Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
01/1990
01/09/1990US4893001 IC card
01/09/1990US4892798 Electrophoretic imaging metal-toner fluid dispersion
01/09/1990US4892776 Circuit board material and electroplating bath for the production thereof
01/09/1990US4892764 Fiber/resin composites, and method of making the same
01/09/1990US4892703 Surface structure of A1N substrate and a process for producing the same
01/09/1990US4892607 Chip mounting techniques for display apparatus
01/09/1990US4892487 Connector assembly with movable carriage
01/09/1990CA1264360A1 Self-heating, self-soldering bus bar
01/09/1990CA1264278A1 Process for producing copper-laminated base material for printed circuit boards
01/08/1990EP0331684A4 Process for fabricating multilayer circuit boards.
01/08/1990EP0269679A4 Electrical circuit interconnection.
01/04/1990DE3920686A1 Busbar printed circuit board
01/04/1990DE3822431A1 Holding device for optical waveguides
01/04/1990DE3822214A1 Separating device
01/03/1990EP0349460A2 Method and apparatus for the injection molding of circuit boards
01/03/1990EP0349161A2 Printed wiring board fabrication method
01/03/1990EP0348954A2 Electrical connection arrangement for flat cable
01/03/1990EP0348860A2 Punch press for piercing green sheet with liner
01/03/1990EP0348755A2 Novel photocurable and heat-curable polyvinyl butyral resin
01/03/1990EP0348752A1 Device and process for cleaning and treating horizontally moving circuit boards
01/03/1990EP0348632A2 Processing of cores for circuit boards or cards
01/03/1990EP0348562A1 High-density contact area electrical connectors
01/03/1990CN2050626U Full digital automatic controlled printed substrate etching machine
01/03/1990CN1006356B Millite ceramic multi-layered substrate and process for producing same
01/02/1990US4891711 Document reader for a digital copier
01/02/1990US4891616 Parallel planar signal transmission system
01/02/1990US4891496 Heated tool with multiple heating surfaces
01/02/1990US4891472 Interconnects on a printed circuit board having connecting points for an electronic component with a plurality of terminals
01/02/1990US4891259 Multilayer systems and their method of production
01/02/1990US4891254 Detector, high temperature resistant carrier, protective coating
01/02/1990US4891246 Controlled atmosphere firing process
01/02/1990US4891242 Integrated circuits
01/02/1990US4891069 Catalyst for reduction of metal compound by generated hydrogen
01/02/1990US4891014 Method of forming contact bumps in contact pads
01/02/1990US4890783 Ceramic-metal joining
01/02/1990US4890727 Method and apparatus for plating through holes in graphite composites
01/02/1990US4890383 Method for producing displays and modular components
01/02/1990US4890381 Contacting device and method for connecting a conductive foil
12/1989
12/28/1989WO1989012899A1 Substrates with dense metal vias
12/28/1989WO1989012871A1 Manufacturing portable electronic tokens
12/28/1989WO1989012550A1 Multiaxially oriented thermotropic polymer substrate for printed wire board
12/28/1989WO1989012548A1 Film-based structural components with controlled coefficient of thermal expansion
12/28/1989EP0331718A4 Multiple electrode plasma reactor power distribution system.
