| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 05/24/1989 | DE3738168A1 Method for solder attachment of components on printed circuit boards |
| 05/24/1989 | DE3738051A1 Printed circuit board assembly |
| 05/24/1989 | DE3737945A1 Vacuum laminator |
| 05/24/1989 | DE3737830A1 Device for irradiating printed circuit boards on both sides |
| 05/24/1989 | DE3737674A1 Device for cleaning preferably flat workpieces |
| 05/24/1989 | DE3737565A1 Method and device for soldering |
| 05/24/1989 | DE3729532A1 Method for wiring small domestic electrical apparatuses |
| 05/23/1989 | US4833590 Method and apparatus for the fine adjustment of an object on a sub-surface of a plane |
| 05/23/1989 | US4833570 Electronic circuit assembly |
| 05/23/1989 | US4833568 Three-dimensional circuit component assembly and method corresponding thereto |
| 05/23/1989 | US4833328 Forming contacts on diamonds |
| 05/23/1989 | US4833104 Glass-ceramic substrates for electronic packaging |
| 05/23/1989 | US4833039 Hermetic feedthrough in ceramic substrate |
| 05/23/1989 | US4833004 Structure of copper conductor and method of forming same |
| 05/23/1989 | US4832989 Method of improving the bond strength of electrolessly deposited metal layers on plastic-material surfaces |
| 05/23/1989 | US4832988 Process for chemically metallizing an inorganic substrate |
| 05/23/1989 | US4832811 Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
| 05/23/1989 | US4832799 Amines, alkali metal hydroxides, multilayer |
| 05/23/1989 | US4832621 Probe for in-circuit emulator |
| 05/23/1989 | US4832620 Electrical connector terminal for a flexible printed circuit board |
| 05/23/1989 | US4832609 Solderless circuit connection for bowed circuit board |
| 05/23/1989 | US4832455 Liquid crystal apparatus having an anisotropic conductive layer between the lead electrodes of the liquid crystal device and the circuit board |
| 05/23/1989 | US4832255 Precision solder transfer method and means |
| 05/23/1989 | US4832249 Method and arrangement for reflow soldering and reflow unsoldering of circuit boards |
| 05/23/1989 | US4831724 Apparatus and method for aligning surface mountable electronic components on printed circuit board pads |
| 05/23/1989 | US4831723 Direct bond circuit assembly with crimped lead frame |
| 05/23/1989 | EP0245305A4 Copper oxide treatment in printed circuit board. |
| 05/23/1989 | CA1254493A1 High concentration sodium permanganate etch bath and its use in desmearing and/or etching printed circuit boards |
| 05/18/1989 | WO1989004589A1 Welding device |
| 05/18/1989 | WO1989004588A1 Method of forming metal coating on dielectric |
| 05/18/1989 | WO1989004234A1 Vapour phase process and apparatus |
| 05/18/1989 | DE3738067A1 Device for the multiple coating of boards |
| 05/18/1989 | DE3738023A1 Miniature etching system with regeneration unit and rinsing unit for etching copper surfaces and electrolytic copper recovery |
| 05/18/1989 | DE3737636A1 Device for brushing board-shaped workpieces |
| 05/17/1989 | EP0316061A1 Composition and process for conditioning the surface of polycarbonate resins prior to metal plating |
| 05/17/1989 | EP0316039A2 Machine for machining close parallel score lines on plane sheets |
| 05/17/1989 | EP0315905A2 Electroluminescent device |
| 05/17/1989 | EP0315891A1 Bath solutions and processes for stripping lead/tin, lead or tin layers from copper or nickel surfaces |
| 05/17/1989 | EP0315851A1 Laminate consisting of polymers resistant to high temperatures with metal layers directly applied to them |
| 05/17/1989 | EP0315829A2 Drill back-up material for small bore drilling of circuit boards |
| 05/17/1989 | EP0315792A2 Interconnection system for integrated circuit chips |
| 05/17/1989 | EP0315762A2 Continuous furnace for soldering electronic components |
| 05/17/1989 | EP0315748A2 Positive-working radiation-sensitive composistion and radiation-sensitive recording material produced therefrom |
| 05/17/1989 | EP0315739A2 Device for separating and edging printed circuit boards |
| 05/16/1989 | US4831278 Wire harness for automobile |
| 05/16/1989 | US4830979 Method of manufacturing hermetically sealed compression bonded circuit assemblies |
| 05/16/1989 | US4830922 Viscous dielectric hydrocarbon grease; inert shape-maintaining particles; for high impedance circuits |
| 05/16/1989 | US4830903 Metal in a matrix |
