Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/1991
05/28/1991US5019201 External-circuit connecting method and packaging structure
05/28/1991CA1284528C Radiation supply and adhesive dispensing system
05/23/1991DE3938710A1 Komplexverbindungen mit oligomerem bis polymerem charakter Complex compounds with oligomeric to polymeric character
05/23/1991CA2030499A1 Laminate for electroless metallization, a printed circuit provided with same, and a process for the manufacture of such a laminate
05/23/1991CA2030259A1 Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs, and process for preparing such printed circuit wiring boards
05/22/1991EP0428383A1 Process for surface treatment of copper and copper alloy
05/22/1991EP0428260A2 Metal surface treatment agents
05/22/1991EP0428165A1 Moisture resistant electrically conductive cements and method for making and using same
05/22/1991EP0428086A2 Method of manufacturing a ceramic circuit board
05/22/1991EP0427923A2 Method for the reduction of pinholes in resist films
05/22/1991EP0427883A1 Zero insertion force electrical connector
05/21/1991US5018005 Thin, molded, surface mount electronic device
05/21/1991US5017949 Table assembly for pattern drawing apparatus
05/21/1991US5017863 Electro-emissive laser stimulated test
05/21/1991US5017742 Copper Clad Plastic
05/21/1991US5017738 Connecting apparatus
05/21/1991US5017420 Process for preparing electrically conductive shaped articles from polybenzimidazoles
05/21/1991US5017409 Spraying circuit boards
05/21/1991US5017272 Electrolytic polymerization
05/21/1991US5017271 Method for printed circuit board pattern making using selectively etchable metal layers
05/21/1991US5017267 Alkanesulfonic acid, ferric nitrate, chlorate
05/21/1991US5017255 Method of transferring an inorganic image
05/21/1991US5017164 Surface mount I.C. pin array system
05/21/1991US5017159 Solid single leg terminal
05/21/1991US5017145 Matrix switching device and method of manufacturing the same
05/21/1991US5017131 Atmosphere furnace
05/21/1991US5016804 Soldering apparatus having at least one stirrup electrode
05/21/1991CA2030145A1 Flame retardant adhesive composition and laminates
05/21/1991CA1284364C Modular connector
05/19/1991CA2027424A1 Electroless plating-resisting ink composition
05/18/1991WO1991007650A1 Method for measuring degree of cure of resin in a composite material and process for making the same
05/18/1991WO1991007522A1 Oligomeric to polymeric character complexes
05/18/1991CA2030151A1 Method for fabricating multilayer circuits
05/17/1991CA2030147A1 Electronic circuitry utilizing silver diffusion transfer imaging
05/16/1991WO1991007075A1 High power, high temperature disassemblable ceramic capacitor mount
05/16/1991WO1991007072A1 Device for drilling printed circuit boards
05/16/1991WO1991006977A1 Flexible circuit board for mounting ic and method of producing the same
05/16/1991WO1991006690A1 Mixture for cleaning printed circuit boards
05/16/1991WO1991006423A1 Multilayer circuit board having microporous layers and process for making same
05/16/1991WO1991006390A1 Solder leveller
05/16/1991WO1991006389A1 Method and device for laser brazing
05/16/1991DE3937926A1 Vorrichtung zum abblenden von feldlinien in einer galvanikanlage Apparatus for dim of field lines in a galvanizing plant
05/16/1991DE3936908A1 Covering machine applying foil coating to plate - coats workpiece with adhesive and cuts foil to required size
05/15/1991WO1991007759A1 Moisture resistant electrically conductive cements and methods for making and using same
05/15/1991EP0427702A2 Multilayer circuit board and method of making it
05/15/1991EP0427563A2 Apparatus and method for installation of multi-pin components on circuit boards
05/15/1991EP0427249A2 Aqueous processible photopolymerizable compositions capable of photolytically generating metal ions
05/15/1991EP0427220A2 Copper halide imaging system for electronic applications
05/15/1991EP0427193A2 Method of removing areas of layers from a substrate
05/15/1991EP0427151A2 Gull-wing zig-zag inline-lead package having end-of-package anchoring pins
05/15/1991EP0427081A2 Device for self-positioning of printed circuit boards
05/15/1991EP0427069A2 Detergent composition comprising fluorinated hydrocarbons containing hydrogen and partially fluorinated alcanols
05/15/1991EP0427053A2 Device and method for coating printed circuit plates
05/15/1991EP0427020A2 Method and device for processing soldering joint partners
05/15/1991EP0426946A2 Solder interconnects for selective line coupling
05/15/1991EP0426944A1 Cleaning agent for rosin-base solder flux
05/15/1991EP0426943A2 Agent and method for removing rosinbase solder flux
05/15/1991EP0426942A1 Agent for cleaning rosin-base solder flux
05/15/1991EP0426931A2 Film bonding method and apparatus for performing same
05/15/1991EP0426799A1 Continuous furnace
05/15/1991EP0426665A1 Method for manufacturing printed circuit boards.
