Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1989
10/19/1989WO1989010005A1 Pre-formed chip carrier cavity package
10/19/1989WO1989009845A1 Azeotrope-like compositions of dichlorotrifluoroethane, methanol and nitromethane
10/19/1989WO1989009756A1 Ceramic-ceramic compounds, suitable for electrical applications
10/18/1989EP0337686A2 Semiconductor chip module
10/18/1989EP0337659A1 Solder post retention means
10/18/1989EP0337658A1 Selective plating by laser ablation
10/18/1989EP0337596A2 Electroconductive magnesia powder and process for preparation thereof
10/18/1989EP0337465A2 Process for producing printed circuit board
10/18/1989EP0337445A2 Laminar structure comprising organic material and inorganic material, methods for producing it and its use
10/18/1989EP0337412A2 Encapsulant composition
10/18/1989EP0337403A2 Photopolymerizable compositions
10/18/1989EP0337331A1 Method for producing an allround-shielded transmission line
10/18/1989EP0337149A2 Solder deposition tool
10/18/1989EP0336969A1 Flexible metal/plastic laminate and method and apparatus for manufacturing same
10/18/1989EP0112899B1 Solder bearing terminal pin
10/17/1989US4875138 Variable pitch IC bond pad arrangement
10/17/1989US4875087 Integrated circuit device having strip line structure therein
10/17/1989US4874930 Electroconductive film system for aircraft windows
10/17/1989US4874920 Electronic device manufacturing methods
10/17/1989US4874907 Printed circuit board
10/17/1989US4874799 Aqueous akaline developable, UV curable urethane acrylate compounds and compositions useful for forming liquid 100 percent solids, solvent-free solder mask coatings
10/17/1989US4874635 Method for removing residual precious metal catalyst from the surface of metal-plated plastics
10/17/1989US4874548 Conductive adhesive
10/17/1989US4874493 Method of deposition of metal into cavities on a substrate
10/17/1989US4874477 Applying polyelectrolyte; then dispersion of carbon black and dispersants; electroplating
10/17/1989US4874318 Mounting arangement for a chip carrier
10/17/1989US4874124 Process for carrying out the soldering of electronic components on a support
10/17/1989US4874081 Device for transferring printed circuit board
10/17/1989US4873764 Component mounting process for printed circuit boards
10/12/1989DE3906690A1 Ceramic plate for power semiconductor modules
10/12/1989DE3810633A1 Method and device for cutting equipment cards and printed, large-area circuit boards to length
10/11/1989EP0336869A2 A multilayered metallurgical structure for an electronic component
10/11/1989EP0336704A2 Polymethylpentene release sheet
10/11/1989EP0336659A2 Method and apparatus for applying flux to a substrate
10/11/1989EP0336604A2 Mixed aldehyde novolak resins and high contrast high thermal stability positive photoresists prepared therefrom
10/11/1989EP0336542A1 Process for the regeneration of a permanganate etchant bath
10/11/1989EP0336528A2 Automated discretionary bonding of multiple parallel elements
10/11/1989EP0336372A2 Moistureproof coating
10/11/1989EP0336283A2 Cathodically depositable electrodeposition paint
10/11/1989EP0336232A1 Method for dip-soldering printed-circuit boards
10/11/1989EP0336072A2 Base material of epoxy resin
10/11/1989EP0336059A1 A method of surface grinding of planar member
10/11/1989EP0336058A1 An apparatus for surface grinding of planar members
10/11/1989CN2045748U Control device structure for industrial sewing machine
10/11/1989CN1005443B Soft soldering appliance
10/10/1989US4873615 Semiconductor chip carrier system
10/10/1989US4873399 Ink-on-glass digitizer tablet and method of construction
10/10/1989US4873397 Electronic circuit element
10/10/1989US4873175 Light shielding electrodeposition in a transparent pattern
10/10/1989US4873169 Reacting naphthoquinone diazide sulfonic acid halide with mono- or polyvalent phenolic compound
10/10/1989US4873151 Aluminum nitride circuit substrate
