Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1989
05/03/1989EP0119272B1 Method and device for soldering printed board
05/03/1989DE3735959A1 Multilayer thin-film circuit and a method for its production
05/03/1989DE3735798A1 Method and device for the electrostatic coating of electrical printed circuit boards
05/02/1989US4827377 Multi-layer circuitry
05/02/1989US4827328 Hybrid IC device
05/02/1989US4827327 Integrated circuit device having stacked conductive layers connecting circuit elements therethrough
05/02/1989US4827208 Circuit testers
05/02/1989US4827083 Silver-palladium alloy
05/02/1989US4826941 Process for the anionic polymerization of acrylic monomers and optionally of vinyl comonomers
05/02/1989US4826755 Process of photoetching of superficial coatings based on polymeric materials
05/02/1989US4826720 Polyetherimide or polyether ketone polymers
05/02/1989US4826705 Radiation curable temporary solder mask
05/02/1989US4826565 Etching for roughness
05/02/1989US4826365 Material-working tools and method for lubricating
05/02/1989US4826068 Outer lead bonding device utilizing tape carriers
05/02/1989US4825539 Process for manufacturing a multilayer substrate
05/02/1989US4825536 Method for fabricating electronic circuit board
05/02/1989CA1253629A1 Laser direct writing of conductive patterns
05/02/1989CA1253628A1 Hybrid and multi-layer circuitry
05/02/1989CA1253604A1 Method for deriving an interconnection route between elements in an interconnection medium
04/1989
04/27/1989DE3733860A1 Thin-film resistor
04/26/1989EP0313111A2 Photoprinting with radiation transparent phototools
04/26/1989EP0312994A2 Process for producing a molded article of thermoplastic resin
04/26/1989EP0312824A2 Ceramic structure with copper based conductors and method for forming such a structure
04/26/1989EP0312802A2 Self-mounted chip carrier
04/26/1989EP0312751A2 Positive-working radiation-sensitive composition and radiation-sensitive recording material produced therefrom
04/26/1989EP0312682A2 Printed circuit board
04/26/1989EP0312631A1 Method for manufacturing electrical connection between flat electrical conducting paths and circuit board manufactured with this method
04/26/1989EP0312607A1 Power circuit board and manufacturing method
04/26/1989EP0312551A1 Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists
04/26/1989EP0215031B1 Method for selectively forming at least a coating strip of a metal or alloy on a substrate of another metal
04/25/1989USRE32910 Arrangement for mounting components on a carrier board and method of indicating mounting locations
04/25/1989US4824875 UV curable conformal coating with moisture shadow cure
04/25/1989US4824693 Method for depositing a solderable metal layer by an electroless method
04/25/1989US4824511 Multilayer circuit board with fluoropolymer interlayers
04/25/1989US4824381 Circuit board containing a metal net
04/25/1989US4824379 Flexible circuit connection assembly
04/25/1989US4824310 Automated work-piece handling system for machine tool
04/25/1989US4824010 Process and apparatus for soldering printed circuit boards
04/25/1989US4824009 Process for braze attachment of electronic package members
04/25/1989CA1253259A1 Board for printed circuits and processes for manufacturing such printed circuit boards
04/20/1989DE3828873A1 Circuit board with a printed electric circuit and a transparent protective layer and also a process for producing the same
04/19/1989EP0312498A1 Conveying method for plates
04/19/1989EP0312415A1 Circuit board for high currents and process of making the same
04/19/1989EP0312268A2 Method of treating surface of molded article comprising liquid crystal polyester resin
04/19/1989EP0312170A2 Process for step and repeat vacuum-deposition of large-area thin-film transistor matrix-circuits on monolithic glass panels through perforated metal masks
04/19/1989EP0311989A1 Surface treatment of polyethylene fibers
04/19/1989EP0311970A2 Printed circuit board
04/19/1989EP0311881A2 Use of addition products of alkylene oxide in fluxes and remelt liquids
