| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 08/31/1994 | EP0612463A1 Device for formation of a film on the walls of holes in printed circuit boards. |
| 08/31/1994 | EP0612343A1 Heat-seal coating using dispersions |
| 08/31/1994 | EP0458948B1 Peroxide composition for removing flux residue and method of using same |
| 08/31/1994 | EP0411142B1 Outer layer material of multilayer printed wiring board and production thereof |
| 08/31/1994 | EP0401314B1 Cryogenic process for metal lift-off |
| 08/30/1994 | US5343366 Packages for stacked integrated circuit chip cubes |
| 08/30/1994 | US5343365 PCB relay having an improved terminal structure |
| 08/30/1994 | US5343359 Apparatus for cooling daughter boards |
| 08/30/1994 | US5342999 Apparatus for adapting semiconductor die pads and method therefor |
| 08/30/1994 | US5342807 Soft bond for semiconductor dies |
| 08/30/1994 | US5342736 Method of wet etching of polyimide |
| 08/30/1994 | US5342694 Treating an autodeposited coating with an alkaline material |
| 08/30/1994 | US5342674 For electronic computers |
| 08/30/1994 | US5342654 Surface roughening of resin molded articles for metallizing |
| 08/30/1994 | US5342501 Method for electroplating metal onto a non-conductive substrate treated with basic accelerating solutions for metal plating |
| 08/30/1994 | US5342468 Depositing a thin film of inorganic metal or alloy over a easy releasing surface, pressing sheet form back to deform substrate, it causes thin film to cut and transferred at pressed part to required electronic part |
| 08/30/1994 | US5342207 Electrical interconnection method and apparatus utilizing raised connecting means |
| 08/30/1994 | US5341980 Method of fabricating electronic circuit device and apparatus for performing the same method |
| 08/30/1994 | CA2030136C Ceramic block filter with co-fired coupling pins |
| 08/30/1994 | CA1331711C Photosensitive thermosetting resin composition and method of forming solder resist pattern by use thereof |
| 08/25/1994 | DE4308895C1 Device for the accurately fitting positioning of printed circuit boards and a printing tool (printing tool) |
| 08/24/1994 | EP0612204A2 Electrical connector header with slip-off positioning cover and method of using same |
| 08/24/1994 | EP0612202A1 Precleaning of soldered circuit cards to prevent white residue |
| 08/24/1994 | EP0611483A1 Method and apparatus for controlled spray etching |
| 08/24/1994 | CN1091233A Method for forming via holes in multilayer circuits |
| 08/23/1994 | US5341274 Printed circuit board with enhanced EMI suppression |
| 08/23/1994 | US5341233 Liquid crystal module with tab assemblies connected through a flexible circuit board |
| 08/23/1994 | US5341157 Laser-driven silk screen mask device |
| 08/23/1994 | US5341115 Reinforced wrap around ground and method |
| 08/23/1994 | US5340947 Copper, silver and gold, or alloys thereof |
| 08/23/1994 | US5340946 Polyesters, polyurethanes, phenoxies, epoxies and blends thereof |
| 08/23/1994 | US5340914 Microwave processing |
| 08/23/1994 | US5340656 Three-dimensional printing techniques |
| 08/23/1994 | US5340640 Conductive ink for use with printed circuit modules |
| 08/23/1994 | US5340639 Printed-wiring board |
| 08/23/1994 | US5340617 Electrostatic patterning of multi-layer module lamina |
| 08/23/1994 | US5340491 Comprising aqueous solution of hydrogen iodide and ferric chloride; for indium tin oxide film |
| 08/23/1994 | US5340451 Process for producing a metal organic polymer combination |
| 08/23/1994 | US5340436 Demetallizing procedure |
| 08/23/1994 | US5340411 Chemial reducing the oxide of tin-lead alloys with dopes cadmium, indium and antimony by immersing in an etching acidic chloride or nitrate solution |
| 08/23/1994 | US5340407 Solubilizing contaminant with terpene, removing with heated water, separating water from mixture |
| 08/23/1994 | US5340318 Conductive elastomeric element electronic connector assembly |
| 08/23/1994 | US5340296 Resilient interconnection bridge |
| 08/23/1994 | US5340013 Rework process for printed circuit cards and solder fountain having gas blanket for carrying out the process |
| 08/23/1994 | US5339844 Low cost equipment for cleaning using liquefiable gases |
| 08/23/1994 | US5339843 Controlled agitation cleaning system |
| 08/23/1994 | US5339537 Continuous drier for flat piece material |
| 08/23/1994 | US5339536 Apparatus and method for solder paste printing process for printed circuit boards |
| 08/23/1994 | US5339519 Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels |
| 08/23/1994 | CA1331578C Conversion of manganese dioxide to permanganate |
| 08/23/1994 | CA1331543C Polymeric films |
| 08/23/1994 | CA1331542C Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom |
