Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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01/31/1990 | EP0352774A1 Photopolymerisation sensitizer active at longer wavelength |
01/31/1990 | EP0352719A1 Punching unit for punching apparatus |
01/31/1990 | EP0352454A2 Method for fluxless solder bonding |
01/31/1990 | EP0352432A2 Precision solder transfer method and means |
01/31/1990 | EP0198844B1 Electrical interconnection means |
01/31/1990 | CN1039342A Heat-pressing inlaying metlhod for making printed circuit board |
01/31/1990 | CN1006612B Article heat cohesive device |
01/30/1990 | US4897769 Right angle light emitting diode assembly with snap-in feature |
01/30/1990 | US4897766 Composite type circuit parts |
01/30/1990 | US4897676 High-density circuit and method of its manufacture |
01/30/1990 | US4897338 Method for the manufacture of multilayer printed circuit boards |
01/30/1990 | US4897326 Circuit components on major side in desired design and corresponding soldered wires on second major side; electrography |
01/30/1990 | US4897305 Using aliphatic hydrocarbon vapor |
01/30/1990 | US4897165 High molecular weight endcapped polyoxyethylene glycol surfactant, copper sulfate; throwing power |
01/30/1990 | US4897164 Treating deposited carbon black particles with aqueous alkaline alkali metal borate solution before microetching |
01/30/1990 | US4897153 Method of processing siloxane-polyimides for electronic packaging applications |
01/30/1990 | US4897151 Method for fabricating a dichroic parabolic lens reflector |
01/30/1990 | US4897148 Apparatus for removing adhesive tape wrapped around a printed circuit board |
01/30/1990 | US4897118 Selective metallization process, additive method for manufacturing printed circuit boards, and composition for use therein |
01/30/1990 | US4897051 Flexible electric component leads |
01/30/1990 | US4896817 Heating with lead compound |
01/30/1990 | US4896464 Method of forming upstanding conductive terminals of a ceramic structure |
01/30/1990 | CA1265282A1 Protective coating for phototools |
01/30/1990 | CA1265260A1 Method of sealing electric and electronic parts |
01/30/1990 | CA1265218A1 Surface mount compatible connector system with mechanical integrity |
01/25/1990 | WO1990000852A1 Device for rapid applying of pastes and adhesives at discrete points, especially for surface mounting of components at circuit cards |
01/25/1990 | WO1990000634A2 Metallized polymers and method |
01/25/1990 | WO1990000460A1 Method of repairing a binding post and kit therefor |
01/25/1990 | DE3824866A1 Application of flux |
01/24/1990 | EP0352211A2 Enhanced removal of carbon from ceramic substrate laminates |
01/24/1990 | EP0352183A1 Process for mounting electronic micro components on a support, and intermediate product |
01/24/1990 | EP0351985A1 Solder containing electrical connector |
01/24/1990 | EP0351851A2 Method and apparatus for making a flexible interconnect |
01/24/1990 | EP0351810A1 Cleaning composition of terpene compound and dibasic ester |
01/24/1990 | EP0351622A2 Wet etching of cured polyimide |
01/24/1990 | EP0351569A1 Apparatus for electroplating platelike articles, particularly circuit boards |
01/24/1990 | EP0351555A2 Recording material polymerisable by radiation and process for the manufacture of relief images |
01/24/1990 | EP0351533A1 Process for coating a substrate with metallic layer |
01/24/1990 | EP0351460A1 Soldering apparatus |
01/24/1990 | EP0351413A1 Method and apparatus for production of three-dimensional objects by photosolidification. |
01/24/1990 | CN1039157A Electrical connection arrangement for flat |
01/24/1990 | CN1006597B Process to obtain thin film lines |
01/23/1990 | US4896019 Electric soldering iron for simultaneously soldering or desoldering a row of integrated circuit leads |
01/23/1990 | US4895789 Method of manufacturing non-linear resistive element array |
01/23/1990 | US4895756 Printed circuit substrate |
01/23/1990 | US4895739 Pretreatment for electroplating process |
01/23/1990 | US4895735 Thermal energy, vapor deposition |
01/23/1990 | US4895630 Water soluble polymer |
01/23/1990 | US4895617 Amine oxide surfactant |
