| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 05/08/1991 | DE3936959A1 High speed drilling machine for PCB - has clamp ring removed from drill holder to allow replacement of drill bit |
| 05/08/1991 | DE3936947A1 Anordnung zur beschickung von vorzugsweise einspindeligen nc-leiterplatten-koordinatenbohrmaschinen mit zu bohrenden leiterplatten bzw. zum abtransport fertig gebohrter leiterplatten Arrangement for feeding preferably single-spindle nc-pcb-coordinate with drills to drill pcb and pcb drilled ready for abtransport |
| 05/08/1991 | DE3936906A1 Housing for electronic device in motor vehicle - has frame provided by inside surface fitted with two opposing carrier plates |
| 05/08/1991 | DE3936887A1 Compsn. contains fluoro-chloro-hydrocarbon contg. hydrogen - and partially halogenated lower alcohol and is used as cleaning compsn., esp. for printed circuit contaminated with flux |
| 05/08/1991 | DE3936829A1 Protective foil removal device for PCB(s) - engages edge of foil and lifts it away from surface of transported circuit board |
| 05/08/1991 | DE3936747A1 Drill bit for PCB - has rear angled face at each end of front cutting edge |
| 05/08/1991 | DE3936363A1 Etching unit esp. for printed copper circuit boards - in which used rinsing water is distilled to recover pure water and ammoniacal etchant to which ammonia is added prior to recycling |
| 05/08/1991 | CN1051282A Printed circuit board, method of its fabrication and of attaching electronic elements thereto |
| 05/08/1991 | CN1051254A Personal computer processor card interconnect system |
| 05/08/1991 | CN1051203A Stabilized azeotrope-like compositions 1,1-dichloro-2,2,2-trifuoroethane and 1,1-dichloro-1-fluoroethane |
| 05/07/1991 | USH921 Stress controlling mounting structures for printed circuit boards |
| 05/07/1991 | US5014223 Method of filling inner region of a graphic with traces of imaging spot |
| 05/07/1991 | US5014162 Solder assembly of components |
| 05/07/1991 | US5014160 EMI/RFI shielding method and apparatus |
| 05/07/1991 | US5014159 Semiconductor package |
| 05/07/1991 | US5014114 High speed, high density semiconductor memory package with chip level repairability |
| 05/07/1991 | US5014113 Multiple layer lead frame |
| 05/07/1991 | US5013631 Ultraviolet curable conformal coatings |
| 05/07/1991 | US5013581 Method of making a polymer-metal compound having a predetermined electrical conductivity by depositing on a substrate from a glow discharge zone |
| 05/07/1991 | US5013402 Method of manufacturing double-sided wiring substrate |
| 05/07/1991 | US5013397 Printed circuit board and method of preparing same |
| 05/07/1991 | US5013395 Oxidizing a cuprous chloride solution to cupric chloride |
| 05/07/1991 | US5013249 Electrical connectors |
| 05/07/1991 | US5013108 Optical scanning device and mirror correction system for use in such a device |
| 05/04/1991 | WO1991006689A1 Coating metal on poly(aryl ether ketone) surfaces |
| 05/04/1991 | CA2066239A1 Coating metal on poly (aryl ether ketone) surfaces |
| 05/04/1991 | CA2029244A1 Planarizing surfaces of interconnect substrates by diamond turning |
| 05/03/1991 | CA2002192A1 Accelerated sputtering system |
| 05/02/1991 | WO1991006961A1 Electrically conductive polymer composition |
| 05/02/1991 | WO1991006137A1 Application specific tape automated bonding |
| 05/02/1991 | WO1991006126A1 High-speed ccd sensor mounting system with improved signal to noise operation and thermal contact |
| 05/02/1991 | WO1991006117A1 Three dimensional microcircuit structure and process for fabricating the same from ceramic tape |
| 05/02/1991 | WO1991005888A1 Etching installation and process for etching objects |
| 05/02/1991 | WO1991005658A1 Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil |
| 05/02/1991 | EP0425437A2 Method for making metallic patterns |
| 05/02/1991 | EP0425316A2 Electric connector |
| 05/02/1991 | EP0425294A2 Two-color molded article for use in circuit formation |
| 05/02/1991 | EP0425192A2 Printed circuit board interconnect apparatus |
| 05/02/1991 | EP0425148A2 Method of forming multilayer thick film circuits |
| 05/02/1991 | EP0424866A2 Liquid solder mask composition |
| 05/02/1991 | EP0424798A2 Apparatus for production of plated through-holed printed and multi-layer circuit boards |
| 05/02/1991 | EP0424796A2 Injection molded printed circuits |
| 05/02/1991 | EP0424696A2 Structure for testing the operability of a completed printed circuit board, process for fabricating same and process for testing same. |
| 05/02/1991 | EP0424522A1 Interconnect device and method of manufacture thereof |
| 05/02/1991 | EP0424505A1 Apparatus and method for fabricating printed circuit boards |
| 05/02/1991 | DE4009462A1 Miniature timing relay - has circuitry on disc interconnected by flexible sections that allow folding within housing |
