Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/1989
03/21/1989CA1251426A1 Solder paste dispenser for smd circuit boards
03/16/1989EP0235270A4 Grinding guide and method for controlling the automatic grinding of objects.
03/16/1989DE3729789A1 Method for mounting electronic microcomponents on a printed circuit board
03/16/1989DE3729450A1 Process and device for coating both sides of a film web
03/16/1989DE3728337A1 Method for producing etched printed circuit boards
03/15/1989EP0307319A2 Reflow furnace
03/15/1989EP0307231A2 Display device
03/15/1989EP0307067A2 Fuse covers
03/15/1989EP0306954A2 Process for the deposition of microstructures having a given structure using laser light
03/15/1989EP0306930A2 Conductor tracks with connection points for an electronic component comprising a plurality of terminals, arranged on a circit board
03/15/1989EP0306727A2 Glass powder adhesive sheet
03/15/1989EP0306636A1 Pad printing press for transferring a predifined quantity of printing products
03/15/1989EP0306553A1 Platable composition, plated article formed from it, and method of forming the article
03/15/1989EP0306479A1 Display device for information on lc-displays
03/15/1989CN2034363U Apparatus for manufacturing printed circuit board directly with computer
03/14/1989US4812950 Means for mounting a ROM on a printed circuit board
03/14/1989US4812949 Method of and apparatus for mounting an IC chip
03/14/1989US4812792 Composite of dielectric layers, metal layers and graphite layers
03/14/1989US4812620 Concentrated radiant energy heat source unit
03/14/1989US4812388 Process to obtain thin film lines
03/14/1989US4812355 Polyethylene, metal foil, glass cloth
03/14/1989US4812353 Process for the production of circuit board and the like
03/14/1989US4812275 Electroless deposition, catalysis, circuit boards
03/14/1989US4812217 Continuous transporting, cleaning
03/14/1989US4812213 Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
03/14/1989US4812202 Process for metal-plating ceramic surfaces
03/14/1989US4812191 Method of forming a multilevel interconnection device
03/14/1989US4812135 Flexible electrical connectors
03/14/1989US4812101 Method and apparatus for continuous throughput in a vacuum environment
03/14/1989US4811893 Method for bonding copper plate to alumina substrate and process for producing copper/alumina bonded assembly
03/14/1989US4811482 Embedded wiring patterns
03/14/1989EP0294478A4 Improved grinding guide and method.
03/14/1989EP0290577A4 An improved photo-selective plating method.
03/14/1989EP0235269A4 Automatic grinding machine.
03/09/1989WO1989002213A1 Process for producing conductive patterns on a substrate
03/09/1989WO1989002212A2 Improved circuit board material and electroplating bath for the production thereof
03/09/1989WO1989002135A1 Digitizing tablet
03/09/1989WO1989001990A1 Process for fabricating multilayer circuit boards
03/09/1989WO1989001989A1 Method for applying a film coating of a liquid hot solder resist agent and a resist composition for use with the method
03/09/1989WO1989001842A1 Drilling apparatus and method
03/09/1989DE3828799A1 Glaskeramikplatte sowie verfahren zu deren herstellung Glass-ceramic plate as well as processes for their preparation
03/09/1989DE3728727A1 Drilling tool
03/09/1989DE3728664A1 Electrical component for surface mounting on printed circuit boards
03/09/1989DE3728151A1 Method and device for producing through-plated holes in printed circuits by direct injection of the contact metal in the liquid state
03/08/1989EP0306412A1 Casing for an electronic circuit
03/08/1989EP0306273A2 Alkaline developable liquid photoimageable solder resist ink composition
03/08/1989EP0306255A2 Boring apparatus for a laminated plate and boring cutter
03/08/1989EP0306200A1 Radiation supply and adhesive dispensing system
03/08/1989EP0306156A2 Transfer roller
03/08/1989EP0305698A2 Dosage device for the coating of a printed circuit board by a soldering paste for the soldering of SMD-components
