| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 06/12/1991 | EP0431701A2 A method for forming a photoresist with a cover coat |
| 06/12/1991 | EP0431606A2 Surface structure of ceramics substrate and method of manufacturing the same |
| 06/12/1991 | EP0431566A1 Electrical circuit board interconnect |
| 06/12/1991 | EP0431501A2 Multilayer printed circuit board formation |
| 06/12/1991 | EP0431458A1 Cleaning composition |
| 06/12/1991 | EP0431334A2 Electrical component with conductive path |
| 06/12/1991 | EP0431260A1 Flexible cable connector |
| 06/12/1991 | EP0431095A1 Composition for a solder mask, product thereof and process for using same |
| 06/12/1991 | EP0419577A4 Film-based structural components with controlled coefficient of thermal expansion |
| 06/12/1991 | EP0385979A4 High-density electronic modules, process and product |
| 06/12/1991 | EP0282487B1 Means for use in manufacturing circuit cards and method for manufacturing the means |
| 06/12/1991 | CN1052139A Furfuryl alcohol mixtures for use as cleaning agents |
| 06/11/1991 | US5023916 Method for inspecting the leads of electrical components on surface mount printed circuit boards |
| 06/11/1991 | US5023751 Method of producing a tape for providing electronic modules, and tape obtained by this method |
| 06/11/1991 | US5023580 Surface-mount filter |
| 06/11/1991 | US5023498 Flexible circuit board for motor position adjustment |
| 06/11/1991 | US5023426 Robotic laser soldering apparatus for automated surface assembly of microscopic components |
| 06/11/1991 | US5023407 Printed circuit board with a uniform conductive layer formed by equalization of metals therein |
| 06/11/1991 | US5023205 Method of fabricating hybrid circuit structures |
| 06/11/1991 | US5022968 Oxidation resistance; removable with dilute hydrochloric or sulfuric acid |
| 06/11/1991 | US5022960 Integrating substrate and metal layers, exposing predetermined part of metal layer by laser machining |
| 06/11/1991 | US5022956 Making hole(s) in glass fiber reinforced epoxy resin sheet, plasma etching with tetrafluoromethane and oxygen to remove resin only |
| 06/11/1991 | US5022955 Apparatus and method for self-induced repair of circuit shorts and near-shorts |
| 06/11/1991 | US5022870 Retainer for connector terminals |
| 06/11/1991 | US5022862 Modular connector |
| 06/11/1991 | US5022580 Vernier structure for flip chip bonded devices |
| 06/11/1991 | US5022556 Programmable volume dispensing apparatus |
| 06/11/1991 | CA1284842C Printed circuit boards and method for manufacturing printed circuit boards |
| 06/08/1991 | CA2031421A1 Cleaning composition |
| 06/06/1991 | DE4005157C1 Pressing metal plate for laminates - comprises adhesive and cover films, including glass coating, joined by heat and pressure |
| 06/06/1991 | DE3940407A1 Verfahren zur galvanischen direktmetallisierung Method for galvanic direct metallization |
| 06/06/1991 | DE3939940A1 PCB facilitating automatic component mounting - has holes with tapered lead=in for terminal wires of electronic components |
| 06/06/1991 | DE3939628A1 Adhesive compsn. which can be cured by UV light - used to fix components to hybrid substrates before solder reflow process and can be exposed by radiation through substrate |
| 06/06/1991 | DE3939627A1 Layer circuits with substrate of aluminium oxide or nitride ceramic - are bonded to base of metal, ceramic or plastic using UV-hardenable adhesive |
| 06/06/1991 | DE3925880A1 Printed circuit board mfr. - forming holes in board in press blanking operation using stepper motor driven table |
| 06/06/1991 | CA2031045A1 Multilayer printed circuit board formation |
| 06/05/1991 | EP0430864A2 Method of making electrical interconnections on a universal substrate and device therefor |
| 06/05/1991 | EP0430861A1 Laser soldering system for SMD elements |
| 06/05/1991 | EP0430842A2 Apparatus and method for reworking printed wire circuit boards |
| 06/05/1991 | EP0430416A2 Electroless plating-resisting ink composition |
| 06/05/1991 | EP0430333A1 Laminate for electroless metallization, a printed circuit provided with same, and a process for the manufacture of such a laminate |
| 06/05/1991 | EP0430240A2 Method of mounting an electric part on a circuit board |
| 06/05/1991 | EP0430175A1 Resin composition for forming durable protection coating and process for forming durable protection coating on substrate |
| 06/05/1991 | EP0430157A2 Composite circuit board and manufacturing method of the same |
| 06/05/1991 | EP0430116A2 Method for forming through holes in a polyimide substrate |
| 06/05/1991 | EP0430026A2 Copolymer for use in preparing prepregs, printed circuit wiring boards prepared from such prepregs and processes for preparing such printed circuit wiring boards |
| 06/05/1991 | EP0429689A1 Printed circuit board |
| 06/05/1991 | EP0429664A1 Printed circuit board and method of mounting circuit parts |
