| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 07/11/1989 | US4846922 Method of making deactivatable tags |
| 07/11/1989 | US4846918 Copper etching process and product with controlled nitrous acid reaction |
| 07/11/1989 | US4846709 Reinforced connection for a chemical connector and method of constructing therefor |
| 07/11/1989 | US4846390 Automatic soldering apparatus |
| 07/11/1989 | US4846202 Device for cleaning or chemical treatment or workpieces |
| 07/11/1989 | US4846032 Device and method for separating printed circuit boards |
| 07/11/1989 | CA1257401A1 Multi-point solder paste application |
| 07/11/1989 | CA1257347A1 Microwave connector assembly capable of being readily connected to microwave circuit components |
| 07/11/1989 | CA1257220A1 Plating bath and method for electroplating tin and/or lead |
| 07/11/1989 | CA1257188A1 Apparatus and process for the production of multilayer laminated plates |
| 07/11/1989 | CA1257154A1 Planarized ceramic substrates |
| 07/06/1989 | DE3837009A1 Method for producing a thin-film circuit |
| 07/06/1989 | DE3743744A1 Polymeric conditioning agents for the pretreatment of nonmetallic surfaces for a chemical metallization |
| 07/06/1989 | DE3743742A1 Polymeric conditioning agents for the pretreatment of nonmetallic surfaces for a chemical metallization |
| 07/06/1989 | DE3743740A1 Polymeric conditioning agents for the pretreatment of nonmetallic surfaces for a chemical metallization |
| 07/05/1989 | EP0323295A1 Method for fixing an electronic component and its contacts on a carrier |
| 07/05/1989 | EP0323186A2 Multilayer ceramic coatings from metal oxides and hydrogen silsequioxane resin ceramified in ammonia |
| 07/05/1989 | EP0323103A2 Multilayer ceramics coatings from the ceramification of hydrogen silsesquioxane resin in the presence of ammonia |
| 07/05/1989 | EP0322997A2 Process for making printed circuit boards |
| 07/05/1989 | EP0322967A1 Process of metallising a silica, quartz, glass or saphire substrate, and substrate obtained by this process |
| 07/05/1989 | EP0322764A2 Method for producing copper film-formed articles |
| 07/05/1989 | EP0322696A1 Contact pad for connecting a clip-on terminal to a hybrid circuit substrate wafer |
| 07/05/1989 | EP0322641A2 Process for improving the adhesion of electrolessly plated metal layers to polyimide surfaces |
| 07/05/1989 | CN1004747B Printed circuit board unit |
| 07/04/1989 | USH650 Double sided circuit board and a method for its manufacture |
| 07/04/1989 | US4845479 High reliability PWB interconnection for touch input systems |
| 07/04/1989 | US4845474 Smoke and fire detector |
| 07/04/1989 | US4845452 Composite bead element |
| 07/04/1989 | US4845315 Cable system |
| 07/04/1989 | US4845313 Metallic core wiring substrate |
| 07/04/1989 | US4845311 Flexible coaxial cable apparatus and method |
| 07/04/1989 | US4845012 Photocurable electrodeposition coating compositions for printed circuit photoresist films |
| 07/04/1989 | US4844981 Adhesion promoter for printed circuits |
| 07/04/1989 | US4844784 Precise bonding |
| 07/04/1989 | US4844758 Thin film coating method |
| 07/04/1989 | US4844324 Solder system and method of using same |
| 07/04/1989 | US4843961 Stencil printing with vacuum support frame |
| 07/04/1989 | CA1257011A1 Electrical component with added connecting conducting paths |
| 07/04/1989 | CA1257010A1 Heat dissipation for electronic components on a ceramic substrate |
| 07/04/1989 | CA1257009A1 Process for optically testing circuit boards |
| 06/29/1989 | WO1989006087A1 Improvements in or relating to the repair of electrical circuits |
| 06/29/1989 | WO1989005984A1 Process for adapting the frequency band of an oscillating circuit made from a metal-plastic-metal sandwich foil useful as an identification label, and sandwich foil for implementing the process |
| 06/29/1989 | WO1989005831A1 Resin composition and solder resist resin composition |
| 06/29/1989 | DE3743163A1 Printed circuit board for an electrical circuit, especially in an office machine |
| 06/28/1989 | EP0322258A2 Method for producing thin film patterns on substrates |
| 06/28/1989 | EP0322165A1 Thermally conductive ceramic/polymer composites |
| 06/28/1989 | EP0322121A1 Surface mounting leadless components on conductor pattern supporting substrates |
| 06/28/1989 | EP0321899A1 Method and cooling device for an integrated-circuit housing |
| 06/28/1989 | EP0321856A2 Polymeric conditioning product for the pre-treatment of non-metallic surfaces for electroless metal plating |