04/19/1989EP0072830B2 Treatment of copper foil
04/18/1989US4823277 Forming plated through holes in a printed circuit board by using a computer controlled plotter
04/18/1989US4823217 Circuiting device
04/18/1989US4822988 Card containing a component and a micromodule having side contacts
04/18/1989US4822697 Vapor deposition of hydrogen silsesquioxane, heating
04/18/1989US4822638 Electronic device fabrication on non-conductive polymer substrate
04/18/1989US4822633 Auto-selective metal deposition on dielectric surfaces
04/18/1989US4822523 Electrically conductive, potentially adhesive composition
04/18/1989US4822468 Barrel plating apparatus
04/18/1989US4822196 In a telephone wire connecting panel
04/18/1989US4821948 Method and apparatus for applying flux to a substrate
04/18/1989US4821947 In inert environment at low temperature
04/18/1989US4821946 Soldering method
04/18/1989US4821614 Programmable magnetic repulsion punching apparatus
04/18/1989US4821413 Method of making electric component
04/18/1989CA1252909A1 Modular circuit board units mounted on printed circuit board for forming module-in-module connection and circuit arrangement
04/18/1989CA1252696A1 Polyimide embedded conductor process
04/13/1989DE3732854A1 Assembly of integral construction
04/13/1989DE3732249A1 Method for fabricating three-dimensional printed-circuit boards
04/12/1989EP0311418A2 Composite bead element
04/12/1989EP0311288A2 Improvements in or relating to resin compositions curable with ultraviolet light
04/12/1989EP0311274A2 Thermal writing on glass or glass-ceramic substrates and copper-exuding glasses
04/12/1989EP0311232A2 Process for surface treatment of moldings of liquid-crystalline polyester resin
04/12/1989EP0311222A2 Wire mat mateable with a circuit board
04/12/1989EP0310965A2 Electronic device
04/12/1989EP0310803A1 Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby
04/12/1989EP0310656A1 Surface treatment of polymers.
04/12/1989CN1003899B Method for manufacture of electronic device
04/11/1989US4821152 Method and device for mounting electric components on a circuit board
04/11/1989US4821142 Specific thermal expansion coefficient and softening point
04/11/1989US4821014 Variable resistor for mounting on surface
04/11/1989US4821007 Strip line circuit component and method of manufacture
04/11/1989US4820661 Amorphous aluminoborosilicate frits with oxides of titanium, zirconium, barium, zinc, calcium
04/11/1989US4820612 Electronic device and its manufacturing method
04/11/1989US4820562 Metallizing composition for sintered ceramic article
04/11/1989US4820553 Method for pretreatment of polyesters for metal plating
04/11/1989US4820549 Photo-curable resist resin composition for electroless plating, process for preparing a printed circuit board with the said resist resin composition and a printed circuit board having resist prepared from the said resist resin composition
04/11/1989US4820548 Three step process for treating plastics with alkaline permanganate solutions
04/11/1989US4820446 Polysiloxane-polyurethane block polymers
04/11/1989US4820376 Fabrication of CPI layers
04/11/1989US4820171 Coupling plate having a plurality of electric coupling points, a method of producing such a plate and a use of the coupling plate as a planning board
04/11/1989US4819842 Radiation supply and adhesive dispensing system
04/11/1989US4819327 Soldering method for printed circuit board
04/06/1989WO1989003165A1 Wire/disk board-to-board interconnect device
04/06/1989WO1989003128A1 Contact plug
04/06/1989WO1989002822A1 Flexible metal/plastic laminate and method and apparatus for manufacturing same
04/06/1989WO1989002212A3 Improved circuit board material and electroplating bath for the production thereof
04/06/1989DE3732855A1 Steckerstift Connector pin
04/06/1989DE3731714A1 Soldering device having a flux applicator
04/06/1989DE3731691A1 Method and appliance for producing plated-through holes in printed circuits by centrifugal direct injection of the contact medium
04/05/1989EP0310437A1 Method of manufacturing a metallised aluminium nitride circuit board