| 06/05/1991 | EP0429582A1 Interface member and method for obtaining low-loss electrical interconnection |
| 06/05/1991 | EP0429451A1 Azeotropähnliche bestandteile von dichlortrifluoräthan, methanol und nitromethan. |
| 06/05/1991 | EP0247141B1 System for testing and repairing printed circuit boards |
| 06/05/1991 | CN1051921A Copolymer for use in preparing prepregs, printed circuit wiring boards preparad from such prepregs, and processes for preparing such printed circuit wiring boards |
| 06/05/1991 | CA2031395A1 Method for forming a photoresist with a cover coat |
| 06/05/1991 | CA2025903A1 Electrical component with conductive path |
| 06/04/1991 | US5021821 Film circuit substrate exposure apparatus |
| 06/04/1991 | US5021630 Laser soldering method and apparatus |
| 06/04/1991 | US5021472 Solid fine powders of cured heat resistant resin dispersed in uncured heat resistant resin |
| 06/04/1991 | US5021296 Circuit board and process for producing the same |
| 06/04/1991 | US5021287 Performs lamination without deformation; used for integrated circuits, printed circuit boards |
| 06/04/1991 | US5021269 Method for forming a metal film on the surface of a substrate metal |
| 06/04/1991 | US5021138 Side source center sink plasma reactor |
| 06/04/1991 | US5021129 Multilayer structures of different electroactive materials and methods of fabrication thereof |
| 06/04/1991 | US5021120 Using ultrasonically vibrated etchant bath |
| 06/04/1991 | CA1284692C Multilayer interconnection system for multichip high performance semiconductor packaging |
| 06/04/1991 | CA1284576C Conditioner for the treatment of base materials |
| 06/02/1991 | WO1991008327A1 Process and device for controlling the flow of operations in electroplating plants |
| 06/02/1991 | CA2031392A1 Laser soldering system for smd-components |
| 06/01/1991 | CA2011477A1 Process for producing electrical connections on a universal substrate and apparatus for the same |
| 05/30/1991 | WO1991007590A1 Swash plate piston pump/motor |
| 05/30/1991 | WO1991007527A1 Device for reducing the concentration of field lines in an electroplating plant |
| 05/30/1991 | WO1991007526A1 Method for directly electroplating a dielectric substrate and plated substrate so produced |
| 05/30/1991 | WO1991007248A1 Shield gas wave soldering |
| 05/30/1991 | WO1991007247A1 Method for manufacturing a soldered article |
| 05/30/1991 | WO1991007239A1 Drying method and apparatus therefor |
| 05/30/1991 | CA2030763A1 Method for forming through holes in a polyimide substrate |
| 05/29/1991 | WO1991008324A1 Metallization of non-conductors |
| 05/29/1991 | EP0429027A1 Flame retardant adhesive composition and laminates |
| 05/29/1991 | EP0428997A2 Method for fabricating multilayer circuits |
| 05/29/1991 | EP0428880A1 Ceramic compositions and their use |
| 05/29/1991 | EP0428870A2 Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same |
| 05/29/1991 | EP0428838A1 A method and apparatus for reel to reel manufacturing of high performance multilayer circuit interconnect units |
| 05/29/1991 | EP0428796A1 Liquid degaser in an ebullated bed process |
| 05/29/1991 | EP0428695A1 Improved three-dimensional circuit component assembly and method corresponding thereto |
| 05/29/1991 | EP0277209B1 Wave solder finger shield apparatus |
| 05/29/1991 | DE4037747A1 Printed circuit board - made by vapour coating substrate prepd. with photoresist pattern |
| 05/29/1991 | DE4037555A1 Card contg. semiconductors on PCB and battery - mfd. by moulding of PCB and battery compartment in thermosetting resin and sealing the compartment after battery injection |
| 05/29/1991 | DE4012981A1 Contacting device for circuit board - has facility for easy contacting from mounting side after assembly |
| 05/29/1991 | DE3939676A1 Metallisierung von nichtleitern Metallization of non ladders |
| 05/29/1991 | DE3939256A1 Halte- und kontakteinrichtung fuer in einem elektrolysebad zu behandelnde bauelemente Holding and contact device for in an electrolysis devices to be treated |
| 05/29/1991 | CN2077921U Electromagnetic pump soft-brazed by liquid metal |
| 05/28/1991 | US5019944 Mounting substrate and its production method, and printed wiring board having connector function and its connection method |
| 05/28/1991 | US5019941 Electronic assembly having enhanced heat dissipating capabilities |
| 05/28/1991 | US5019940 Mounting apparatus for electronic device packages |
| 05/28/1991 | US5019700 Multifunction card type electronic apparatus |
| 05/28/1991 | US5019425 Process for the pre-treatment of synthetic materials |
| 05/28/1991 | US5019415 Glow Discharge |
| 05/28/1991 | US5019229 Method of controlling epoxy resin etchant ion concentration |
| 05/28/1991 | US5019222 Copper-Cobalt Alloy |
| 05/28/1991 | US5019210 Method for enhancing the adhesion of polymer surfaces by water vapor plasma treatment |
| 05/28/1991 | US5019209 Method of manufacturing and using a carrier tape for bonding IC devices |