Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/1989
04/05/1989EP0310208A2 Method for producing a wired circuit board
04/05/1989EP0310010A2 Multilayer printed circuit board formation
04/05/1989EP0309684A1 Method relating to the adhesion of polymeric materials to electrolytic copper surfaces
04/05/1989EP0309593A1 Ceramic base and process for its production
04/05/1989EP0188615B1 Method of and apparatus for forming thick-film circuit
04/05/1989CN1032189A Azeotrope or azeotrope-like composition of trichlorotrifluoroethane, methanol and 1,2-dichloroethylene
04/04/1989US4819131 Integrated circuit package having coaxial pins
04/04/1989US4819094 Damped magnetic head suspension assembly
04/04/1989US4818960 Composite part and method of manufacturing same
04/04/1989US4818879 Positioning and machining apparatus having a scanner for circularly scanning an object by a light beam
04/04/1989US4818823 Adhesive component means for attaching electrical components to conductors
04/04/1989US4818784 Insulating coating layer for electronic circuit board, insulating coating material for electronic circuit board, and method for forming insulating coating layer for electronic circuit board
04/04/1989US4818617 Master overlay sheet which is translucent blue-green or yellow-green color
04/04/1989US4818322 Method for scribing conductors via laser
04/04/1989US4818312 Method of making electronic tags
04/04/1989US4818241 Electrical interconnection device using elastomeric strips
04/04/1989US4818240 Power rails for edge mounting modules
04/04/1989US4817851 Surface mount technology repair station and method for repair of surface mount technology circuit boards
04/04/1989US4817524 Screen printing method and apparatus
04/04/1989US4817477 Apparatus and method of automatically punching hole patterns in sheets of material
04/04/1989US4817280 Method of manufacturing printed circuit boards
04/04/1989US4817277 Method of manufacturing an electrically conductive adhesive bond
04/04/1989US4817276 Sintering mullite with silicon, aluminum,and magnesium oxide binder; printing patterns with high melting metal
03/1989
03/30/1989DE3730497A1 Surface mounted device (SMD)
03/30/1989DE3730325A1 Electronic component
03/29/1989EP0309376A2 Method of making a rigid, mono or multilayer printed circuit
03/29/1989EP0309243A1 Pre-etch treatment of a plastics substrate
03/29/1989EP0309190A2 Polyimide coating compositions
03/29/1989EP0309109A2 Testing process for electronic devices
03/29/1989EP0309082A1 An azeotrope or azeotrope-like composition of trichlorotrifluoroethane, methanol and 1,2-dichlorethylene
03/29/1989EP0308980A2 Flat wire in silicone rubber or matrix MOE
03/29/1989EP0308854A1 Desmear and etchback using NF3/O2 gas mixtures
03/29/1989EP0308851A2 A process for the manufacture of copper thick-film conductors using an infrared furnace
03/29/1989EP0308714A2 Wiring arrangement for connecting a plurality of electrical or electronic devices
03/29/1989EP0308676A2 Non-tensile coating for electrical and electronic components, especially for hybrid circuits
03/29/1989EP0308576A2 A printed wiring board
03/29/1989EP0308518A1 Ink receiving flexible sheet for printing a pattern on an object by firing and label comprising said sheet
03/29/1989EP0276276A4 Method for manufacture of printed circuit boards.