05/15/1991CN1051387A Ternary azeotropic compositions of 1,1-dichloro-1, 2-difluoroethane and trans-1,2-dichloroethylene with methanol, ethanol or isopropanol
05/14/1991US5015981 Electronic microminiature packaging and method
05/14/1991US5015555 Photopolymerizable composition containing heterocyclic triazole
05/14/1991US5015553 Multilayer light sensitive element for images to make a printed wiring board
05/14/1991US5015538 Multilayer polymer metal composite formed by electrodeposition
05/14/1991US5015519 Molded article with partial metal plating and a process for producing such article
05/14/1991US5015517 Textured polyimide film
05/14/1991US5015339 Electrodeposition a metal layer on a nonconductive layer, coating with a dispersion of carbon black
05/14/1991US5015329 Pre-swelling and etching of plastics for plating
05/14/1991US5015314 Method for production of ceramic circuit board
05/14/1991US5015207 Multi-path feed-thru lead and method for formation thereof
05/14/1991US5015206 Solder terminal
05/14/1991US5015193 High density and high signal integrity connector
05/14/1991US5015191 Flat IC chip connector
05/14/1991US5015097 Method for inspecting filled state of via-holes filled with fillers and apparatus for carrying out the method
05/14/1991US5014420 Fusing together metal particles using a high-frequency electromagnetic field
05/14/1991US5014419 Twisted wire jumper electrical interconnector and method of making
05/14/1991CA1284207C Shielding apparatus for a printed circuit board
05/14/1991CA1284190C Dual solder process for connecting electrically conducting terminals of electrical components to printed circuit conductors
05/14/1991CA1284125C Laser marking of pigmented high molecular weight polymer surfaces
05/10/1991CA2029624A1 Aqueous processible photopolymerizable compositions capable of photolytically
05/10/1991CA2029466A1 Apparatus and method for installation of multi-pin components on circuit boards
05/09/1991CA2029479A1 Copper halide imaging system for electronic applications
05/08/1991EP0426609A2 Ceramic insulating substrate and process for producing the same
05/08/1991EP0426600A2 Formation of high quality patterns for substrates and apparatus therefor
05/08/1991EP0426583A1 Double face printed circuit board and method of making it
05/08/1991EP0426533A1 Tape carrier having connection function and method of fabricating the same
05/08/1991EP0426523A2 Direct Write Film plotting method and apparatus
05/08/1991EP0426512A2 Tetrahydrofurfuryl alcohol mixtures used as cleaning agents
05/08/1991EP0426496A2 Planarizing surfaces of interconnect substrates by diamond turning
05/08/1991EP0426373A2 Board dryer
05/08/1991EP0426303A2 A soldering method
05/08/1991EP0426247A1 Method and device for placing air coils on a printed circuit board
05/08/1991EP0426212A1 Process and composition for treating metal surfaces
05/08/1991EP0425866A2 Process and apparatus to bring small quantities of a paste on a circuit board
05/08/1991EP0425703A1 Photo-curable resin laminate and method of producing printed wiring board using the same
05/08/1991EP0425607A1 High-density, multi-level interconnects, flex circuits, and tape for tab
05/08/1991EP0417074A4 Electronic device fabrication by selective doping of a non-conductive polymer
05/08/1991EP0229842B1 Laminator