| 06/28/1989 | EP0321855A2 Polymeric conditioning product for the pre-treatment of non-metallic surfaces for electroless metal plating |
| 06/28/1989 | EP0321734A1 Process for the production of strongly adhering metallic structures on fluoropolymers and thermoplastic materials |
| 06/28/1989 | EP0321668A2 Circuit board with conductor |
| 06/28/1989 | EP0321552A1 Automatic clock de-skewing on a circuit board |
| 06/28/1989 | EP0321525A1 A pin fastened to a printed circuit board by soldering. |
| 06/28/1989 | EP0321510A1 Arrangement for holding a printed circuit board fixed to a frame. |
| 06/28/1989 | CN1004678B Electric component part having lead terminals |
| 06/27/1989 | US4843520 Electronic circuit module |
| 06/27/1989 | US4843404 Tag web of spiral conductors |
| 06/27/1989 | US4843330 Electron beam contactless testing system with grid bias switching |
| 06/27/1989 | US4843329 Method for contactless testing for electrical opens and short circuits in conducting paths in a substrate |
| 06/27/1989 | US4843280 A modular surface mount component for an electrical device or led's |
| 06/27/1989 | US4843191 Interconnection technique using dielectric layers |
| 06/27/1989 | US4843190 Circuit board substrate with gold plated contact elements and a method for mounting gold plated contact elements to the substrate |
| 06/27/1989 | US4843113 Containing wollastonite and alkaline earth metal carbonate |
| 06/27/1989 | US4842946 Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby |
| 06/27/1989 | US4842899 Process for forming metallic film on inorganic material |
| 06/27/1989 | US4842677 Excimer laser patterning of a novel resist using masked and maskless process steps |
| 06/27/1989 | US4842654 Free-falling through temperature gradients oils; speres |
| 06/27/1989 | US4842528 Solder post retention means |
| 06/27/1989 | US4842412 Exposure apparatus employed for fabricating printed circuit boards |
| 06/27/1989 | US4842373 Connecting structure for connecting a liquid crystal display and a flexible flat cable |
| 06/27/1989 | US4842184 Method and apparatus for applying solder preforms |
| 06/27/1989 | US4841857 Thin-film forming apparatus |
| 06/27/1989 | US4841633 Method of mounting electronic parts onto single-sided printed wiring board |
| 06/27/1989 | EP0313574A4 Potted electrical/mechanical devices, and dual cure potting method. |
| 06/27/1989 | CA1256628A1 Electrically conductive microspheres and compositions incorporating same |
| 06/27/1989 | CA1256589A1 Hermetic high frequency surface mount microelectronic package |
| 06/27/1989 | CA1256307A1 Apparatus for viewing printed circuit board having specular non-planar topography |
| 06/22/1989 | DE3804825A1 Gedaempfte magnetkopfaufhaengungsanordnung Steamed magnetkopfaufhaengungsanordnung |
| 06/22/1989 | DE3741918A1 Method for producing an electronic circuit device |
| 06/22/1989 | DE3741916A1 Method of curing polymer-based adhesives |
| 06/22/1989 | DE3741706A1 Method for producing spiral thin-film flat coils |
| 06/22/1989 | DE3741525A1 Electrical device |
| 06/22/1989 | DE3740741A1 Method for applying contact decks to a substrate |
| 06/21/1989 | EP0321446A2 Printed wiring board |
| 06/21/1989 | EP0321246A1 Joined ceramic-metal composite substrate and method for production thereof |
| 06/21/1989 | EP0321142A2 Soldering method using localized heat source |
| 06/21/1989 | EP0321067A1 Process for treating copper surface |
| 06/21/1989 | EP0320965A2 Thin-film coating method and apparatus therefor |
| 06/21/1989 | EP0320964A2 Thin-film coating apparatus |
| 06/21/1989 | EP0320601A2 Electroplating process |
| 06/20/1989 | US4841413 Snap on fuse cover |
| 06/20/1989 | US4841275 Thick-film integrated circuit device capable of being manufactured by means of easy-to-perform trimming operation |
| 06/20/1989 | US4841100 Expanding surface mount compatible retainer post |
| 06/20/1989 | US4841099 Electrically insulating polymer matrix with conductive path formed in situ |
| 06/20/1989 | US4840924 Method of fabricating a multichip package |
| 06/20/1989 | US4840923 Simultaneous multiple level interconnection process |
| 06/20/1989 | US4840853 Surface structure of AlN substrate and a process for producing the same |
| 06/20/1989 | US4840758 Methods of preparing molded thermoplastic articles wherein radio frequency energy is utilized to heat the thermoplastic material |
| 06/20/1989 | US4840709 Single-stage electrochemical image-forming process for reproduction layers |