01/23/1990 | US4895524 Interface device having rigid planar elements and flexible printed circuits |
01/23/1990 | US4895523 Controlled impedance connector |
01/23/1990 | US4895177 Circuit board cleaning apparatus |
01/23/1990 | US4895099 Device for sequential spray application of chemical solutions used in the preparation of circuit board inner layers |
01/23/1990 | US4895033 Sample holder for use in the grinding or polishing of samples |
01/23/1990 | CA1264872A1 Mounting of an integrated circuit on a support |
01/17/1990 | EP0351034A2 Process and film for producing printed wiring boards |
01/17/1990 | EP0351011A1 Optical scanning device |
01/17/1990 | EP0350977A1 Device for the affixation of a metallic element to a plate |
01/17/1990 | EP0350876A2 Process for the production of dielectric layers in planar circuits on ceramic substrates |
01/17/1990 | EP0350873A2 Method for forming pattern and method for making semiconductor device |
01/17/1990 | EP0350833A2 Integrated circuit package structure |
01/17/1990 | EP0350648A2 Process for the production of highly temperature-resistant copper coatings on inorganic dielectrics |
01/17/1990 | CN2051427U Metallized-hole-free single face multi-layer printing circuit board |
01/17/1990 | CN1006518B Printed resister, its fabrication and use |
01/16/1990 | US4894751 Printed circuit board for electronics |
01/16/1990 | US4894708 LSI package having a multilayer ceramic substrate |
01/16/1990 | US4894686 Transfer roller |
01/16/1990 | US4894606 System for measuring misregistration of printed circuit board layers |
01/16/1990 | US4894509 Laser assisted heater bar for multiple lead attachment |
01/16/1990 | US4894506 Method and apparatus for reflow soldering of electrical component leads, including floating heater bar |
01/16/1990 | US4894317 Method of forming a printed circuit and the printed circuit formed therefrom |
01/16/1990 | US4894316 Adjustment of thin film capacitors |
01/16/1990 | US4894279 Wear resistant layer composed of polymer modified by organotitanium compound |
01/16/1990 | US4894273 Containing oxids of molybdenum, tungsten, niobium, manganese, ytterium and(or) titanium |
01/16/1990 | US4894271 Overcoating prepreg with copper foil; heating |
01/16/1990 | US4894176 Cleaning compounds, degreasing |
01/16/1990 | US4894124 Electroless deposition of nickel or cobalt, electrodeposition of copper, multilayer |
01/16/1990 | US4894115 Laser beam scanning method for forming via holes in polymer materials |
01/16/1990 | US4894018 Low profile electrical connector |
01/16/1990 | US4894016 Electrical connector |
01/16/1990 | US4894015 Flexible circuit interconnector and method of assembly thereof |
01/16/1990 | US4893556 Screen printer with double doctor/squeegee, printing pressure sensor and aligning mechanism |
01/16/1990 | US4893404 Method for producing a multilayer printed wiring board |
01/16/1990 | US4893403 Chip alignment method |
01/16/1990 | CA1264489A1 Apparatus for operating and controlling machines cleaning thin metal or metal coated sheets and boards |
01/11/1990 | WO1990000310A1 Cryogenic process for metal lift-off |
01/11/1990 | DE3823072A1 Electroplating device for plate-shaped workpieces, especially printed circuit boards |
01/11/1990 | DE3822658A1 Product for long-lasting cleaning of non-ferrous metal surfaces |
01/10/1990 | EP0350387A2 Additives for electroplating compositions and methods for their use |
01/10/1990 | EP0350316A1 Cleaning and drying of electronic assemblies |
01/10/1990 | EP0350179A1 Manufacturing portable electronic tokens |
01/10/1990 | EP0350060A2 Thin film feed member for thin film adhering apparatus |
01/10/1990 | EP0349946A1 Process for manufacturing metallic layers |
01/10/1990 | EP0349882A1 Process for manufacturing metal layers |
01/10/1990 | EP0349833A1 Electroplating apparatus for planar work pieces, particularly circuit boards |
01/10/1990 | EP0349805A2 Process for etching epoxy resin |
01/10/1990 | EP0349756A2 Method of making electric circuit device |
01/10/1990 | CN1006440B Hybrid and multi-layer circuit |
01/09/1990 | US4893216 Circuit board and method of soldering |
01/09/1990 | US4893172 Connecting structure for electronic part and method of manufacturing the same |