03/29/1989EP0126164B1 Method of connecting double-sided circuits
03/28/1989US4816967 Low impedance interconnect method and structure for high frequency IC such as GaAs
03/28/1989US4816789 Solderless, pushdown connectors for RF and DC
03/28/1989US4816666 Apparatus and methods for inspection of electrical materials and components
03/28/1989US4816616 Structure and method for isolated voltage referenced transmission lines of substrates with isolated reference planes
03/28/1989US4816323 Ceramic substrate, electroconductive metal and fluoropolymer dielectric overcoating
03/28/1989US4816200 Method of making an electrical thick-film, free-standing, self-supporting structure, particularly for sensors used with internal combustion engines
03/28/1989US4816086 Compositions useful in copper oxidation, and a method to prepare copper oxidation solutions
03/28/1989US4816070 Use of immersion tin and alloys as a bonding medium for multilayer circuits
03/28/1989US4815990 Flexible circuit having termination features and method of making the same
03/28/1989US4815982 Electrical connector having stress-free contacts
03/28/1989US4815981 Flexible printed circuit board terminal structure
03/28/1989US4815913 Electronic component mounting device
03/28/1989US4815208 Method of joining substrates for planar electrical interconnections of hybrid circuits
03/23/1989WO1989002697A1 Induced metallization process by way of dissociating aluminum nitride ceramic
03/23/1989WO1989002695A1 Multiple electrode plasma reactor power distribution system
03/22/1989EP0308296A1 Printed circuit comprising a heat sink
03/22/1989EP0308011A1 Method of locally providing metal on a surface of a substrate
03/22/1989EP0307990A1 Surface-mounted device coated with an adhesive
03/22/1989EP0307923A2 Resin composition curable with an active energy ray containing half-esterificated epoxy resin and monomer having ethylenically unsaturated bond
03/22/1989EP0307922A2 Resin composition curable with an active energy ray containing half-esterificated epoxy resin as a constituent
03/22/1989EP0307921A2 Resin composition curable with an active energy ray containing photopolymerizable polyurethane
03/22/1989EP0307920A2 Resin composition curable with an active energy ray containing graft copolymerized polymer with trunk chain containing dicyclopentenyl group
03/22/1989EP0307919A2 Resin composition curable with an active energy ray containing epoxy resin and monomer with ethylenically unsaturated bond
03/22/1989EP0307918A2 Resin composition curable with an active energy ray containing epoxy resin containing at least a compound having one or more of epoxy group in the molecule
03/22/1989EP0307888A2 Solder precipitating composition and method of precipitating solder
03/22/1989EP0307878A2 Method for fabricating multilayer circuits
03/22/1989EP0307773A1 Method of manufacturing electronic modules, especially for smart cards
03/22/1989EP0307766A1 Circuit board to be imprinted with SMD components
03/22/1989EP0307611A2 Method and apparatus for selective electroplating
03/22/1989EP0307597A1 Printed circuit mother board for busses of microprocessors
03/22/1989EP0307596A2 Method of producing conductor networks
03/22/1989EP0307591A2 Method and apparatus for aligning solder balls
03/22/1989EP0307585A2 Process for the firmly adhering metallisation of an enamel
03/22/1989EP0307574A1 Soldering head for soldering or unsoldering components
03/22/1989EP0307425A1 Mounting arrangement for a chip carrier.
03/22/1989EP0307412A1 Solder leveller.
03/22/1989EP0307407A1 Solder leveller.
03/22/1989EP0156919B1 Electrolytic capacitor
03/22/1989CN1031907A Snap on fuse cover
03/21/1989US4814947 Surface mounted electronic device with selectively solderable leads
03/21/1989US4814945 Multilayer printed circuit board for ceramic chip carriers
03/21/1989US4814944 Mounting structure for surface mounted type component with projection extending down from lower surface thereof and method of mounting a surface mounted type component on a printed circuit board
03/21/1989US4814855 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
03/21/1989US4814295 Mounting of semiconductor chips on a plastic substrate
03/21/1989US4814283 Simple automated discretionary bonding of multiple parallel elements
03/21/1989US4814259 Laser generated electrically conductive pattern
03/21/1989US4814246 Light-sensitive photoconductive recording material with light sensitive covering layer for use in manufacturing printing form or printed circuit
03/21/1989US4814205 Addition of ferric compounds
03/21/1989US4814040 Thermal compression
03/21/1989US4813825 Drilling spindle with pressure foot shutter
03/21/1989US4813642 Fixation device for electronic display
03/21/1989US4813352 Silkscreen printer
03/21/1989US4813130 Automatic extrusion pinning method and apparatus
03/21/1989US4813129 Interconnect structure for PC boards and integrated circuits
03/21/1989US4813128 High density disposable printed circuit inter-board connector
03/21/1989CA1251595A1 Aluminum-filled compositions
03/21/1989CA1251588A1 POLYMERS WITH GRAFT .alpha.-ALKYLACRYLATE FUNCTIONALITY
03/21/1989CA1251577A1 Apparatus for making scribed circuit boards and circuit board modifications
03/21/1989CA1251576A1 Wire scribed circuit boards and method of manufacture
03/21/1989CA1251575A1 Automatic test system having a "true tester-per-pin" architecture
03/21/1989CA1251519A1 Method of desmearing holes
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