03/08/1989EP0305697A2 Process for soldering SMD components temporarily held by a solder lead evacuated by means of a vacuum connection
03/08/1989EP0305494A1 Electroplating apparatus
03/08/1989EP0147470B1 Apparatus for automatically inserting electronic part
03/08/1989CN1031636A Mounting structure of electronic elements
03/07/1989US4811165 Assembly for circuit modules
03/07/1989US4810563 Semiconductors, metal sheet, polyimide(amide) film, adhesives, particulate solid, circuits
03/07/1989US4810528 Process for producing multilayer circuit board
03/07/1989US4810525 Laser method of coating metal with a noble metal
03/07/1989US4810420 Thick film copper via-fill inks
03/07/1989US4810333 Electroplating process
03/07/1989US4810332 Method of making an electrical multilayer copper interconnect
03/07/1989US4810326 Etching copper with gas plasma of fluorocarbon
03/07/1989US4810321 Coating with polyurethane, then with thermoplastic polymer melt, extrusion
03/07/1989US4810320 Printing, adhesives, registry, joining sheets, curing, transferring
03/07/1989US4810095 Laser-beam, pattern drawing/inspecting apparatus
03/07/1989US4810048 Mechanical part mounting chassis with integrated circuit
03/07/1989US4809443 Apparatus for fixing electronic parts to printed circuit board
03/07/1989CA1250961A1 Conductive polymer devices having leads with reduced resistance to bending
03/07/1989CA1250960A1 Process of scribing a conductor on a circuit board boards using a pulsed laser
03/07/1989CA1250959A1 Molded circuit board
03/02/1989DE3833146A1 Method for producing a controller
03/02/1989DE3727401A1 Moulding for repairing meandering conductor tracks and a device for producing the moulding
03/02/1989DE3727313A1 Holding device for fixing at least one thermostat which has electrical connecting means
03/01/1989EP0305295A2 Metallization layer structure formed on aluminum nitride ceramics and method of producing the metallization layer structure
03/01/1989EP0305267A1 Production method of the totality of conducting patterns on an insulating surface of complex shape
03/01/1989EP0305166A1 Electrical connection pin
03/01/1989EP0305157A2 Adaptor assembly for circuit boards
03/01/1989EP0305103A1 Method and apparatus for preparing a screen printing screeen
03/01/1989EP0304902A2 Arrangement for modifying and/or repairing a flat module when inserting surface-mounted components
03/01/1989EP0304901A2 Arrangement for modifying and/or repairing a flat module when inserting surface-mounted components
03/01/1989EP0304809A1 Perfluorinated butyl derivative compounds
03/01/1989EP0304687A2 Method for regenerating an acid solution
03/01/1989EP0304593A1 Surface mounted device component
03/01/1989EP0304516A1 A reinforced porous dielectric sheet
03/01/1989EP0304472A1 Biased grinding assembly
03/01/1989EP0202291B1 Improvements relating to protectively coating electrical equipment
02/1989
02/28/1989US4809308 Method and apparatus for performing automated circuit board solder quality inspections
02/28/1989US4808967 Circuit board material
02/28/1989US4808769 Film carrier and bonding method using the film carrier
02/28/1989US4808468 Reduced residual concentration of volatiles; improved adhesion
02/28/1989US4808435 Screen printing method for producing lines of uniform width and height
02/28/1989US4808434 Process for application of overlay conductors to surface of printed circuit board assemblies
02/28/1989US4808431 Method for controlling plating on seeded surfaces
02/28/1989US4808365 Method for reducing edge curl on green sheets
02/28/1989US4808274 Metallized substrates and process for producing
02/28/1989US4808113 Electrically connecting printed circuits
02/28/1989US4808112 High density connector design using anisotropically pressure-sensitive electroconductive composite sheets
02/28/1989US4807794 Method and equipment to solder printed-circuit assemblies
02/28/1989CA1250543A1 Method for plating polyamide resin molded article
02/23/1989WO1989001535A1 Method and solution for the prevention of smear in the manufacture of printed circuit boards
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