| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/20/1989 | US4840702 Apparatus and method for plasma treating of circuit boards |
| 06/20/1989 | US4840698 Apparatus for laminating a film under pressure and heat |
| 06/20/1989 | US4840666 Lacquer, and process for producing anti-corrosion coatings |
| 06/20/1989 | US4840305 Method for vapor phase soldering |
| 06/20/1989 | CA1256175A1 Circuit to post interconnection device |
| 06/20/1989 | CA1256007A1 Process for laminating a film under pressure and heat and an apparatus for carrying out the process |
| 06/20/1989 | CA1255975A1 Formaldehyde-free autocatalytic electroless copper plating |
| 06/15/1989 | WO1989005570A1 Mounting substrate for leadless ceramic chip carrier |
| 06/15/1989 | WO1989005568A1 Process for manufacturing through-contacting printed circuit boards |
| 06/15/1989 | WO1989005567A1 A method of producing an electronic circuit part and an apparatus for producing an electronic circuit part |
| 06/15/1989 | WO1989005566A1 Apparatus and method for the manufacture of printed circuit board prototypes |
| 06/15/1989 | WO1989005476A1 Photoimageable compositions |
| 06/15/1989 | WO1989005361A1 Deposition of materials in a desired pattern on to substrates |
| 06/14/1989 | EP0320238A1 Imide type prepolymer compositions and processes for preparing same |
| 06/14/1989 | EP0320013A2 Chip type capacitor and manufacturing thereof |
| 06/14/1989 | EP0319827A2 Wiring method and apparatus for electronic circuit boards or the like |
| 06/14/1989 | EP0319755A1 Method for controlling plating on seeded surfaces |
| 06/14/1989 | CN1033389A Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof |
| 06/13/1989 | US4839775 Thick-film circuit arrangement having a ceramic substrate plate |
| 06/13/1989 | US4839497 Drilling apparatus and method |
| 06/13/1989 | US4839232 Flexible laminate printed-circuit board and methods of making same |
| 06/13/1989 | US4839218 Multilayer; containing a vinyl chloride plastisol and adhesive |
| 06/13/1989 | US4838800 High density interconnect system |
| 06/13/1989 | US4838656 Transparent electrode fabrication |
| 06/13/1989 | US4838476 Vapour phase treatment process and apparatus |
| 06/13/1989 | US4838475 Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device |
| 06/13/1989 | US4837927 Method of mounting circuit component to a circuit board |
| 06/13/1989 | EP0288507A4 Process for preparing multilayer printed circuit boards. |
| 06/13/1989 | EP0288491A4 Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein. |
| 06/13/1989 | CA1255812A1 Semiconductor chip package with semiconducting lead alignment bars |
| 06/13/1989 | CA1255810A1 Molded articles having areas catalytic, and non-catalytic, for adherent metallization |
| 06/13/1989 | CA1255692A1 Aqueous alkaline developable, uv curable urethane acrylate compounds and compositions useful for forming solder mask coatings |
| 06/13/1989 | CA1255542A1 Solder/unsolder device |
| 06/08/1989 | DE3826999A1 Cable link and a method for its production |
| 06/08/1989 | DE3740149A1 Method for producing a conductor pattern on a substrate |
| 06/08/1989 | DE3737946A1 Cut-sheet lamination by means of a laminator |
| 06/07/1989 | EP0319263A2 Method of producing polymer article having metallized surface |
| 06/07/1989 | EP0319146A2 Glass-ceramic substrates for electronic packaging and thermally crystallizable glass compositions of use in the production thereof |
| 06/07/1989 | EP0319008A2 Epoxy resin compositions as used in producing composites with high wet glass transition temperatures and in adhesive applications |
| 06/07/1989 | EP0318876A2 Method for improving the adhesion of a metal to a fluoropolymer |
| 06/07/1989 | EP0318513A1 Method for forming a metal coating on a substrate. |
| 06/07/1989 | EP0318485A1 Apparatus and method for high density interconnection substrates using stacked modules. |
| 06/06/1989 | US4837412 Keyboard of a membrane contact type |
| 06/06/1989 | US4837408 High density multilayer wiring board and the manufacturing thereof |
| 06/06/1989 | US4837407 Plastic electrically insulating substrates for wiring circuit boards and a method of manufacturing thereof |
| 06/06/1989 | US4837129 Process for producing conductor patterns on three dimensional articles |
| 06/06/1989 | US4837086 Adhesive clad insulating substrate used for producing printed circuit boards |
| 06/06/1989 | US4837050 Method for producing electrically conductive circuits on a base board |
| 06/06/1989 | US4836889 Containing metal oxides; inorganic acid etching |
