Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/1991
07/23/1991US5034569 Multilayer interconnection circuit board
07/23/1991US5034568 Package structure for multichip modules
07/23/1991US5034260 Ceramic and circuit substrate and electronic circuit substrate by use thereof
07/23/1991US5034257 Conductors and insulators
07/23/1991US5034245 Multilayer resin on circuit substrate, electrode patterns
07/23/1991US5033970 Self-mounted chip carrier
07/23/1991US5033666 Electronics
07/23/1991CA1286821C Heat activatable adhesive for wire scribed circuits
07/23/1991CA1286792C Embedded catalyst receptors for metallization of dielectrics
07/23/1991CA1286791C Sealing and stress relief layers and use thereof
07/23/1991CA1286765C Ultrasonic stylus position stabilizer
07/23/1991CA1286586C Finish laminates for high frequency circuits
07/20/1991CA2032921A1 Thermosettable composition
07/18/1991DE4101275A1 Soldering and positioning tool for electronic SMD components - uses hot air supply applied to solder bumps by jet-like gap(s)
07/18/1991DE4013620C1 Flexible flat cable connector - has U=shaped connecting pins which can be bent into hollow cylindrical shape
07/18/1991DE4000945A1 Measuring temp. and/or temp. variation esp. at soldered joints - by detecting physical change in at least one part e.g. between solder and liq. or malleable states
07/17/1991WO1991011039A1 High density and multiple insertion connector
07/17/1991EP0437312A1 Electronic part mountable on the surface of a printed circuit board and method of mounting the same
07/17/1991EP0437166A2 Thermal cutoff and resistor assembly
07/17/1991EP0436969A1 High frequency thermode driver employing one-turn-secondary transformers
07/17/1991EP0436848A2 Matched impedance vertical conductors in multilevel metal dielectric laminated wiring
07/17/1991EP0436812A1 Copper etch process and printed circuit formed thereby
07/17/1991EP0436746A1 Process of manufacture for high performance epoxy based laminating adhesives
07/17/1991EP0436745A1 A high performance epoxy based coverlay and bond ply adhesive with heat activated cure mechanism
07/17/1991EP0436652A1 Hybrid microchip bonding article
07/17/1991EP0436635A1 Perfluoroheptaglyme - an improved vapor-phase soldering fluid
07/17/1991EP0436525A1 Wire/disk board-to-board interconnect device
07/17/1991EP0252115B1 Compressive pedestal for microminiature connections
07/17/1991EP0215024B1 Solder-bearing terminal
07/17/1991CN1053134A Copper halide imaging system for electronic applications
07/16/1991US5032953 Surface mounted single in-line electronic component package with mounting projections and chamfered viewing edge
07/16/1991US5032950 Cuffed tape wrap and fill wound capacitor
07/16/1991US5032803 Directional stripline structure and manufacture
07/16/1991US5032737 Ignition circuit module and method of manufacture
07/16/1991US5032735 Method of and apparatus for inspecting printed circuit boards
07/16/1991US5032691 Electric circuit assembly with voltage isolation
07/16/1991US5032490 Photosensitive aqueous developable copper conductor composition
07/16/1991US5032478 Resolution
07/16/1991US5032467 Polyimides, bonding strength
07/16/1991US5032427 Process for preparation printed circuit through-holes for metallization
07/16/1991US5032426 Both surfaces, one-step drying
07/16/1991US5032423 Magnetic field
07/16/1991US5032235 Electrodeposition
07/16/1991US5032234 Electrodeposition
07/16/1991US5032216 Non-photographic method for patterning organic polymer films
07/16/1991US5032006 Electrooptical cells having connection means
07/16/1991US5031308 Method of manufacturing multilayered printed-wiring-board
07/16/1991CA1286167C Method for forming patterned tin oxide thin film element
07/13/1991CA2032654A1 Optical-electronic interface module
07/12/1991WO1991011090A1 Method for manufacturing flexible printed circuits, printed circuit thereby manufactured, and device for implementing the method
