Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
07/1991
07/02/1991US5028741 High frequency, power semiconductor device
07/02/1991US5028513 Adhesion of resist to substrate, preventing delamination
07/02/1991US5028473 Three dimensional microcircuit structure and process for fabricating the same from ceramic tape
07/02/1991US5028457 Roll coating apparatus and method capable of providing coatings without pin holes
07/02/1991US5028111 Method of fixing cylindrical optical part and electric part
07/02/1991US5028003 High pressure fluid processing device
07/02/1991US5027841 Apparatus to clean printed circuit boards
07/02/1991US5027683 Punching device for thin plates and punching units used with punching device
07/02/1991US5027505 Method of producing electronic components
07/02/1991CA1285463C Composition useful for stripping photoresist polymers
06/1991
06/28/1991WO1991010291A1 Board for surge absorbing device of communication line
06/28/1991CA2045670A1 Circuit board for surge absorber for communication lines
06/27/1991WO1991009511A2 Electrical conductors of conductive resin
06/27/1991WO1991009450A1 Power converter circuit board
06/27/1991WO1991009419A1 Flip chip technology using electrically conductive polymers and dielectrics
06/27/1991WO1991009151A1 Method of metallizing substrates by chemical redox
06/27/1991WO1991009087A1 Novel bistriazene compounds and polymeric compositions crosslinked therewith
06/27/1991WO1991008850A1 Method of manufacturing minute metallic balls uniform in size
06/27/1991DE4041071A1 Vorrichtung zur abschirmung und isolierung einer elektronischen schaltungskarte Apparatus for shielding and isolation of an electronic circuit card
06/27/1991DE3942509A1 HF circuit with tunable printed coil - having inductance varied by moving relative position of ferrite element i.e. by distance or amt. of coverage
06/27/1991DE3942472A1 Beschichtungsverfahren Coating process
06/27/1991CA2020462A1 Electrical connector device
06/26/1991EP0434579A1 UV curable compositions for use, in particular, in the field of antiadherent-paper and optical fibers
06/26/1991EP0434543A2 High-density memory array packaging
06/26/1991EP0434471A1 Surface mounted LED package
06/26/1991EP0434451A2 Cuffed tape wrap and fill wound capacitor
06/26/1991EP0434313A2 Enhanced direct bond structure
06/26/1991EP0434312A2 Bonding a conductor to a substrate
06/26/1991EP0434311A1 An epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it
06/26/1991EP0434135A1 Method of positioning and soldering of SMD components
06/26/1991EP0434013A2 Epoxy resin-impregnated glass cloth sheet having adhesive layer
06/26/1991EP0433997A2 Improved connector arrangement system and interconnect element
06/26/1991EP0433983A2 Copper etch process using halides
06/26/1991EP0433803A1 Solder joint locator
06/26/1991EP0433742A2 Photo module
06/26/1991EP0433721A2 Method of applying a solder stop coating on printed circuit boards
06/26/1991EP0433720A2 Method of applying a solder stop coating on printed circuit boards
06/26/1991CN1052558A Aqueous processible photopolymerizable compositions capable of photolytically generating metal ions
06/26/1991CN1052473A Ceramic-metal bonding
06/26/1991CN1013017B Soldering apparatus
06/26/1991CN1012961B Photopolymerizable compositions containing inorganic fillers
06/25/1991US5027256 Component carrier with curved base
06/25/1991US5027253 Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
06/25/1991US5027191 Cavity-down chip carrier with pad grid array
06/25/1991US5027062 Electroformed chemically milled probes for chip testing
06/25/1991US5026752 Amorphous-polypropylene-based hot melt adhesive
06/25/1991US5026748 Matrix filled with three-dimensional arrangement of carbon fibers, thermoplastic, thermosetting or elastomeric resins; bonding electronic components
06/25/1991US5026741 Photocurable organopolysiloxane composition
06/25/1991US5026591 Microporous matrix filled with thermo(plastic or setting) resin
06/25/1991US5026500 Nitroalkanes, ethanol, chlorofluorocarbons, and phosphine acid esters; room temperature