| 05/16/1989 | US4830880 Applying polymer and metal complex, decomposing complex to form nuclei, removing polymer |
| 05/16/1989 | US4830878 Method of manufacturing a substrate coated with multiple thick films |
| 05/16/1989 | US4830723 Method of encapsulating conductors |
| 05/16/1989 | US4830714 Process for the production of printed circuit boards |
| 05/16/1989 | US4830704 Replacement of portions of copper invar core with superior conductive materials |
| 05/16/1989 | US4830691 Process for producing high-density wiring board |
| 05/16/1989 | US4830608 Baking oven for printed circuit substrates |
| 05/16/1989 | US4830554 Routing apparatus for cutting printed circuit boards |
| 05/16/1989 | US4830264 Method of forming solder terminals for a pinless ceramic module |
| 05/16/1989 | US4829664 Method for mounting electronic components |
| 05/16/1989 | US4829663 Method of mounting surface-mounted type electronic components on a printed circuit board |
| 05/16/1989 | EP0313580A4 Radiation curable temporary solder mask. |
| 05/11/1989 | DE3836480A1 Anhaenger bzw. etikett und verfahren zu seiner herstellung Trailers or label and process for its manufacture |
| 05/10/1989 | EP0315450A2 Pellicle |
| 05/10/1989 | EP0315407A2 High temperature release sheet for printed circuit boards |
| 05/10/1989 | EP0315343A1 Solder masks |
| 05/10/1989 | EP0315342A2 UV curable conformal coating with moisture shadow cure |
| 05/10/1989 | EP0315341A2 Compositions having uv cure with moisture shadow cure |
| 05/10/1989 | EP0315320A2 Thick-film high frequency signal circuit apparatus with feedthrough capacitor |
| 05/10/1989 | EP0315228A1 Soldering apparatus |
| 05/10/1989 | EP0315165A2 Positive-type photosensitive electrodeposition coating composition |
| 05/10/1989 | EP0315000A2 Soldering device |
| 05/10/1989 | EP0314895A1 Fuse element |
| 05/10/1989 | EP0314670A1 Azeotrope-like compositions of trichlorotrifluoroethane, methanol, nitromethane, acetone, and methyl acetate |
| 05/10/1989 | EP0178327B1 Method of manufacturing transparent electrode substrate |
| 05/10/1989 | EP0178306B1 Rotary screen printing apparatus |
| 05/10/1989 | EP0120083B1 Apparatus and method for electroless plating |
| 05/09/1989 | US4829406 Square body leadless electrical device |
| 05/09/1989 | US4829404 Method of producing a flexible circuit and master grid therefor |
| 05/09/1989 | US4829375 Method for punching in printed circuit board laminates and related apparatus and articles of manufacture |
| 05/09/1989 | US4828967 Electronic device and its manufacturing method |
| 05/09/1989 | US4828961 Imaging process for forming ceramic electronic circuits |
| 05/09/1989 | US4828878 Device for and method of treating objects, particularly printed circuit boards |
| 05/09/1989 | US4828877 Forming conductive link in gap left by vaporizable plug |
| 05/09/1989 | US4828654 Variable size segmented anode array for electroplating |
| 05/09/1989 | US4827672 Abrasive cutting wheel system |
| 05/09/1989 | US4827611 Compliant S-leads for chip carriers |
| 05/09/1989 | US4827610 Method of creating solder or brazing barriers |
| 05/09/1989 | CA1253930A1 Flexible electrical connectors |
| 05/09/1989 | CA1253788A1 Cutting device with a heated cutting wire and process for cutting employing the cutting device |
| 05/05/1989 | WO1989004113A1 High-density electronic modules, process and product |
| 05/05/1989 | WO1989003761A1 Fiber/resin composites, and method of making the same |
| 05/03/1989 | EP0314132A2 Curable composition |
| 05/03/1989 | EP0314053A1 Electroplating device for the thickening of a conductive line on a glass window |
| 05/03/1989 | EP0314051A2 Method of coating surfaces previously made adhesive |
| 05/03/1989 | EP0313860A2 An edge support and power distribution structure |
| 05/03/1989 | EP0313855A2 Process for removing contaminant |
| 05/03/1989 | EP0313778A2 Production of printing master plate or printed circuit board |
| 05/03/1989 | EP0313580A1 Radiation curable temporary solder mask. |
| 05/03/1989 | EP0313574A1 Potted electrical/mechanical devices, and dual cure potting method. |
| 05/03/1989 | EP0201583B1 Process for fabricating dimensionally stable interconnect boards and product produced thereby |
| 05/03/1989 | EP0134416B1 Fibre-reinforced composite and method of making a fibre for composites |