Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
09/1994
09/21/1994EP0615678A1 A process and an apparatus for wave soldering.
09/20/1994US5349500 Direct application of unpackaged integrated circuit to flexible printed circuit
09/20/1994US5349235 High density vertically mounted semiconductor package
09/20/1994US5348792 Multilayered wiring board with wiring configurations to reduce crosstalk
09/20/1994US5348784 Antistatic and conductive carpet tile system
09/20/1994US5348693 Formation of three dimensional objects and assemblies
09/20/1994US5348686 Electrically conductive gel
09/20/1994US5348590 Surface treating agent for copper or copper alloys
09/20/1994US5348588 Evaporative treatment of inorganic saponifier wash water
09/20/1994US5348585 Liquid dispensing apparatus
09/20/1994US5348574 Electroless deposition
09/20/1994US5348488 Electrical connector with board-mounting alignment system
09/20/1994US5347925 Solder or conductive paste printing stencil holder
09/20/1994US5347712 Method for manufacturing a multilayer wiring board
09/20/1994US5347711 Termination of multi-conductor electrical cables
09/20/1994US5347710 Parallel processor and method of fabrication
09/15/1994WO1994021098A1 Feedthrough via connection method and apparatus
09/15/1994WO1994021097A2 Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture
09/15/1994WO1994020601A1 Process for producing clean article
09/15/1994DE4407092A1 Printed circuit board for surface-mounted electrical components
09/15/1994DE4405224A1 Method for the connection of a bipolar transistor
09/15/1994DE4337111A1 Printed circuit board for preliminary coating with solder metal layers, and a printed circuit board which has been preliminary coated with it
09/15/1994DE4307900A1 Method and device for perforating ceramic films
09/15/1994DE4307784A1 Method for fabricating printed-circuit boards provided with pads for SMD mounting
09/14/1994EP0615310A2 Press fit connection for components in holes of a printed circuit board
09/14/1994EP0615290A2 Electronic structures having a joining geometry providing reduced capacitive loading
09/14/1994EP0615285A2 Attaching an electronic circuit to a substrate
09/14/1994EP0615284A2 Electronic circuit device
09/14/1994EP0615283A1 Interconnection structure of electronic parts comprising solder bumps with metal core members
09/14/1994EP0615257A2 Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure
09/14/1994EP0615256A2 Method of manufacturing a pattern of an electrically conductive polymer on a substrate surface and method of metallizing such a pattern
09/14/1994EP0615162A2 Infra-red sensitive aqueous wash-off photoimaging element
09/14/1994EP0615001A1 Monitoring electroless plating baths
09/14/1994EP0614721A1 Kinetic solder paste composition
09/14/1994EP0614601A1 Method of manufacturing circuit boards
09/14/1994CN1092240A Method of manufacturing organic substrate used for printed circuits and organic substrate manufactured thereby
09/14/1994CN1092118A Unconducting surface electroplating
09/14/1994CN1025932C Method for manufacture of heating film viscose paper and use thereof
09/13/1994US5347591 Method of and device for determining positioning between a hole and a wiring pattern on a printed circuit board by utilizing a set of area values
09/13/1994US5347462 Method for machining printed circuit board
09/13/1994US5347258 Annular resistor coupled with printed circuit board through-hole
09/13/1994US5347162 Preformed planar structures employing embedded conductors
09/13/1994US5347091 Multilayer circuit card connector
09/13/1994US5346957 Adhesive composition
09/13/1994US5346775 Article comprising solder with improved mechanical properties
09/13/1994US5346750 Porous substrate and conductive ink filled vias for printed circuits
09/13/1994US5346719 Vapordeposition of thin coating of refractory metal, heating to form metal-carbon bonding and continuing deposition
09/13/1994US5346597 By placing in an etching solution containing acid or alkali and applying an alternating current
09/13/1994US5346558 Solderable anisotropically conductive composition and method of using same
09/13/1994US5346401 Electrical connector for translating between first and second sets of terminals having different pitches
