| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/03/1991 | EP0435212A1 Process of pretreatment of metal-plating resin molded articles |
| 07/03/1991 | EP0435058A2 Layer transfer process for image production and apparatus to perform the process |
| 07/03/1991 | EP0403643A4 Uniform current and voltage distribution device |
| 07/03/1991 | CN2080293U Dual in-line semiconductor display device with support frame |
| 07/02/1991 | US5029242 Glass-ceramic structure and method for making same |
| 07/02/1991 | US5029043 LC circuit incorporated ceramic substrate |
| 07/02/1991 | US5029041 Electrostatic discharge protection for a printed circuit board |
| 07/02/1991 | US5028986 Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices |
| 07/02/1991 | US5028867 Printed-wiring board |
| 07/02/1991 | US5028743 Printed circuit board with filled throughholes |
| 07/02/1991 | US5028741 High frequency, power semiconductor device |
| 07/02/1991 | US5028473 Three dimensional microcircuit structure and process for fabricating the same from ceramic tape |
| 07/02/1991 | US5028111 Method of fixing cylindrical optical part and electric part |
| 07/02/1991 | US5027505 Method of producing electronic components |
| 07/02/1991 | CA1285625C Circuit board contact guide pattern |
| 06/29/1991 | CA2028201A1 Automated adjustment of air-core coil inductance |
| 06/28/1991 | WO1991010291A1 Board for surge absorbing device of communication line |
| 06/28/1991 | CA2045670A1 Circuit board for surge absorber for communication lines |
| 06/27/1991 | WO1991009511A2 Electrical conductors of conductive resin |
| 06/27/1991 | WO1991009450A1 Power converter circuit board |
| 06/27/1991 | WO1991009087A1 Novel bistriazene compounds and polymeric compositions crosslinked therewith |
| 06/27/1991 | WO1991009081A1 Crosslinkable fluorinated polymer compositions |
| 06/27/1991 | WO1991009071A1 Electronic articles containing a fluorinated poly(arylene ether) dielectric |
| 06/27/1991 | WO1991009070A1 Fluorinated poly(naphthyl ethers) |
| 06/27/1991 | WO1991009062A1 Novel resin, process for preparing the same, and composition comprising the same |
| 06/27/1991 | DE4041071A1 Vorrichtung zur abschirmung und isolierung einer elektronischen schaltungskarte Apparatus for shielding and isolation of an electronic circuit card |
| 06/27/1991 | DE3942509A1 HF circuit with tunable printed coil - having inductance varied by moving relative position of ferrite element i.e. by distance or amt. of coverage |
| 06/27/1991 | DE3942390A1 Parallel bus link between sensors and data units - has identical connection to prevent faulty assembly and give variable bus length |
| 06/26/1991 | EP0434543A2 High-density memory array packaging |
| 06/26/1991 | EP0434471A1 Surface mounted LED package |
| 06/26/1991 | EP0434313A2 Enhanced direct bond structure |
| 06/26/1991 | EP0434312A2 Bonding a conductor to a substrate |
| 06/26/1991 | EP0434311A1 An epoxy/polyimide copolymer blend dielectric and layered circuits incorporating it |
| 06/26/1991 | EP0434192A2 Offset basecard |
| 06/26/1991 | EP0434144A1 Balun |
| 06/26/1991 | EP0433997A2 Improved connector arrangement system and interconnect element |
| 06/26/1991 | EP0433992A1 Method of forming metallized layer on aluminium nitride sintered body |
| 06/26/1991 | EP0433814A2 Keyboard |
| 06/26/1991 | EP0433742A2 Photo module |
| 06/26/1991 | CN1052473A Ceramic-metal bonding |
| 06/25/1991 | US5027256 Component carrier with curved base |
| 06/25/1991 | US5027255 High performance, high current miniaturized low voltage power supply |
| 06/25/1991 | US5027253 Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards |
| 06/25/1991 | US5027089 High frequency noise bypassing |
| 06/25/1991 | US5027088 Signal wiring board |
| 06/25/1991 | US5026748 Matrix filled with three-dimensional arrangement of carbon fibers, thermoplastic, thermosetting or elastomeric resins; bonding electronic components |
| 06/25/1991 | US5026292 Card edge connector |
| 06/25/1991 | US5026134 Optical communication apparatus with base for fixing elements |
| 06/25/1991 | US5025555 Method of producing electric circuit patterns |
| 06/25/1991 | US5025553 Circuit board manufacture |
| 06/25/1991 | US5025552 Method of manufacturing ion current recording head |
| 06/24/1991 | CA2032698A1 Layer transfer process for image production and apparatus to perform the process |
| 06/20/1991 | DE3941814A1 Carrier plate for power semiconductor components - has metal plate provided with ceramics disc divided into pieces between metallised areas |
