Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
08/1991
08/13/1991US5039841 Reflow furnace
08/13/1991US5039824 Printed circuit having twisted conductor lines printed thereon
08/13/1991US5039735 Room temperature vulcanizable organopolysiloxane composition for masking electric or electronic parts
08/13/1991US5039576 From bath having alkyl sulfonic acid electrolyte, low melting
08/13/1991US5039570 Resistive laminate for printed circuit boards, method and apparatus for forming the same
08/13/1991US5039569 Surface modification of organic materials to improve adhesion
08/13/1991US5039472 Isopropanl and methylene chloride or resorcinol solvents before printed circuit pattern is transferred
08/13/1991US5038996 Lead and tin coating to form eutectic bond
08/13/1991US5038995 Soldering method and soldering apparatus
08/13/1991US5038950 Method and apparatus for joining together associated metal conductors of a layer structure with an insulating layer provided therebetween
08/13/1991US5038706 Printed circuits board soldering apparatus
08/13/1991US5038467 Apparatus and method for installation of multi-pin components on circuit boards
08/13/1991CA2034601A1 Solder mask vacuum laminator conversion
08/13/1991CA1287694C Composite dielectric structure for optimizing electrical performance in highperformance chip support packages
08/13/1991CA1287690C Method and apparatus for reflow soldering of electrical component leads, including floating heater bar
08/08/1991WO1991011833A1 Chip interconnect with high density of vias
08/08/1991WO1991011307A1 Method of and material for forming thick filmy pattern
08/08/1991WO1991011288A1 Laser micro-film machine for processing objects having thin films such as integrated circuits
08/08/1991WO1991011284A1 Gas curtain additives and zoned tunnel for soldering
08/08/1991WO1991011269A1 A method for electrical assembly cleaning
08/08/1991CA2074529A1 Chip interconnect with high density of vias
08/08/1991CA2035364A1 Cleaning substance containing 1,1-dichloro-1-1 fluoroethane, methy formiate and methanol
08/08/1991CA2035363A1 Cleaning substance containing 1,1-dichloro-1-fluoroethane and methyl formiate
08/07/1991EP0440444A2 Photosensitive resin composition
08/07/1991EP0440264A1 Process and device for soldering under a protective gas
08/07/1991EP0440027A2 Additive for acid-copper electroplating baths to increase throwing power
08/07/1991EP0439928A1 Directional stripline structure and manufacture
08/07/1991EP0439907A2 Apparatus and method for the noncontact measurement of drill diameter, runout, and tip position
08/07/1991EP0439843A1 Process for crosslinking heat-curable prepolymers
08/07/1991EP0439828A2 Copper-clad polyetherimide laminates with high peel strength
08/07/1991EP0439825A2 Semiconductor package having leads that break-away from supports
08/07/1991EP0439546A1 Process and device for soldering the leads of smd components
08/07/1991CN1053687A Photosensitive resin composition and method of use thereof
08/07/1991CN1053646A Catalytic, water-soluble polymeric films for metal coatings
08/06/1991US5038255 Vehicle lamp
08/06/1991US5038252 Printed circuit boards with improved electrical current control
08/06/1991US5038251 Electronic apparatus and a method for manufacturing the same
08/06/1991US5038195 protective nickel alloy coating to copper leads
08/06/1991US5038194 Semiconductor device
08/06/1991US5038132 Dual function circuit board, a resistor element therefor, and a circuit embodying the element
08/06/1991US5038068 Thin film pattern and method of forming the same
08/06/1991US5037722 Photoresist exposure method and apparatus therefor
08/06/1991US5037721 Positive radiation-sensitive mixture containing monomeric acid-cleavable compound and radiation-sensitive recording material produced therefrom
08/06/1991US5037691 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products
08/06/1991US5037506 Method of stripping layers of organic materials
08/06/1991US5037504 Transferring the image
08/06/1991US5037482 Contacting laminate with water, alkane sulfonic acid, surfactants and oxidizing agent to clean and micro-roughen
