Au ultrasonic connection structure
01/03/1989US4796080 Semiconductor chip package configuration and method for facilitating its testing and mounting on a substrate
01/03/1989US4795991 Inlet type noise filter directly mounted to a PC board
01/03/1989US4795870 Conductive member having integrated self-regulating heaters
01/03/1989US4795861 Membrane switch element with coated spacer layer
01/03/1989US4795694 Integrated circuits
01/03/1989US4795693 Rubber modified epoxy resin
01/03/1989US4795670 Multilayer ceramic substrate with circuit patterns
01/03/1989US4795660 Metallized polymer compositions, processes for their preparation and their uses
01/03/1989US4795658 Method of metallizing ceramic material
01/03/1989US4795512 Reduction of copper oxide in glass, ceramics to produce copper electrode
01/03/1989US4795353 Locking clip
01/03/1989US4795079 Structure of joining printed circuit boards and process for producing the same
01/03/1989US4794689 Method of and apparatus for mounting electric components
01/03/1989CA1248242A1 Printed circuit element comprising a polyimide- containing cover layer
01/03/1989CA1248217A1 Miniature hearing aid
01/03/1989CA1247943A1 Electrically and thermally conductive adhesive transfer tape
12/1988
12/29/1988WO1988010509A1 Method for fabricating a tape for electronic module circuits, and tape obtained according to such method
12/29/1988WO1988010505A1 Improvements in and relating to electrical components
12/29/1988WO1988010503A1 Electric switch, in particular steering column switch for motor vehicles
12/29/1988WO1988009599A3 Gold compression bonding
12/29/1988DE3812922A1 Device for connecting a liquid-crystal display element to a flexible cable
12/29/1988DE3720298A1 Metal layer arrangement for thin-film hybrid circuits
12/29/1988DE3719941A1 Device for testing electroplating baths