Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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11/15/1989 | EP0342085A1 Electric connector and printed circuit comprising such a connector |
11/15/1989 | EP0341944A2 Improvements in or relating to methods of and apparatus for registration |
11/15/1989 | EP0341848A2 Optical alignment system for use in photolithography and having reduced reflectance errors |
11/15/1989 | EP0341806A2 Apparatus for inspecting circuit boards with surface mounted components |
11/15/1989 | EP0341629A2 Printed circuit board and a method of recognizing the position of surface mounted parts |
11/15/1989 | EP0341465A1 Composition and process for etching and activating insulating surfaces |
11/15/1989 | EP0341458A1 Double-sided board circuit |
11/14/1989 | US4880959 Process for interconnecting thin-film electrical circuits |
11/14/1989 | US4880684 Sealing and stress relief layers and use thereof |
11/14/1989 | US4880683 Wound upon itself for conuenient storage |
11/14/1989 | US4880663 Method for applying a moistureproof insulative coating to printed circuit boards using triangular or dovetail shaped liquid films emitted from a flat-pattern nozzle |
11/14/1989 | US4880589 A homopolymer or copolymer of 4-methylpentene |
11/14/1989 | US4880570 Glycidylaminophenyl resin and glycidyl phenolic resins, silver flakes |
11/14/1989 | US4880489 Apparatus for plasma etching circuit boards or the like |
11/14/1989 | US4880486 Method for mounting electronic parts |
11/14/1989 | US4880349 Method for locating and supporting ceramic substrates |
11/14/1989 | US4879968 Separating device for trimming the width of a poured curtain of coating material |
11/08/1989 | EP0340997A2 Electrically insulating polymer matrix with conductive path formed in situ |
11/08/1989 | EP0340513A1 Metallising process |
11/08/1989 | EP0340392A2 Beta-diketo-compound-polymer reaction product and use thereof |
11/08/1989 | EP0340376A1 Electric circuit for electronic machines, printed by means of a silk-screen process onto a polyester film with a multi-layered structure |
11/08/1989 | EP0340275A1 Vapour phase process and apparatus |
11/08/1989 | EP0340241A1 High density electronic package comprising stacked sub-modules. |
11/08/1989 | CN1037041A Process for preparing photocured coatings |
11/07/1989 | USRE33108 Photoresists |
11/07/1989 | US4879630 Housing for an electronic circuit |
11/07/1989 | US4879261 Ceramics, dielectrics, silica, zinc borate flux |
11/07/1989 | US4879184 Method of high resolution of electrostatic transfer of a high density image to a receiving substrate |
11/07/1989 | US4879156 Multilayered ceramic substrate having solid non-porous metal conductors |
11/07/1989 | US4879007 Shield for plating bath |
11/07/1989 | US4878993 Method of etching thin indium tin oxide films |
11/07/1989 | US4878851 Electrical socket apparatus with temporary housing |
11/07/1989 | US4878738 Electro-optical device |
11/07/1989 | US4878611 Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate |
11/07/1989 | US4878315 Griding guide and method |
11/07/1989 | US4878294 Electroformed chemically milled probes for chip testing |
11/07/1989 | EP0290598A4 Ceramic/organic multilayer interconnection board. |
11/07/1989 | CA1262778A1 Method for producing circuit boards with deposited metal patterns and circuit boards produced thereby |
11/02/1989 | WO1989010680A1 Machine for cleaning and/or rinsing holes in printed circuit boards |
11/02/1989 | WO1989010431A1 Process and composition for preparing printed circuit through-holes for metallization |
11/02/1989 | WO1989010339A1 Ceramic plate (substrate) coated on at least one side with metal |
11/02/1989 | WO1989010230A1 Wavesoldering device and procedure |
11/02/1989 | EP0340116A2 Electrical contact stabilizer assembly |
11/02/1989 | EP0339881A1 Method of making a ciccuit board |
11/02/1989 | EP0339871A2 Corrosion tolerant bonding pad and method of fabricating same |
11/02/1989 | EP0339701A1 Flexible circuit and connector |
11/02/1989 | EP0339653A1 Matrix switching device and method of manufacturing the same |
11/02/1989 | EP0339570A2 Thin film peeling apparatus |
11/02/1989 | EP0339154A2 Memory card |
11/02/1989 | EP0339020A1 Method of patterning resist for printed wiring board. |