| 08/23/1994 | CA1331541C Method for treating a polyimide surface to improve the adhesion of metal deposited thereon, and articles produced thereby |
| 08/23/1994 | CA1331509C Wet lamination process and apparatus |
| 08/18/1994 | WO1994018701A1 Stress-resistant semiconductor chip-circuit board interconnect |
| 08/18/1994 | WO1994018350A1 Alloy to be plated, its plating method and plating solution |
| 08/18/1994 | WO1994018003A1 Metal on plastic films with adhesion-promoting layer |
| 08/18/1994 | WO1994017976A1 Process for the production of plastic laminates with metal laminae especially for printed circuits made from endless bands |
| 08/18/1994 | WO1994017975A1 Process for making plastic laminates with metal laminae for printed circuits especially, with endothermic heating |
| 08/18/1994 | WO1994017950A1 No-clean, low-residue, volatile organic compound free soldering flux and method of use |
| 08/18/1994 | WO1994017949A1 Wave-soldering using a shroud for a gas |
| 08/18/1994 | WO1994017929A1 Apparatus for spray coating |
| 08/17/1994 | EP0611121A2 Systems for patterning dielectrics and structures therefrom |
| 08/17/1994 | EP0611091A1 Process for making metallized vias in diamond substrates |
| 08/17/1994 | EP0611082A1 Improvements in and relating to curing coating materials |
| 08/17/1994 | EP0611064A1 Solder pad configuration for wave soldering |
| 08/17/1994 | EP0610694A1 Methyl chloroform-free desmear process in additive circuitization |
| 08/17/1994 | EP0610631A1 Electrical connector |
| 08/17/1994 | EP0610556A1 Localized surface glazing of ceramic articles |
| 08/17/1994 | EP0610360A1 Process for manufacturing a printed circuit and printed circuit. |
| 08/17/1994 | EP0610344A1 Positive photoresists containing solubility enhancers |
| 08/17/1994 | EP0559777A4 A process and composition for cleaning contaminants with terpene and monobasic ester |
| 08/17/1994 | EP0464199B1 Electrically conductive pressure sensitive adhesive |
| 08/17/1994 | CN1090834A Localized surface glazing of ceramic articles |
| 08/17/1994 | CA2114664A1 Precleaning of soldered circuit cards to prevent white residue |
| 08/16/1994 | US5339269 Semiconductor memory module |
| 08/16/1994 | US5339217 Composite printed circuit board and manufacturing method thereof |
| 08/16/1994 | US5338645 Selective laser vaporization of conductive material from plated surface of radiation tranmitting substrate |
| 08/16/1994 | US5338619 Copper foil for printed circuits and method of producing same |
| 08/16/1994 | US5338567 Printed circuits and base materials precatalyzed for metal deposition |
| 08/16/1994 | US5338392 Forming integral conductive frame and wiring pattern, bonding to base surface, removing frame |
| 08/16/1994 | US5338391 Method of making a substrate having selectively releasing conductive runners |
| 08/16/1994 | US5338360 Device for circulating and applying a viscous material in patches on a substrate |
| 08/16/1994 | US5338351 Ink composition and method of making, using and recovering such composition |
| 08/16/1994 | US5338209 For an electrical connector having a compressible elastic core |
| 08/16/1994 | US5338208 High density electronic connector and method of assembly |
| 08/16/1994 | US5338008 Solder reflow furnace |
| 08/16/1994 | US5337475 Filling the aperturs in self-supporting dielectric layer with a mixture of a glass-ceramic powder, a metal or alloy particle and binders, heating to burn off the binder, sintering to form electroconductive passageway |
| 08/16/1994 | US5337467 Method of producing wire-bonded substrate assembly |
| 08/16/1994 | US5337466 Method of making a multilayer printed wiring board |
| 08/16/1994 | CA1331442C Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition |
| 08/11/1994 | DE4402545A1 Method for the formation of discrete solder points on corresponding contact connection surfaces on a printed circuit board |
| 08/11/1994 | DE4303908A1 Controller |
| 08/10/1994 | EP0646048A4 Electrically conductive compositions and methods for the preparation and use thereof. |
| 08/10/1994 | EP0610089A2 A composition including a catalytic metal-polymer complex and a laminate preform or a laminate formed therefrom |
| 08/10/1994 | EP0609984A1 Method of and apparatus for cover sheet removal from laminated boards |
| 08/10/1994 | EP0609977A1 Electrical connections between printed circuit boards and integrated circuits surface mounted thereon |
| 08/10/1994 | EP0609861A2 Ceramic substrate and manufacturing method thereof |
| 08/10/1994 | EP0609774A1 Printed circuit board or card for direct chip attachment and fabrication thereof |
| 08/10/1994 | EP0609478A1 Method of discrete conformal coating |