Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/1989
12/13/1989EP0345809A1 Ceramic laminated circuit substrate, method for making same and use of the substrate
12/13/1989EP0345508A2 Method of making multilayer printed-circuit boards
12/13/1989EP0345427A2 Circuit support for electrical components, e.g. circuit foils, boards or the like
12/13/1989EP0345340A1 Photoimageable compositions.
12/13/1989CN1038007A Device and methd for wave soldering
12/13/1989CN1037997A Solder post retention means
12/13/1989CN1037920A Stabilized azeotrope or azeotrope-like composition
12/13/1989CN1037905A Urethane acrylate compounds and compositions
12/12/1989US4887030 Testing device for electrical circuit boards
12/12/1989US4887005 Multiple electrode plasma reactor power distribution system
12/12/1989US4886942 Strain relief structure for connecting flat flexible cable to a circuit board
12/12/1989US4886681 Concurrent radiation and vapor phase decomposition of metal
12/12/1989US4886644 Liquid degaser in an ebullated bed process
12/12/1989US4886627 Polyorganoetheroacetylenes exposed to radiation of high energy density
12/12/1989US4886573 Process for forming wiring on substrate
12/12/1989US4886461 Zero insertion force electrical connector
12/12/1989US4885841 Vibrational method of aligning the leads of surface-mount electronic components with the mounting pads of printed circuit boards during the molten solder mounting process
12/12/1989CA1263896A1 Wave solder finger shield apparatus
12/07/1989DE3844310A1 Holder for free-standing (exposed) electronic components
12/07/1989DE3818800A1 Process for introducing profiled patterns (profile patterns) onto or into surfaces whose cross-sections are parts of a circle (semicircle) or another geometrical figure, by using the single-stage or multi-stage photo-etching technique (ProMus process)
12/07/1989DE3817543A1 Maschine zum behandeln von gegenstaenden mit einer behandlungsfluessigkeit Machine for treating articles with a behandlungsfluessigkeit
12/07/1989DE3817542A1 Maschine zum behandeln von gegenstaenden mit einer behandlungsfluessigkeit Machine for treating articles with a behandlungsfluessigkeit
12/06/1989EP0344719A2 Electric circuit device
12/06/1989EP0344504A2 Article comprising a polyimide and a metal layer and methods of making such articles
12/06/1989EP0344160A1 Process and device for the electrolytic dip-coating of plates, in particular electric printed circuit boards
12/06/1989CN2049065U Full film plane combined switch
12/05/1989US4885662 Circuit module connection system
12/05/1989US4885604 Exposure apparatus
12/05/1989US4885431 Printed circuit board
12/05/1989US4885126 Interconnection mechanisms for electronic components
12/05/1989US4885053 Etching ceramic substrate by applying organic alkali or alkaline earth compound; for surface roughness before plating
12/05/1989US4885038 Coating conductor with polymer which decomposes upon heating
12/05/1989US4885036 For removal of manganese dioxide precipitates from cleaning solution for printed circuit boards
12/05/1989US4884983 Resolderable electrical connector
12/05/1989US4884738 Method and apparatus for brazing surface components onto a printed circuit board
12/05/1989US4884337 Method for temporarily sealing holes in printed circuit boards utilizing a thermodeformable material
12/05/1989US4884335 Surface mount compatible connector system with solder strip and mounting connector to PCB
12/05/1989CA1263763A1 Printed circuit with chromium adhesion layer
12/05/1989CA1263561A1 Silk-screen printing method
11/1989
11/30/1989WO1989011779A1 Machine for treating objects with a treating liquid
11/30/1989WO1989011777A1 Machine for treating objects with a treating liquid
11/30/1989DE3915777A1 Elektrischer steckverbinder Electrical connectors
11/30/1989DE3817267A1 Leiterplatte Circuit board
11/30/1989DE3816614A1 Method and device for coating printed circuit board assemblies
11/29/1989EP0343862A1 Method of forming a sealed electrical connector
11/29/1989EP0343771A1 Transmission line
11/29/1989EP0343761A1 Stabilized azeotrope or azeotrope-like composition
11/29/1989EP0343616A2 System for soldering printed circuits
11/29/1989EP0343379A2 Thin film package for mixed bonding of a chip