11/02/1989 | DE3817879A1 Mounting plate |
11/02/1989 | DE3813566A1 Electrical connection between a hybrid assembly and a printed circuit board, and a method for its production |
11/02/1989 | DE3813565A1 Electrical connection of hybrid assemblies |
11/02/1989 | DE3813518A1 Maschine zum reinigen und/oder spuelen von bohrungen in leiterplatten Machine for cleaning and / or spook of holes in printed circuit boards |
11/02/1989 | DE3810716A1 Holder for flat components |
11/01/1989 | CN1036791A Stabilized azeotrope or azeotrope-like composition of 1,1,2-trichloro-1,2,2-trifluoroethane, methanol and 1,2-dichloroethylene |
10/31/1989 | US4878155 High speed discrete wire pin panel assembly with embedded capacitors |
10/31/1989 | US4878152 Compressed graphite sheet sandwiched between two thin layers of carbon fibers embedded in resin matrix |
10/31/1989 | US4878070 Thermal ink jet print cartridge assembly |
10/31/1989 | US4877936 Soldered structure of fine wire, and method of and apparatus for soldering fine wire |
10/31/1989 | US4877647 Method of coating substrates with solvated clusters of metal particles |
10/31/1989 | US4877644 Selective plating by laser ablation |
10/31/1989 | US4877565 Method of manufacturing circuit component such as stator for variable resistor |
10/31/1989 | US4877545 For cleaning printed circuit boards |
10/31/1989 | US4877493 Dielectric block plating process |
10/31/1989 | US4877481 Patterning method by laser scribing |
10/31/1989 | US4877450 Formaldehyde-free electroless copper plating solutions |
10/31/1989 | US4877326 Method and apparatus for optical inspection of substrates |
10/31/1989 | US4877176 Soldering pins into printed circuit boards |
10/31/1989 | US4877175 Laser debridging of microelectronic solder joints |
10/31/1989 | CA1262577A1 Process for preparing multilayer printed circuit boards |
10/31/1989 | CA1262576A1 Porous bottom-layer dielectric composite structure |
10/31/1989 | CA1262518A1 Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein |
10/31/1989 | CA1262517A1 Process for metalizing non-conductive substrates |
10/26/1989 | DE3830636C1 Baseplate for producing metallised holes in printed circuit boards or substrates, and a method for producing the baseplate |
10/25/1989 | EP0338717A2 A connector assembly |
10/25/1989 | EP0338641A1 Method of mounting optical elements on a support and optical circuit obtained in this way |
10/25/1989 | EP0338447A2 Device for dissipating heat of components on a printed-circuit board |
10/25/1989 | EP0338286A1 Process for metallising a polyimide sheet on both surfaces |
10/25/1989 | EP0338232A2 Method for mounting a flexible film electronic device carrier on or for separating it from a substrate |
10/25/1989 | EP0338190A2 Process for manufacturing an airgap isolated crossing and device |
10/25/1989 | EP0338150A1 A method of producing electronic basic blocks with a high degree of compaction and basic blocks produced according to method |
10/25/1989 | EP0337986A1 Multilayer circuit board fabrication process. |
10/25/1989 | EP0277148A4 Method for manufacture of printed circuit boards. |
10/25/1989 | CN1036682A Soldering apparatus of reflow type |
10/24/1989 | US4876437 Soldering apparatus |
10/24/1989 | US4876322 Irradiation cross-linkable thermostable polymer system, for microelectronic applications |
10/24/1989 | US4876177 Process for producing printed circuit board |
10/24/1989 | US4876120 Tailorable multi-layer printed wiring boards of controlled coefficient of thermal expansion |
10/24/1989 | US4876119 Method of coating a nitride ceramic member |
10/24/1989 | US4875982 Plating high aspect ratio holes in circuit boards |
10/24/1989 | US4875973 Hydrogen peroxide compositions containing a substituted aminobenzaldehyde |
10/24/1989 | US4875972 For etching printed circuit boards |
10/24/1989 | US4875869 Backplane with associated handling means |
10/24/1989 | US4875862 Surface mountable connector |
10/24/1989 | US4875283 Method for manufacturing printed circuit boards |
10/24/1989 | US4875282 Method of making multilayer printed circuit board |
10/24/1989 | US4875279 Die attach pickup tools |
10/24/1989 | CA1262494A2 Routing fixture for producing a wired circuit board |
10/19/1989 | WO1989010048A1 Apparatus for processing planar printed circuit boards |