09/13/1994US5346118 Surface mount solder assembly of leadless integrated circuit packages to substrates
09/13/1994US5346117 Method of fabricating a parallel processor package
09/13/1994US5345958 Double fluid layer-type ultrasonic cleaning apparatus
09/13/1994CA2031058C Directional stripline structure and manufacture
09/13/1994CA2015772C Process for making hybrid microcircuits providing accurate thick film resistor printing
09/13/1994CA1331927C Positive-type photosensitive electrodeposition coating composition
09/13/1994CA1331926C Photoresist compositions
09/13/1994CA1331914C Micro-electronics devices and methods of manufacturing same
09/08/1994DE4407292A1 Photosensitive resin
09/08/1994DE4406871A1 Print production process
09/08/1994DE4406766A1 Sprühvorrichtung Sprayer
09/08/1994DE4330467C1 Method for soldering surface-mounted electronic components (SMDs) onto printed circuit boards
09/08/1994DE4307134A1 Male connector strip for electrical controllers in motor vehicles
09/08/1994DE4306416A1 Coil structure for a printed circuit board arrangement
09/07/1994EP0614331A2 Printed circuit board
09/07/1994EP0614328A1 Composite molded product having three-dimensional multi-layered conductive circuits and method of its manufacture
09/07/1994EP0614221A1 Integrated transmission line structure
09/07/1994EP0614219A1 Semiconductor chip packaging technology
09/07/1994EP0613765A1 Method for the manufacture of subdividable tiles from a brittle material and device for fixing and grinding the edges of the tiles
09/07/1994EP0613610A1 Magnetic vias within multi-layer, 3-dimensional structures/substrates.
09/07/1994EP0613608A1 Field control and stability enhancement in multilayer, 3-dimensional structures.
09/07/1994EP0613590A1 Die mounting with uniaxial conductive adhesive.
09/07/1994EP0402381B1 New through-hole plated printed circuit board and process for manufacturing same
09/06/1994US5345366 Substrate to substrate standoff assembly
09/06/1994US5345365 Interconnection system for high performance electronic hybrids
09/06/1994US5345364 Edge-connecting printed circuit board
09/06/1994US5345056 Plasma based soldering by indirect heating
09/06/1994US5345040 Device including a conductor truck foil
09/06/1994US5344893 Heat and chemical resistance
09/06/1994US5344747 Printed circuit manufacture, mild alkaline etching in short time
09/06/1994US5344743 Triblock polymers of possibly quaternized vinylpyridine with 1,3-butadiene or isoprene;
09/06/1994US5344740 Positive-type photosensitive electrodeposition coating composition containing quinonediazide resin having an anion-forming group and a nitrogen-containing compound and process for producing circuit plate using same
09/06/1994US5344729 Rigid shell, metal film, photoresist
09/06/1994US5344607 High strength alloys
09/06/1994US5344343 Solder-bearing lead
09/06/1994US5344338 Strain relief structure for connecting flat flexible cable to a circuit board
09/06/1994US5343802 Offset printing method and offset printing machine for the same
09/06/1994US5343616 Method of making high density self-aligning conductive networks and contact clusters
09/06/1994CA2030826C Composite circuit board with thick embedded conductor and method of manufacturing the same
09/01/1994WO1994019809A1 Circuit component stand-off mount
09/01/1994WO1994019726A1 Apparatus and method for machining conductive structures on substrates
09/01/1994WO1994016120A3 Phosphating compositions and processes, particularly for use in fabrication of printed circuits utilizing organic resists
09/01/1994DE4323890A1 Device for profiling and deburring printed circuit boards
08/1994
08/31/1994EP0613332A1 Interconnect for microchip carrier
08/31/1994EP0613331A1 Method of attaching a hybrid circuit on a pcb
08/31/1994EP0613330A1 Discrete wiring method for printed circuit boards and/or electronic component assemblies
08/31/1994EP0613170A1 Method and apparatus for fabrication of thin film semiconductor devices using non-planar, exposure beam lithography
08/31/1994EP0612812A2 Resin composites and method for producing the same
08/31/1994EP0612781A1 Epoxy-terminated polyamides, adhesive made therefrom and methods for producing them
08/31/1994EP0612577A1 Article comprising solder with improved mechical properties, and method of making the solder