Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/1989
10/03/1989US4870746 Method of making a multilayer printed circuit board having screened-on resistors
10/03/1989CA1262073A1 Process for preparing printing forms
10/03/1989CA1262070A1 Irradiation cross-linkable thermostable polymer system, for microelectronic applications
09/1989
09/28/1989DE3908514A1 Method for removing organic and inorganic residues in a soldering process
09/28/1989DE3904542A1 Contact device
09/28/1989DE3809140A1 Apparatus for forming stacks of material blanks of different materials
09/27/1989EP0334657A2 Method of surface treatment of copper foil or copper clad laminate for internal layer
09/27/1989EP0334397A2 Circuit board
09/27/1989EP0334384A1 Incombustible azeotropic like solvent compositions
09/27/1989EP0333995A2 An apparatus of chamfering planar plate
09/27/1989EP0333994A2 A method of chamfering planar plate
09/27/1989EP0333744A1 Method and apparatus for manufacturing printed circuit boards.
09/27/1989EP0333722A1 Sheet material coated with pressure-sensitive adhesive.
09/27/1989CN1035930A Method for manufacturing printed circuit board
09/26/1989US4870701 Connecting structure of diodes
09/26/1989US4870286 Electron beam direct drawing device
09/26/1989US4870225 Mounting arrangement of chip type component onto printed circuit board
09/26/1989US4870224 Integrated circuit package for surface mount technology
09/26/1989US4869970 Radiation attenuation shielding
09/26/1989US4869930 Printed circuits
09/26/1989US4869926 Method of production galvanically deposited aluminum layers for use as contacts of microcircuits
09/26/1989US4869798 Elongated housing enclosing the trace, sealed at the edges containing electrodes and having electrolyte and rinsing fluid pass through; automatic; accuracy
09/26/1989US4869778 Method of forming a patterned aluminum layer and article
09/26/1989US4869767 Process for placing single or multiple patterned layers of conductive material on a substrate
09/26/1989US4869671 Electrical connector for printed circuit board
09/26/1989US4869626 High speed drilling spindle
09/26/1989US4869625 Combination drilling and skiving tool
09/26/1989US4869418 Solder leveling method and apparatus
09/26/1989US4869198 Vacuum debubbler machine
09/26/1989US4868980 Method of designing and manufacturing circuits using universal circuit board
09/26/1989EP0242369A4 Surface mountable integrated circuit packages having solder bearing leads.
09/26/1989CA1261975A1 Solder joint
09/26/1989CA1261481A1 Printed circuit board capable of preventing electromagnetic interference
09/26/1989CA1260882A1 Fused eyeletting machine
09/26/1989CA1260810A1 Fluorescent solder paste mixture
09/26/1989CA1260625A1 Multilayer printed circuit board with domain partition
09/26/1989CA1260624A1 Unidirectional conduction metal to metal adhesive
09/26/1989CA1260623A2 Flexible cable assembly
09/26/1989CA1260337A1 Secondary metallization by glass displacement in ceramic substrate
09/26/1989CA1260266A1 Method for creating a design in relief in a hard smooth substrate and apparatus for use in the method
09/26/1989CA1260239A1 Extractor tool for printed circuit cards
09/26/1989CA1260158A1 Mounting structure and method for surface mounted type components
09/26/1989CA1260157A1 Electrical circuit fabrication apparatus and method
09/26/1989CA1260098A1 Solder-bearing leads
09/26/1989CA1259947A1 Laser-enhanced jet-plating and jet-etching: high speed maskless patterning method
09/26/1989CA1259946A1 Forming ceramic tiles by electrodeposition on anodized support
09/21/1989WO1989008975A1 Interconnection mechanisms for electronic components
09/21/1989WO1989008926A1 Vernier structure for flip chip bonded devices
09/21/1989WO1989008923A1 Method of producing laminated ceramic electronic parts
09/21/1989WO1989008908A1 Led display module
09/21/1989DE3843230C1 Process for making a metallic pattern on a base, in particular for the laser structuring of conductor tracks