| 06/06/1989 | US4836792 Connector |
| 06/06/1989 | US4836651 Flexible circuit interconnection for a matrix addressed liquid crystal panel |
| 06/06/1989 | US4836435 Component self alignment |
| 06/06/1989 | US4836137 Apparatus for electrostatically spray coating workpieces with air ionizing neutralizing device |
| 06/06/1989 | US4836107 Arrangement of modular subassemblies |
| 06/06/1989 | US4835859 Method of forming a contact bump |
| 06/06/1989 | US4835847 Method and apparatus for mounting a flexible film electronic device carrier on a substrate |
| 06/06/1989 | US4835846 Method of manufacture of electronic modules for cards with microcircuits |
| 06/01/1989 | WO1989005066A1 Moldable/foldable radio housing |
| 06/01/1989 | WO1989004880A1 High temperature thermoplastic substrate having a vacuum deposited solderable electrical circuit pattern and method of manufacture |
| 06/01/1989 | DE3838971A1 Goldplattierte anschlusselemente Gold plated connector elements |
| 06/01/1989 | DE3804558A1 Circuit element |
| 05/31/1989 | EP0318209A2 Interconnection technique using dielectric layers |
| 05/31/1989 | EP0317748A2 Pre-treatment process for synthetic resins |
| 05/30/1989 | US4835704 Adaptive lithography system to provide high density interconnect |
| 05/30/1989 | US4835598 Wiring board |
| 05/30/1989 | US4835593 Multilayer thin film metallurgy for pin brazing |
| 05/30/1989 | US4835345 Printed wiring board having robber pads for excess solder |
| 05/30/1989 | US4835344 Electronic component parts and method for manufacturing the same |
| 05/30/1989 | US4835065 Composite alumina-aluminum nitride circuit substrate |
| 05/30/1989 | US4835061 Conductive laminate |
| 05/30/1989 | US4835039 Tungsten paste for co-sintering with pure alumina and method for producing same |
| 05/30/1989 | US4835038 Substrate coated with multiple thick films |
| 05/30/1989 | US4835008 Process of forming breadboard interconnect structure having plated through-holes |
| 05/30/1989 | US4834844 Process for the selective additive correction of voids in copying layers |
| 05/30/1989 | US4834835 Glass fiber reinforcement, dry etching |
| 05/30/1989 | US4834834 Laser photochemical etching using surface halogenation |
| 05/30/1989 | US4834821 Process for preparing polymeric materials for application to printed circuits |
| 05/30/1989 | US4834796 Electroless copper plating solution and process for electrolessly plating copper |
| 05/30/1989 | US4834794 Solder composition of mixed powders |
| 05/30/1989 | US4834662 Method and arrangement for the connection of a multipole connector to a circuit board |
| 05/30/1989 | US4833913 Sample having coated perforations intended to be examined under the microscope and its preparation process, particularly for printed circuit boards |
| 05/30/1989 | US4833775 Electrical connection apparatus for flat conductor cables and similar articles |
| 05/30/1989 | CA1255049A1 Filler for electronic element encapsulation resin and electronic element encapsulation resin composition containing the same |
| 05/30/1989 | CA1255014A1 Round solder pad for surface mounting electronic devices and a surface mounting position incorporating such shaped pads |
| 05/30/1989 | CA1255013A1 Airless spray method of coating circuit boards |
| 05/30/1989 | CA1255012A1 Self-soldering, flexible circuit connector |
| 05/30/1989 | CA1254789A1 Multilayer hybrid integrated circuit |
| 05/24/1989 | EP0317440A1 Device for controling a soldering joint by electronic mesurement of the soldering joint area |
| 05/24/1989 | EP0317422A1 Individual tinning device for printed-circuit boards |
| 05/24/1989 | EP0317310A2 Molded-in lead frames |
| 05/24/1989 | EP0317256A2 A printed circuit substrate |
| 05/24/1989 | EP0317213A2 Device for transferring printed circuit board |
| 05/24/1989 | EP0317011A2 Multi-level circuits, methods for their fabrication, and display devices incorporating such circuits |
| 05/24/1989 | EP0316947A2 Apparatus for and method of screen printing on boards |
| 05/24/1989 | EP0316886A2 Printed circuit board manufacturing method |
| 05/24/1989 | EP0316591A2 One-component conposition curable at room temperature while eliminating an oxime |
| 05/24/1989 | EP0316534A1 Circuit element |
| 05/24/1989 | EP0316452A1 Process for preparing thin film of base metal and application of the same |
| 05/24/1989 | DE3739043A1 Printed-circuit board component |
| 05/24/1989 | DE3738545A1 Device for mounting plug connectors on printed circuit boards |