08/06/1991US5037334 Connector with equal lateral force contact spacer plate
08/06/1991US5037316 Board-surface mounting type electric connector
08/06/1991US5037315 Electrical connectors
08/06/1991US5037312 Conductive gel area array connector
08/06/1991US5037311 High density interconnect strip
08/06/1991US5037309 Holder for installing parts on printed circuit board
08/06/1991US5037208 Immersible transducer assembly
08/06/1991US5036760 Screen printing machine
08/06/1991CA2035582A1 Transport device for boards having a sensitive surface, especially for wet-coated circuit boards
08/02/1991CA2035148A1 Photosensitive resin composition
08/01/1991WO1991011754A1 Improved method and means for producing photomasks
08/01/1991WO1991011493A2 Electrically conductive pressure sensitive adhesive
08/01/1991DE4002154A1 Liq. cleaning e.g. of circuit boards - using cleaning liq. supply and regeneration circuits
08/01/1991CA2074714A1 Method and means for producing photomasks
08/01/1991CA2047665A1 Electrically conductive pressure sensitive adhesive
07/1991
07/31/1991WO1991011472A1 Photocurable resin composition
07/31/1991EP0439256A1 Electronic device employing a conductive adhesive
07/31/1991EP0439137A2 Substrate for packaging a semiconductor device, packaging structure and method
07/31/1991EP0439136A2 Method for electrically connecting and packaging a semiconductor device
07/31/1991EP0439134A2 Substrate for packaging a semiconductor device, packaging structure and method
07/31/1991EP0438742A1 Method of fabricating a semiconductor device of thin package type
07/31/1991EP0438504A1 High density and high signal integrity connector.
07/31/1991CA2050574A1 Photocurable resin composition
07/30/1991US5036431 Package for surface mounted components
07/30/1991US5036379 Electrical interconnect tape
07/30/1991US5036301 Filter apparatus
07/30/1991US5036167 Board for hybrid integrated circuit
07/30/1991US5036128 UV curable ink containing thermosetting resin binder, ketone-amine curing agent, electroconductive particles
07/30/1991US5035980 Photosensitive semi-aqueous developable gold conductor composition
07/30/1991US5035939 Manufacture of printed circuit boards
07/30/1991US5035918 Applying uniform layer of styrene acrylic copolymer, butyl cellosolve, butyl carbitol and water, and subjecting select areas to excimer laser
07/30/1991US5035831 Fluxing of pritned circuits, industrial cleaning
07/30/1991US5035830 Cleaning solvent for printed circuits, blowing agents for polymers, refrigerants, propellants, working fluids,
07/30/1991US5035749 Process for removing tin and tin-lead alloy from copper substrates
07/30/1991US5035659 Compliant terminal pin
07/30/1991US5035628 Electrical connector for electrically interconnecting two parallel surfaces
07/30/1991US5035483 Surface-mountable opto-component
07/30/1991US5035049 Method for producing a stamped substrate
07/30/1991CA1287185C Support acting as a heat sink for printed circuit boards
07/30/1991CA1287184C Printed circuit board testing employing mechanical isolation
07/30/1991CA1286905C Resist process using polysulfone polymers
07/30/1991CA1286876C Apparatus for locating and supporting ceramic substrates
07/25/1991WO1991011081A1 Method, system and composition for soldering by induction heating
07/25/1991WO1991011025A1 A method for manufacturing of mineature impedance matched interconnection patterns
07/25/1991WO1991010992A1 Dye-enhanced deposition of elemental metals and metalloids on substrates
07/25/1991WO1991010573A1 Multi-metal layer interconnect tape for tape automated bonding
07/24/1991EP0438238A2 Surface mount method and device
07/24/1991EP0437976A2 Voltage-controlled oscillator mounted on laminated printed circuit board
07/24/1991EP0437954A1 Optical-electronic interface module
07/24/1991CA2034703A1 Substrate for packaging a semiconductor device
07/24/1991CA2034702A1 Method for packaging semiconductor device
07/24/1991CA2034700A1 Substrate for packaging a semiconductor device
07/23/1991US5034802 Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates
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