09/21/1989DE3807892A1 SMD radio-frequency transformer for wave soldering
09/21/1989DE3806884C1 Through-plated contact printed circuit and method for fabricating it
09/20/1989EP0333550A1 Process for producing printed circuits on a three-dimensional plastic carrier, and carrier so equipped
09/20/1989EP0333374A2 Edge-mounted, surface-mount package for semiconductor integrated circuit devices
09/20/1989EP0333252A2 Process for making metallized holes in a dielectric substrate by vacuum deposition of metals and the product obtained thereby
09/20/1989EP0333237A2 Integrated circuit chip carrier
09/20/1989EP0333160A2 Laminated board for testing electronic components
09/20/1989EP0332948A2 Process for manufacturing high temperature resistant metal layers on ceramic surfaces
09/20/1989EP0332889A2 Method of constructing a high performance printed circuit board assembly
09/20/1989EP0332880A2 Process for the production of metal toners
09/20/1989EP0332834A1 Low dielectric printed circuit boards
09/20/1989EP0200732B1 Production of a matte surface om a metal layer
09/19/1989US4868637 Mixture of dielectric polymer and conductive particles; becomes conductive when concentrated by pressure to decrease spacing between particles
09/19/1989US4868492 Method for contactless testing of conducting paths in a substrate using photo-assisted tunneling
09/19/1989US4868350 High performance circuit boards
09/19/1989US4868253 Substrate for electroless metal plating
09/19/1989US4868252 Dispersion with fluoroacrylic ester
09/19/1989US4868094 Electrical and optical properties
09/19/1989US4868071 Thermally stable dual metal coated laminate products made from textured polyimide film
09/19/1989US4868068 IC wiring connecting method and resulting article
09/19/1989US4868049 Selective metallic transfer foils for xerographic images
09/19/1989US4868047 Printed wiring board
09/19/1989US4868008 Copper sulfide
09/19/1989US4868007 Method and apparatus for forming a thick film integrated circuit
09/19/1989US4867843 Ammonium fluoride, ammonium sulfate, sulfuric acid, water and sodium hydroxide
09/19/1989US4867839 Process for forming a circuit substrate
09/19/1989US4867800 Cleaning composition of terpene compound and dibasic ester
09/19/1989US4867235 Composite heat transfer means
09/19/1989CA1259528A1 Metalized substrates and process for producing
09/19/1989CA1259514A1 Photosensitive ceramic coating composition
09/14/1989DE3807618A1 Epoxy resin base material
09/14/1989DE3807617A1 Epoxy resin base material
09/14/1989DE3806984A1 Method for separating a printed circuit board blank
09/14/1989DE3806753A1 Soldering and/or hardening apparatus
09/13/1989EP0332567A1 Infra-red soldering oven for fusing electronic components on printed-circuit boards
09/13/1989EP0332561A2 Low Dielectric composite substrate
09/13/1989EP0332559A2 Method of manufacturing a substrate for carrying and electrically interconnecting electronic devices
09/13/1989EP0332531A2 Tool changer
09/13/1989EP0332457A2 Multilayered ceramic substrates and method for manufacturing of the same
09/13/1989EP0332411A2 Chip type capacitor and manufacturing thereof
09/13/1989EP0332206A2 Method and apparatus for removing a protection sheet
09/13/1989EP0331965A2 Blends of poly(arylene sulfides), organic carbonates, further thermoplasts and glassfibers
09/13/1989EP0331909A1 High performance circuit boards
09/13/1989EP0331818A1 Method for obtaining electrical interconnect using a solderable mechanical fastener
09/13/1989EP0331718A1 Multiple electrode plasma reactor power distribution system
09/13/1989EP0331684A1 Process for fabricating multilayer circuit boards
09/12/1989US4866571 Semiconductor package
09/12/1989US4866506 Plastic-sealed IC device of heat-resistant construction
09/12/1989US4866217 Bus bar circuit board structure
1 ... 1082 1083 1084 1085 1086 1087 1088 1089 1090 1091 1092 1093 1094 1095 1096 1097 1098 1099 1100 1101 1102 ... 1185