07/12/1991CA2055452A1 Flexible printed circuit fabrication method and device and printed circuit fabricated by said method
07/12/1991CA2023319A1 High frequency thermode driver employing one-turn-secondary transformers
07/11/1991WO1991009986A1 Catalytic, water-soluble polymeric films for metal coatings
07/11/1991DE4000372A1 Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet
07/11/1991DE4000123A1 Holder for small incandescent lamp - is mounted in hole in CCT board via tube holding lamp
07/11/1991DE3943261A1 IC element correcting circuit - has conducting paths punched from metal foil and pressed into U=channels formed in plastic board or casing
07/10/1991EP0436322A2 Method of checking external shape of solder portion
07/10/1991EP0436282A2 Area-selective metallization process
07/10/1991EP0436134A2 IC card
07/10/1991EP0436065A2 Method and apparatus for automatically bonding film to a substrate and cutting the film to desired size
07/09/1991US5031073 Fault-isolating apparatus and method for connecting circuitry
07/09/1991US5031071 Heat spreading device for component leads
07/09/1991US5031069 Integration of ceramic capacitor
07/09/1991US5031027 Shielded electrical circuit
07/09/1991US5030800 Printed wiring board with an electronic wave shielding layer
07/09/1991US5030799 Printed circuit board
07/09/1991US5030548 Photoiniator system comprising a 4,4'-bis(dialkylamino) benzophenone, an aromatic ketone and lophine dimer; also present a halogen compound leuco and dye; lithography; printing plates; photoresists
07/09/1991US5030373 Surface-treating agents for copper and copper alloy
07/09/1991US5030293 Method and apparatus for circuit board cleaning
07/09/1991US5030144 Solder-bearing lead
07/09/1991US5030137 Flat cable jumper
07/09/1991US5030109 Area array connector for substrates
07/09/1991US5029748 Solder preforms in a cast array
07/09/1991US5029747 Apparatus for replacing defective electronic components
07/09/1991US5029731 Process and apparatus for dosing and applying liquid or pasty media to an object
07/09/1991US5029386 Hierarchical tape automated bonding method
07/09/1991US5029384 Apparatus for mounting electronic device on a printed circuit board
07/09/1991CA1286010C Electrical connector terminal for a flexible printed circuit board
07/09/1991CA1286008C Conductive lead arrangement
07/09/1991CA1286007C Electrical socket apparatus with temporary housing
07/09/1991CA1285998C Automatic soldering apparatus
07/09/1991CA1285901C Plating bath and method for electroplating tin and/or lead
07/09/1991CA1285900C Combined sequencer and insertion machine
07/06/1991CA2031110A1 Method for treating a polyimide surface for subsequent plating thereon
07/03/1991EP0435717A1 Process for interconnecting of metallic layers in multilayer circuits of an electronic board and the board produced by the process
07/03/1991EP0435584A1 Multi-level circuit structure
07/03/1991EP0435212A1 Process of pretreatment of metal-plating resin molded articles
07/03/1991EP0435093A2 Thin, molded, surface mount electronic device
07/03/1991EP0435058A2 Layer transfer process for image production and apparatus to perform the process
07/03/1991CN1052765A Method of froming soldes layer on pads of circuit board and method of mounting electronic part on circuit board
07/03/1991CN1052753A Apparatus and method for installation of multi-pin components on circuit boards
07/03/1991CN1052706A Copper etch process using halides
07/03/1991CN1013033B Device for transferring printed circuit board
07/02/1991US5029243 Device for working a workpiece using laser light
07/02/1991US5029242 Glass-ceramic structure and method for making same
07/02/1991US5029043 LC circuit incorporated ceramic substrate
07/02/1991US5028986 Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices
07/02/1991US5028867 Printed-wiring board
07/02/1991US5028760 Infrared heater
07/02/1991US5028743 Printed circuit board with filled throughholes