11/29/1989EP0343377A1 Method of creating an assembly of preforms to repair conducting paths, and apparatus for carrying out the method
11/29/1989EP0343376A1 Method of making solder-coated preforms to upset interruptions in conducting paths
11/29/1989EP0343375A1 Method for cancelling of conductive-path interruptions
11/29/1989EP0343374A1 Method of cancelling interruptions in conducting paths by means of a congruent element
11/29/1989EP0209748B1 Process for chemically treating ceramic work pieces for subsequent metallization
11/29/1989CN1005960B Apparatus for automatically mounting core electronic circuit elements on substrate
11/29/1989CN1005959B Auto-assembling apparatus for special types of circuit elements on boards
11/29/1989CN1005946B Electron device and its manufacturing method
11/29/1989CN1005944B Electronic device and its manufacturing method
11/28/1989US4884170 Multilayer printed circuit board and method of producing the same
11/28/1989US4884125 Hybrid integrated circuit device capable of being inserted into socket
11/28/1989US4883920 Chip type component installation structure
11/28/1989US4883744 Forming a polymide pattern on a substrate
11/28/1989US4883718 Flexible copper-clad circuit substrate
11/28/1989US4883704 Aluminum nitrides, ceramics
11/28/1989US4883575 Apparatus for continuously producing a base for a printed circuit board
11/28/1989US4883571 Process for preparing a printed-circuit board
11/28/1989US4883435 Solder-bearing terminal pin and lead
11/28/1989US4883214 Heated tool with heated support
11/28/1989US4882839 Method of manufacturing multi-layered wiring substrate
11/28/1989CA1263480A1 Elongated frame for releasably-holding printed circuit boards
11/28/1989CA1263460A1 Electronic package assembly and accessory component therefor
11/27/1989EP0312551A4 Additive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresists.
11/23/1989EP0342961A2 Light-emitting diode assembly
11/23/1989EP0342840A2 Urethane acrylate compounds and solder masks
11/23/1989EP0342669A2 Method for preparing thin copper foil-clad substrate for circuit boards
11/23/1989EP0342621A1 Immersion process and apparatus for electroplating boards, particularly electric printed-circuit boards
11/23/1989EP0342594A2 An optical semiconductor device
11/23/1989EP0342393A2 Process for forming a polyimide pattern on a substrate
11/23/1989DE3829508A1 Process for treating articles in chemical or electrochemical baths
11/21/1989US4882656 Surface mounted decoupling capacitor
11/21/1989US4882650 Capacitors
11/21/1989US4882612 Power semiconductor device
11/21/1989US4882550 Oscillator/amplifier connecting structure
11/21/1989US4882454 Thermal interface for a printed wiring board
11/21/1989US4882245 Photoresist composition and printed circuit boards and packages made therewith
11/21/1989US4882202 Use of immersion tin and tin alloys as a bonding medium for multilayer circuits
11/21/1989US4882200 Method for photopatterning metallization via UV-laser ablation of the activator
11/21/1989US4882199 Method of forming a metal coating on a substrate
11/21/1989US4882026 Dielectric block plating apparatus
11/21/1989US4882000 Method of manufacturing printed circuit boards
11/21/1989US4881908 High density and high signal integrity connector
11/21/1989US4881906 Method for obtaining electrical interconnect using a solderable mechanical fastener
11/21/1989US4881320 Method of making vented seal for electronic components and an environmentally protected component
11/21/1989CA1263196A1 Method to ensure the cooling of electronic components fixed on a multilayer for printed circuits and multilayer realized according to said method
11/16/1989WO1989011209A1 Circuit writer
11/16/1989WO1989011114A1 Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
11/16/1989WO1989010985A1 Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
11/16/1989WO1989010984A1 Azeotrope-like compositions of 1,1-dichloro-1-fluoroethane and methanol
11/16/1989DE3815736A1 Multilayer circuit board
11/16/1989DE3814486A1 Keramische platte (substrat) die wenigstens einseitig mit metall beschichtet ist Ceramic plate (substrate) is at least one side coated with metal
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