12/28/1989DE3821473A1 Arrangement for connecting electronic modules and components
12/28/1989DE3821303A1 Method and system for producing metal-core printed circuit boards which are coated with a dielectric
12/28/1989DE3820976A1 SMD inductor or transformer
12/27/1989EP0348062A1 Polymeric films
12/27/1989EP0347974A2 Mount for electronic parts
12/27/1989EP0347936A2 Continuous production of laminated sheet
12/27/1989EP0347824A2 A thick film forming process
12/27/1989EP0347616A1 Photosensitive aqueous developable ceramic coating composition
12/27/1989EP0347615A1 Photosensitive semi-aqueous developable ceramic coating composition
12/27/1989EP0347561A2 Separable electrical connection
12/27/1989EP0347430A1 Production of copper-clad dielectric material
12/27/1989CN1006273B Apparatus and method for installing circuit components on printed circuit board
12/26/1989US4890194 A chip carrier and mounting structure connected to the chip carrier
12/26/1989US4890157 Integrated circuit product having a polyimide film interconnection structure
12/26/1989US4890152 Plastic molded chip carrier package and method of fabricating the same
12/26/1989US4889962 Electrically insulative substrate with a groove having a plating of conductive material
12/26/1989US4889961 Graphite trace electrical interconnect
12/26/1989US4889790 Method of forming a conformable mask on a printed circuit board
12/26/1989US4889585 Method for selectively forming small diameter holes in polyimide/Kevlar substrates
12/26/1989US4889584 Masking, electroplating
12/26/1989US4889573 Detaching coating material from carrier foil
12/26/1989US4889496 Compressible core electrical connector
12/26/1989US4889277 Method and apparatus for surface mounting terminals
12/26/1989US4889275 Method for effecting solder interconnects
12/26/1989US4889070 System for the treatment of edge supported substrates
12/20/1989EP0347058A2 Method for applying a moistureproof coating to printed circuit boards
12/20/1989EP0346997A2 Apparatus for the automatic separation along predetermined bending fracture lines in basic ceramic platelets of hybrid electronic circuits
12/20/1989EP0346888A1 Tin whisker-free tin or tin alloy plated article and coating technique thereof
12/20/1989EP0346655A1 An improved method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
12/20/1989EP0346617A2 Formation of metallic interconnects by grit blasting
12/20/1989EP0346525A2 Multilayer electronic circuit and method of manufacture
12/20/1989EP0346522A2 Printed wiring board
12/20/1989EP0346486A1 Resin composition and solder resist resin composition
12/20/1989EP0346355A1 Photopatternable composite.
12/19/1989US4888574 Electrodepositing nickel-phosphorous from a plating bath free of sulfate and chloride salt
12/19/1989US4888488 Exposing apparatus used in fabrication of printed circuit boards
12/19/1989US4888450 Circuit board fabrication leading to increased capacity
12/19/1989US4888269 Resin composition for solder resist ink
12/19/1989US4888209 Depositing layer of cationic polymer particles containing catalyst dispersed within on printed circuit board for electroless metal deposition
12/19/1989US4888208 Ceramic substrate for printed circuits and production thereof
12/19/1989US4888200 Process and machine for electrostatic coating
12/19/1989US4888083 Laminator
12/19/1989US4888080 Projected press device for raising film
12/19/1989US4887760 Bonding sheet for electronic component and method of bonding electronic component using the same
12/19/1989US4887544 Vacuum well process
12/19/1989US4887353 Conduction cooled module connector system and method of making
12/19/1989EP0268643A4 Electrical circuit interconnection.
12/14/1989WO1989012071A1 Amorphous copolymers or perfluoro-2,2-dimethyl-1,3-dioxole
12/14/1989WO1989011918A1 Treating an autodeposited coating with an alkaline material
12/14/1989DE3819851A1 Electrical component in chip form for fastening on printed circuits
12/14/1989DE3805487A1 Method for separating printed circuit boards from a blank
12/13/1989EP0346228A1 Masking plate for equipped printed-circuit boards, and method of manufacturing the same
12/13/1989EP0346206A1 Active connector for printed-circuit boards
12/13/1989EP0346117A1 Improved heating system in the manufacture of printed circuit boards, assemblies and the like
12/13/1989EP0346074A2 Mass of fine particles of inorganic material and method of producing the same, ultrathin film of the inorganic fine particles and method of making the same, magnetic recording medium and method of providing the same method of manufacturing patterns of inorganic material, and method of manufacturing wirings of inorganic material
12/13/1989EP0346035A2 Terminal structure and process of fabricating the same
12/13/1989EP0345979A2 Method of controlling flow by a radiation formed dam