06/25/1991US5026497 Azeotropic compositions of perfluoro-1,2-dimethylcyclobutane with methanol and 1,1-dichloro-1-fluoroethane or dichlorotrifluoroethane
06/25/1991US5026291 Board mounted connector system
06/25/1991US5026172 Temperature sensor for measuring the surface temperature of a rotating roll
06/25/1991US5026145 Optical image
06/25/1991US5025555 Method of producing electric circuit patterns
06/25/1991US5025553 Circuit board manufacture
06/25/1991US5025552 Method of manufacturing ion current recording head
06/24/1991CA2032698A1 Layer transfer process for image production and apparatus to perform the process
06/23/1991WO1991009984A1 Coating process
06/23/1991CA2048669A1 Coating process
06/21/1991WO1991009987A1 Peroxide composition for removing organic contaminants and method of using same
06/21/1991WO1991008857A1 Weakening wire supplied through a wire bonder
06/21/1991CA2071219A1 Weakening wire supplied through a wire bonder
06/20/1991DE3941814A1 Carrier plate for power semiconductor components - has metal plate provided with ceramics disc divided into pieces between metallised areas
06/19/1991EP0433081A2 Photosensitive resin composition and method of use thereof
06/19/1991EP0432907A1 Improved paste compositions
06/19/1991EP0432874A1 Binary azeotropic compositions of 2,3-dichloro-1,1,1,3,3,-pentafluoropropane and methanol
06/19/1991EP0432870A2 Electrical test probe
06/19/1991EP0432493A2 Electronic circuitry utilizing silver diffusion transfer imaging
06/19/1991EP0432331A2 Rechargeable type small electric appliance
06/18/1991US5025348 Bonding structure of an electronic device and a method for manufacturing the same
06/18/1991US5025305 Semiconductor device for detecting or emitting a magnetic line of force or light
06/18/1991US5025211 Technique for reducing electromagnetic interference
06/18/1991US5024975 Crystallizable, low dielectric constant, low dielectric loss composition
06/18/1991US5024900 Composite nickel-phosphorus alloy plated metal sheet excellent in strippability and having high hardness and method for manufacturing same
06/18/1991US5024873 Composite films with Langmuir-Blodgett component
06/18/1991US5024871 Ceramic filled fluoropolymetric composite material
06/18/1991US5024858 Metallized polymers and method
06/18/1991US5024735 Applying electrolytes to image substrate, contacting with electrically conductive brush, vibration
06/18/1991US5024734 Solder pad/circuit trace interface and a method for generating the same
06/18/1991US5024725 Localized etching in gas or liquid phase
06/18/1991US5024623 Electrical circuit board mounting method
06/18/1991US5024562 Pressure foot for printed circuit board drilling machine
06/18/1991US5024372 Method of making high density solder bumps and a substrate socket for high density solder bumps
06/18/1991US5024366 Desoldering vat
06/18/1991US5023994 Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes
06/18/1991CA1285040C Soldered cable transition connector
06/18/1991CA1284938C Process of laminating
06/18/1991CA1284862C Molded metalized plastic articles and processes for making the same
06/16/1991WO1991008840A1 Autodeposition emulsion for selectively protecting metallic surfaces
06/16/1991CA2051400A1 Autodeposition emulsion for selectively protecting metallic surfaces
06/16/1991CA2032329A1 Photosensitive resin composition and method of use thereof
06/13/1991WO1991008588A1 High power, high density interconnect method and apparatus for integrated circuits
06/13/1991WO1991008586A1 Methods of plating into holes and products produced thereby
06/13/1991WO1991008326A1 Holding and electrical-contact device for components being electroplated in an electrolytic bath
06/13/1991WO1991008325A1 Process for direct galvanic metallisation
06/13/1991WO1991008073A1 Board holder in printed board boring machine
06/13/1991DE3941069A1 Conduction plate soldering device - uses flux funnel neck using as few metal parts as possible that produces fine porous foam
06/12/1991EP0431924A2 Three-dimensional printing techniques
06/12/1991EP0431809A2 Epoxy-silanol functional UV curable polymers
1 ... 1050 1051 1052 1053 1054 1055 1056 1057 1058 1059 1060 1061 1062 1063 1064 1065 1066 1067 1068 1069 1070 ... 1185