Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1989
08/23/1989EP0328907A1 Apparatus for etching work pieces
08/23/1989EP0219517B1 Thermoplastic soldering material, process and device
08/23/1989EP0187765B1 Process to increase the reliability of the metallization of borings in the production of multilayer printed circuits
08/22/1989US4860088 Electrical interconnect tape
08/22/1989US4859813 Digitizer tablet having electrical interconnect components on the writing substrate
08/22/1989US4859808 Electrical conductor having unique solder dam configuration
08/22/1989US4859807 Wire scribed circuit boards and method of manufacture
08/22/1989US4859806 Discretionary interconnect
08/22/1989US4859805 Printed wiring board
08/22/1989US4859571 Embedded catalyst receptors for metallization of dielectrics
08/22/1989US4859557 Reverse photographic process
08/22/1989US4859530 High temperature adhesive for polymide films
08/22/1989US4859505 Process for metallizing glass surface
08/22/1989US4859300 Process for treating plastics with alkaline permanganate solutions
08/22/1989US4859298 Process and apparatus for electrolytically removing protective layers from sheet metal substrate
08/22/1989US4859279 Method for prescribed, structured deposition of micro-structures with laser light
08/22/1989US4859271 Lamination apparatus having multiple book platens
08/22/1989US4859268 Method of using electrically conductive composition
08/22/1989US4859263 Process for the manufacture of printed circuits
08/22/1989US4859190 Dual connector printed circuit board assembly and method
08/22/1989US4859188 Wire/disk board-to-board interconnect device
08/22/1989US4858820 Desoldering aid and method
08/22/1989US4858816 Tin-soldering machine with automatic wave barrier for printed circuit boards
08/22/1989US4858527 Screen printer with screen length and snap-off angle control
08/22/1989US4858479 Methods and means for use in examining the quality of plated-through holes in circuit boards
08/22/1989CA1258723A1 Photosensitive conductive metal composition
08/22/1989CA1258717A1 Method for manufacture of printed circuit boards
08/17/1989DE3903245A1 Method and device for calibrating production systems for thick-film circuit patterns
08/17/1989DE3804070A1 Electroplating installation for printed-circuit boards
08/16/1989EP0328325A1 Laminar polymeric sheet
08/16/1989EP0328263A2 Catalyst for electroless plating
08/16/1989EP0327994A2 Modular programmer device with integrated interconnection to organize and transfer output contacts
08/16/1989EP0327838A2 Apparatus for the continuous making of printed circuits
08/16/1989CN1034841A Production method of printed circuit boards
08/15/1989US4858143 Work ordering routine for use in a method of routing
08/15/1989US4858077 Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board
08/15/1989US4858075 RF shielded and electrically insulated circuit board structure and method of making same
08/15/1989US4858073 Metal substrated printed circuit
08/15/1989US4858072 Interconnection system for integrated circuit chips
08/15/1989US4858071 Electronic circuit apparatus
08/15/1989US4858064 Thick-film high frequency signal circuit apparatus with feedthrough capacitor
08/15/1989US4857752 Parts recognition method and apparatus therefor
08/15/1989US4857671 Film carrier and bonding method using the film carrier
08/15/1989US4857482 Method of forming bump electrode and electronic circuit device
08/15/1989US4857400 Multilayer; thermoplastic resin, release agent, and stabilizer
08/15/1989US4857383 Synthetic substrate with adhesive metal layer
08/15/1989US4857382 Exposure to ultraviolet light
08/15/1989US4857381 Expanded porous polytetrafluoroethylene; for printed circuits
08/15/1989US4857143 Wet etching of cured polyimide
08/15/1989US4857135 Composite board press
08/15/1989US4857002 Terminator assembly for interconnecting computer devices
08/15/1989US4856400 Scoring cutter
08/15/1989US4856185 Method for fastening electronic components to a substrate using a film
08/15/1989US4856184 Method of fabricating a circuit board
08/10/1989WO1989007382A1 Three-dimensional circuit component assembly and method corresponding thereto
08/10/1989WO1989007339A1 Uses of uniaxially electrically conductive articles
08/10/1989WO1989007338A1 Uses of uniaxially electrically conductive articles
08/10/1989WO1989007337A1 Laser-machining polymers
08/10/1989WO1989007336A1 Laminar polymeric sheet
08/10/1989WO1989007162A1 Electrochemical processes
08/09/1989EP0327399A1 Method of manufacturing an uniaxially electrically conductive article
08/09/1989EP0327398A1 Laser-machining polymers
08/09/1989EP0327298A2 Apparatus for selectively coating part of a member
08/09/1989EP0327282A1 Stabilized azeotrope or azeotrope-like composition of 1,1,2-trichloro-1,2,2-trifluoroethane, methanol and 1,2-dichloroethylene
08/09/1989EP0327068A2 Substrate used for fabrication of thick film circuit
08/09/1989EP0326990A2 Thin-film coating apparatus
08/09/1989EP0326918A2 Process for metallising moulded articles of polyarylene sulfide
08/09/1989EP0326821A1 Apparatus for the treatment with radiation of circuit boards clad with surface-mounted component
08/09/1989EP0326655A1 Apparatus and process for electrophoretic deposition
08/09/1989EP0326577A1 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products.
08/09/1989EP0326571A1 Method and apparatus for producing a stamped substrate.
08/09/1989CN1004987B Process for producing coating copper-laminated for printed circuit boards
08/08/1989US4855872 Leadless ceramic chip carrier printed wiring board adapter
08/08/1989US4855792 Optical alignment system for use in photolithography and having reduced reflectance errors
08/08/1989US4855572 Heater for use as either primary or auxiliary heat source and improved circuitry for controlling the heater
08/08/1989US4855537 Wiring substrate having mesh-shaped earth line
08/08/1989US4855333 Multiple wire photosensitive adhesive for wire embedment
08/08/1989US4855084 Anthraquinoylcarboxylic acid hydrazides, curable compositions and use thereof
08/08/1989US4855012 Pull-raising member and pull-raising unit for peeling thin film
08/08/1989US4855002 Process of bonding surfaces employing/anaerobic aluminum filled compositions
08/08/1989US4854882 Floatable surface mount terminal
08/08/1989US4854230 Screen printing apparatus
08/08/1989US4854229 Screen printer apparatus
08/08/1989US4854081 Device for treating printed circuit boards, in particular for pumicing and trimming
08/08/1989US4854040 Copper solder pads, polymeric ink, overcoating with photoresists
08/08/1989US4854039 Prototype circuit board and method of testing
08/08/1989US4854038 Modularized fabrication of high performance printed circuit boards
08/08/1989US4854004 Device for clearing the hole blockage of a liquid resist substrate
08/03/1989DE3801610A1 Multiple connector
08/02/1989EP0326539A1 Vapor phase soldering using certain perfluorinated polyethers
08/02/1989EP0326516A2 Method of making patterns
08/02/1989EP0326499A1 Sintering process of conductors made of copper or copper-based alloys and of their cordierite ceramic substrate
08/02/1989EP0326321A2 Housing for electronic device
08/02/1989EP0326077A2 Circuit board
08/02/1989EP0325798A1 A metallic powder and a paste made from it, and a metallic powder manufacture device
08/02/1989EP0325660A1 Method of heat treatment of low melting -point metal
08/02/1989EP0202279B1 Process for encapsulating micro-electronic semi-conductor and layer-type circuits
08/02/1989CN1034463A Interconnection of electronic components
08/02/1989CN1034387A Azeotropic compositions of 1,1-dichloro-1-fluoroethane and methanol/ethanol
08/01/1989USRE33005 Electrical connector
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