| 06/19/1991 | EP0433176A2 A multilayer hybrid circuit |
| 06/19/1991 | EP0433093A2 Thermal head for thermal recording machine |
| 06/19/1991 | EP0432907A1 Improved paste compositions |
| 06/19/1991 | EP0432331A2 Rechargeable type small electric appliance |
| 06/18/1991 | US5025348 Bonding structure of an electronic device and a method for manufacturing the same |
| 06/18/1991 | US5025307 Modular semiconductor device |
| 06/18/1991 | US5025211 Technique for reducing electromagnetic interference |
| 06/18/1991 | US5024975 Crystallizable, low dielectric constant, low dielectric loss composition |
| 06/18/1991 | US5024883 Glass matrix with ceramic and metallic particles dispersed therein for enhanced flow characteristics; semiconductor casings |
| 06/18/1991 | US5024871 Ceramic filled fluoropolymetric composite material |
| 06/18/1991 | US5024734 Solder pad/circuit trace interface and a method for generating the same |
| 06/18/1991 | US5024623 Electrical circuit board mounting method |
| 06/18/1991 | US5023994 Method of manufacturing a microwave intergrated circuit substrate including metal lined via holes |
| 06/18/1991 | CA1284922C Flexible multilayer polyimide laminates |
| 06/18/1991 | CA1284862C Molded metalized plastic articles and processes for making the same |
| 06/13/1991 | WO1991008588A1 High power, high density interconnect method and apparatus for integrated circuits |
| 06/13/1991 | WO1991008248A1 Quaternary ammonium polyarylamides |
| 06/12/1991 | EP0431938A1 Dielectric compositions of devitrified glass |
| 06/12/1991 | EP0431834A1 Light-shielding aluminium nitride sintered body and method of manufacturing the same |
| 06/12/1991 | EP0431606A2 Surface structure of ceramics substrate and method of manufacturing the same |
| 06/12/1991 | EP0431524A1 A ceramic substrate material coated with an amorphous fluorine resin |
| 06/12/1991 | EP0431333A1 Method for producing glass cloth |
| 06/12/1991 | EP0431260A1 Flexible cable connector |
| 06/12/1991 | EP0431095A1 Composition for a solder mask, product thereof and process for using same |
| 06/12/1991 | EP0419577A4 Film-based structural components with controlled coefficient of thermal expansion |
| 06/12/1991 | EP0282487B1 Means for use in manufacturing circuit cards and method for manufacturing the means |
| 06/11/1991 | US5023753 Printed circuit |
| 06/11/1991 | US5023751 Method of producing a tape for providing electronic modules, and tape obtained by this method |
| 06/11/1991 | US5023726 Unitary chassis for television receivers with two circuit boards and method of manufacture |
| 06/11/1991 | US5023580 Surface-mount filter |
| 06/11/1991 | US5023498 Flexible circuit board for motor position adjustment |
| 06/11/1991 | US5023407 Printed circuit board with a uniform conductive layer formed by equalization of metals therein |
| 06/11/1991 | US5023202 Rigid strip carrier for integrated circuits |
| 06/11/1991 | US5022956 Making hole(s) in glass fiber reinforced epoxy resin sheet, plasma etching with tetrafluoromethane and oxygen to remove resin only |
| 06/11/1991 | US5022922 Agent for improving composite materials |
| 06/11/1991 | US5022862 Modular connector |
| 06/11/1991 | US5022580 Vernier structure for flip chip bonded devices |
| 06/11/1991 | CA1284801C Dielectric inks for multilayer copper circuits |
| 06/06/1991 | DE3939628A1 Adhesive compsn. which can be cured by UV light - used to fix components to hybrid substrates before solder reflow process and can be exposed by radiation through substrate |
| 06/06/1991 | DE3939627A1 Layer circuits with substrate of aluminium oxide or nitride ceramic - are bonded to base of metal, ceramic or plastic using UV-hardenable adhesive |
| 06/05/1991 | EP0430864A2 Method of making electrical interconnections on a universal substrate and device therefor |
| 06/05/1991 | EP0430842A2 Apparatus and method for reworking printed wire circuit boards |
| 06/05/1991 | EP0430476A1 Improved silicone-polyimide material for electronic devices |
| 06/05/1991 | EP0430333A1 Laminate for electroless metallization, a printed circuit provided with same, and a process for the manufacture of such a laminate |
| 06/05/1991 | EP0430277A1 Conductive paste and conductive coating film |
| 06/05/1991 | EP0430251A1 Connector device having large number of connecting terminals |
| 06/05/1991 | EP0430157A2 Composite circuit board and manufacturing method of the same |