| 05/02/1991 | DE3935680A1 Metal core circuit plate - has copper plate with through hole contacts sandwiched between insulating plates |
| 05/02/1991 | DE3935662A1 Circuit substrate mounted on carrier - has adhesive pads and space between filled with cooling fluid |
| 05/02/1991 | DE3935476A1 Bubbles elimination from PCB coating fluid - is obtained using low pressure environment |
| 05/02/1991 | CA2067488A1 Electrically conductive polymer composition |
| 05/01/1991 | CA2028710A1 Multilayer circuit board having microporous layers and method for making same |
| 04/30/1991 | US5012502 Method for determining degree of interconnection of solder joints using X-ray inspection |
| 04/30/1991 | US5012391 Molded electrical interconnection system |
| 04/30/1991 | US5012388 Electrode structure of a chip type electronic component |
| 04/30/1991 | US5012387 Printed circuit board with heat dissipating device |
| 04/30/1991 | US5012047 Multilayer wiring substrate |
| 04/30/1991 | US5011872 For heat exchanging adhesives for printed circuits; stability, workability |
| 04/30/1991 | US5011761 Coating with photosensitive lacquer, masking, exposure, development, removal |
| 04/30/1991 | US5011758 Toned pattern on dielectric receiver; electrostatically transferring developed image by reverse photographic process |
| 04/30/1991 | US5011732 Glass ceramic substrate having electrically conductive film |
| 04/30/1991 | US5011725 Pores back-filled with another metal; glass-free |
| 04/30/1991 | US5011658 For low temperature workability; nondestructive, printed circuits |
| 04/30/1991 | US5011620 Removal of flux residues from surfaces of printed circuit board |
| 04/30/1991 | US5011580 Protective coating |
| 04/30/1991 | US5011569 Etching of copper or copper oxide coatings with ammonium chloride and hydrogen peroxide mixture to produce masking patterns in printed circuit boards |
| 04/30/1991 | US5011546 Water soluble solder flux and paste |
| 04/30/1991 | US5011417 Structure of connection between bus bar and press-connecting branch terminal in electric connection box |
| 04/30/1991 | US5011345 Contour machining method and apparatus for printed circuit board |
| 04/30/1991 | US5011066 Enhanced collapse solder interconnection |
| 04/30/1991 | US5010999 High lamination speed automatic laminator |
| 04/30/1991 | US5010641 Method of making multilayer printed circuit board |
| 04/30/1991 | CA1283591C Method for making a flush surface laminate for a multilayer circuit board |
| 04/30/1991 | CA1283574C Method of patterning resist for printed wiring boards |
| 04/28/1991 | CA2027939A1 Printed circuit board, a method of its fabrication and a method of attaching electronic parts thereto |
| 04/27/1991 | CA2028386A1 Method for making metallic patterns |
| 04/27/1991 | CA2025952A1 Embedded testing circuit and method for fabricating same |
| 04/26/1991 | WO1991007073A1 Method of manufacturing a multilayered circuit board |
| 04/26/1991 | CA2066024A1 Method of manufacturing a multilayered circuit board |
| 04/26/1991 | CA2025198A1 Liquid solder mask composition |
| 04/25/1991 | DE3935222A1 Aetzanlage sowie verfahren zum aetzen von gegenstaenden Etching system and method for etching of Objects |
| 04/25/1991 | DE3935002A1 PCB surface treatment - using plasma in reaction chamber flanked by lock chambers |
| 04/24/1991 | EP0424270A2 Electro-emissive laser stimulated test |
| 04/24/1991 | EP0424262A1 Portable electronics with connectable components |
| 04/24/1991 | EP0424171A2 Perfluoro-N,N,N',N'-tetrapropyldiaminopropane and use thereof in vapor phase heating |
| 04/24/1991 | EP0424106A2 A method for connecting circuit boards |
| 04/24/1991 | EP0424029A2 Multilayer through hole connections |
| 04/24/1991 | EP0423947A2 Process for electroplating electroactive polymers and articles derived therefrom |
| 04/24/1991 | EP0423821A2 Surface-mount network device |
| 04/24/1991 | EP0423752A2 Dielectric compositions |
| 04/24/1991 | EP0423751A2 Crystallizable, low dielectric constant, low dielectric loss composition |
| 04/24/1991 | EP0423651A1 Method for manufacturing a circuit configuration, and circuit configuration on a carrier foil |
| 04/24/1991 | EP0423433A1 Method and apparatus for bonding component leads to pads located on a non-rigid substrate |
| 04/24/1991 | EP0423190A1 Metallized polymers and method. |
| 04/24/1991 | EP0423184A1 Device for rapid applying of pastes and adhesives at discrete points, especially for surface mounting of components at circuit cards. |
| 04/24/1991 | EP0346355A4 Method of patterning resist |
| 04/24/1991 | EP0318513B1 Method for forming a metal coating on a substrate |
| 04/24/1991 | CN1050965A Method for direct metallization of conductire boards |
| 04/24/1991 | CN1050833A Method for treating articles by liquid and their apparatus |
| 04/24/1991 | CA2023713A1 Gaseous isostatic lamination process |
| 04/23/1991 | US5010493 Load distribution method |