10/10/1989US4873136 Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
10/10/1989US4873123 Forming circuit line having terminus with stress relief bend on low adhesion area of substrate
10/10/1989US4873122 With a wetting agent containing positively charged nitrogen atom and a compatible reducing agent
10/10/1989US4873022 Electrically conductive paste, electronic circuit component and method for producing same
10/10/1989US4872937 Electrical component and method of mounting same
10/10/1989US4872934 Bonding flexible circuits to copper sheets, forming conductors, etching circuit patterns
10/10/1989US4872846 Solder containing electrical connector and method for making same
10/10/1989US4872844 Component-carrying adapter for chip carrier socket
10/10/1989US4872788 Multi-spindel drilling machine
10/10/1989US4872787 Method of drilling printed circuit board
10/10/1989US4872604 Heated tool with stop mechanism
10/10/1989US4872381 Programmable magnetic repulsion punching apparatus
10/10/1989US4872261 Method of and apparatus for surface mounting electronic components onto a printed wiring board
10/10/1989CA1262295A1 Uv curable silicone rubber compositions
10/10/1989CA1262292A1 Method of making microwave integrated circuits
10/05/1989WO1989009534A1 Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier
10/05/1989WO1989009131A1 Electrostatic pick-up of master retained on web
10/05/1989DE3810370A1 Method for producing electrical connections
10/05/1989DE3810151A1 Printing template (stencil)
10/05/1989DE3809972A1 Method for transmitting information signals between modules, especially between plug-in modules of a communications system
10/05/1989DE3809955A1 Lampholder for a miniature filament lamp
10/05/1989DE3808704A1 Contact lug for busbar systems on printed circuit boards
10/04/1989EP0335783A1 Casing for an electronic circuit
10/04/1989EP0335683A2 Electroplated alloy coatings having stable alloy composition
10/04/1989EP0335679A2 Bonded ceramic-metal composite substrate, circuit board constructed therewith and methods for production thereof
10/04/1989EP0335629A2 Process for preparing photocured coatings
10/04/1989EP0335565A2 Process for producing printed wiring board
10/04/1989EP0335420A2 Electrical and mechanical joint construction between a printed wiring board and a lead pin
10/04/1989EP0335330A2 Electrodeposition coating process of photoresist for printed circuit board
10/04/1989EP0335281A2 Method of making user adapted printed circuit boards
10/04/1989EP0335249A2 Electrical connector
10/04/1989EP0335220A2 Positive-working light-sensitive mixture and recording material of high thermal stability prepared therefrom
10/04/1989EP0335160A2 Plug connector with angular contact pins to be pushed into the holes of a printed circuit
10/03/1989US4871651 Cryogenic process for metal lift-off
10/03/1989US4871595 Polybenzobisthiazoles
10/03/1989US4871585 Masking with water-swellable rubber, immersion in water bath
10/03/1989US4871584 Process of coating and drying both sides of printed circuit boards
10/03/1989US4871583 Housing for an electronic device
10/03/1989US4871435 Electroplating apparatus
10/03/1989US4871429 Limiting tin sludge formation in tin or tin/lead electroplating solutions
10/03/1989US4871418 Etching of polyoxymethylene glycol substrate which has patterned photoresist coating
10/03/1989US4871324 Backplane for supporting removable modular
10/03/1989US4871319 Molded circuit board for ribbon cable connector
10/03/1989US4871317 Surface mounted component adaptor for interconnecting of surface mounted circuit components
10/03/1989US4871110 Method and apparatus for aligning solder balls
10/03/1989US4871109 Vapor phase soldering using certain perfluorinated polyethers
10/03/1989US4871105 Method and apparatus for applying flux to a substrate
10/03/1989US4870865 Device for testing formation of connection
10/03/1989US4870751 Nucleation, ablation