Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/1989
09/12/1989US4866108 Blend of polyepoxide with polyamine curing agent
09/12/1989US4865954 Process for formation of metallic relief
09/12/1989US4865905 Article for protection of a substrate
09/12/1989US4865888 Supplying oxygen-containing gas bubbles through porous alkali resistant resin gas dispersing tube; printed circuits
09/12/1989US4865877 Method for roughening ceramic substrate surface and method for manufacturing printed circuit board using surface-roughened ceramic substrate
09/12/1989US4865873 Electroless deposition employing laser-patterned masking layer
09/12/1989US4865711 Surface treatment of polymers
09/12/1989US4865686 Eliminating a border portion from the expanded beam; spherical aberration is supressed
09/12/1989US4865654 Tin, lead; eutectic
09/12/1989US4865494 Numerically controlled machine for processing printed circuit boards
09/12/1989US4865448 Method and aparatus for observing the internal surface of a small hole
09/12/1989US4865241 Method and apparatus for subdividing into pieces a ceramic plate
09/12/1989US4864725 Gel encapsulant
09/12/1989US4864723 Electrical circuit modification method
09/12/1989US4864722 Low dielectric printed circuit boards
09/12/1989CA1259425A1 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape
09/12/1989CA1259168A1 Method of assembly of at least two components of ceramic material each having at least one flat surface
09/08/1989WO1989008375A1 New through-hole plated printed circuit board and process for manufacturing same
09/07/1989DE3806014A1 Method for producing a plastic layer
09/06/1989EP0331598A2 A method for producing a plurality of layers of metallurgy
09/06/1989EP0331429A2 A laminated printed circuit board and process for its manufacture
09/06/1989EP0331161A1 Method for fabricating multilayer circuits
09/06/1989EP0331022A2 Radiation induced pattern deposition
09/06/1989EP0331000A1 Use of polyacetals as complexing agents in the chemical deposition of copper, and process for the chemical deposition of copper
09/06/1989EP0330972A2 Autoclave laminating device for multilayered ciruit boards
09/06/1989EP0330922A1 Reflow process for circuit boards
09/06/1989EP0330909A2 Process for mounting parts on a printed-circuit board
09/06/1989EP0330895A2 Method for attaching electronic components to substrates, and arrangement for carrying it out
09/06/1989EP0330867A1 Fluxless application of a metal-comprising coating
09/06/1989EP0205461B1 Method of making an electrical terminal having a compliant retention section
09/06/1989CN1035410A Apparatus for continuously producing multilayer printed circuit board
09/06/1989CN1035409A Apparatus and method for manufacture of printed circuit prototypes
09/06/1989CN1035396A Process for manufacturing copper thick-film conductor by infrared stove
09/06/1989CN1035307A Process for improving adhesion to polyacetal articles
09/05/1989US4864471 Component for surface mounting and method for fastening a component for surface mounting
09/05/1989US4864418 Display unit for controlling pattern printing
09/05/1989US4864361 Screen printing machine
09/05/1989US4864259 Ladder-type electric filter circuit apparatus
09/05/1989US4864106 Heating resistor
09/05/1989US4864079 Electrical components and assemblies
09/05/1989US4863808 Undercutting resistance from gold and tin plating baths
09/05/1989US4863757 Printed circuit board
09/05/1989US4863630 Degreasing, cleaning compounds
09/05/1989US4863577 Desmearing and plated-through-hole method
09/05/1989US4863550 Alignment hole forming device for film laminating apparatus
09/05/1989US4863547 Equipment for heating and cooling substrates for coating photo resist thereto
09/05/1989US4863389 Terminal for connecting electronic components
09/05/1989US4862588 Method of making a flexible interconnect
09/05/1989CA1258990A1 Method and apparatus for coating of circuit boards
09/04/1989EP0228454A4 Compositions and methods for printed circuit board and/or printed wiring board cleaning and soldermask testing.
08/1989
08/31/1989DE3806263A1 Connection system for a telecommunications exchange
08/31/1989DE3805841A1 Verfahren zum bestuecken von bauelementetraegern mit bauelementen in oberflaechenmontagetechnik Method of fitting bauelementetraegern with components in oberflaechenmontagetechnik
08/31/1989DE3805121A1 Strain-relieved, especially tension-relieved and pressure-relieved soldered connection
08/31/1989DE3805076A1 Etching system
08/30/1989EP0330452A2 Electrically conductive pressure-sensitive adhesive tape
08/30/1989EP0330339A2 Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
08/30/1989EP0330210A2 Resistive metal layers and method for making same
08/30/1989EP0330115A2 Curable adhesive composition
08/30/1989EP0330113A1 Electrically conductive adhesive composition
08/30/1989EP0330059A2 Mixture polymerisable by radiation, and a recording material manufactured from it
08/30/1989EP0329973A1 Hot pressing dense ceramic sheets for electronic substrates and for multilayer ceramic electronic substrates
08/30/1989EP0329845A1 Process for the production of strongly adherent metallic structures on polyimide
08/30/1989EP0329823A2 Die attach pickup tools
08/30/1989EP0329808A1 Method and apparatus for cleaning freshly tinned circuit boards
08/30/1989EP0329807A1 Circuit for processing electrical printed-circuit boards
08/30/1989EP0329782A1 Digitizing tablet
08/30/1989CN1035102A Method of producing thin film patterns on glass substrate
08/29/1989US4862400 Microcomputer bus assembly
08/29/1989US4862323 Chip carrier
08/29/1989US4862247 Contact joint for semiconductor chip carriers
08/29/1989US4862153 Flat display panel with framing for flexible substrate folding
08/29/1989US4861967 Card controlled soldering iron temperature control device
08/29/1989US4861964 Laser scribing system and method
08/29/1989US4861941 Shielding device
08/29/1989US4861648 Multilayer; polymeric thermoplastic film, polymeric release layer, outer stabilizing metal foil and adhesive; absence of creases, gases and contaminants
08/29/1989US4861641 Substrates with dense metal vias
08/29/1989US4861640 Molded circuit board and manufacturing method therefor
08/29/1989US4861534 Method and apparatus for the injection molding of circuit boards
08/29/1989US4861438 Method of making patterns
08/29/1989US4861407 Meting or vaporization to form projections
08/29/1989US4861274 Backplane having a movable contact means
08/29/1989US4860939 Method for bonding a copper sheet to a substrate made of an electrically insulating material
08/29/1989US4860443 Ultrasonic welding between pads for attaching metallic conductors
08/29/1989US4860433 Method of manufacturing an inductance element
08/24/1989WO1989007878A1 Process for mounting components on component supports using surface mounting technology
08/24/1989WO1989007785A1 Coating compositions
08/24/1989WO1989007779A1 Method of fastening cylindrical optical parts and electric parts
08/24/1989DE3804487C1 Anode cage
08/23/1989EP0329484A2 Method of manufacturing ceramic laminate
08/23/1989EP0329459A2 Moulded chip carrier
08/23/1989EP0329421A2 Heating unit
08/23/1989EP0329417A2 Process for improving the adhesion to polyacetal articles
08/23/1989EP0329414A2 An improved circuit board
08/23/1989EP0329406A1 Metal coated laminate products made from textured polymide film
08/23/1989EP0329314A1 Uses of uniaxially electrically conductive articles
08/23/1989EP0329313A2 Laser patterning using a novel resist
08/23/1989EP0329237A1 Silk screen printing machine
08/23/1989EP0329133A2 Flip substrate for chip mount
08/23/1989EP0329009A2 Light-sensitive negative registration sheet
08/23/1989EP0328944A2 Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon