| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/13/1991 | CA1287557C Conductive copper paste composition |
| 08/08/1991 | WO1991011307A1 Method of and material for forming thick filmy pattern |
| 08/07/1991 | EP0440502A1 Laminate and process for producing it |
| 08/07/1991 | EP0439928A1 Directional stripline structure and manufacture |
| 08/07/1991 | CN1013463B Arrangement for deactivating integrated circuits |
| 08/06/1991 | US5038308 Compact system unit for personal computers |
| 08/06/1991 | US5038255 Vehicle lamp |
| 08/06/1991 | US5038252 Printed circuit boards with improved electrical current control |
| 08/06/1991 | US5038251 Electronic apparatus and a method for manufacturing the same |
| 08/06/1991 | US5038195 protective nickel alloy coating to copper leads |
| 08/06/1991 | US5038194 Semiconductor device |
| 08/06/1991 | US5038132 Dual function circuit board, a resistor element therefor, and a circuit embodying the element |
| 08/06/1991 | US5037902 Heat and chemical resistance; electronics |
| 08/06/1991 | US5037862 Polyamide-imide resin pastes |
| 08/06/1991 | US5037691 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products |
| 08/06/1991 | US5037315 Electrical connectors |
| 08/06/1991 | US5037311 High density interconnect strip |
| 08/06/1991 | US5037309 Holder for installing parts on printed circuit board |
| 07/31/1991 | EP0439306A2 Signal line |
| 07/31/1991 | EP0439256A1 Electronic device employing a conductive adhesive |
| 07/31/1991 | EP0439137A2 Substrate for packaging a semiconductor device, packaging structure and method |
| 07/31/1991 | EP0439136A2 Method for electrically connecting and packaging a semiconductor device |
| 07/31/1991 | EP0439134A2 Substrate for packaging a semiconductor device, packaging structure and method |
| 07/31/1991 | EP0439122A2 Electric circuit apparatus |
| 07/31/1991 | EP0438742A1 Method of fabricating a semiconductor device of thin package type |
| 07/30/1991 | US5036431 Package for surface mounted components |
| 07/30/1991 | US5036301 Filter apparatus |
| 07/30/1991 | US5036160 Twisted pair backplane |
| 07/30/1991 | US5036128 UV curable ink containing thermosetting resin binder, ketone-amine curing agent, electroconductive particles |
| 07/30/1991 | US5035980 Photosensitive semi-aqueous developable gold conductor composition |
| 07/30/1991 | US5035965 Printed circuit board having a thin film cell incorporated therein |
| 07/30/1991 | US5035945 Polymeric films |
| 07/30/1991 | US5035939 Manufacture of printed circuit boards |
| 07/30/1991 | US5035837 Containing cuprous and cupric oxide, thick films, printed circuits |
| 07/30/1991 | US5035049 Method for producing a stamped substrate |
| 07/30/1991 | CA1287186C Ic card and connector therefor |
| 07/30/1991 | CA1287185C Support acting as a heat sink for printed circuit boards |
| 07/30/1991 | CA1286876C Apparatus for locating and supporting ceramic substrates |
| 07/25/1991 | WO1991011091A1 Board-mounted thermal path connector |
| 07/25/1991 | WO1991011025A1 A method for manufacturing of mineature impedance matched interconnection patterns |
| 07/25/1991 | WO1991011024A1 Air jet impingement on miniature pin-fin heat sinks |
| 07/25/1991 | WO1991010630A1 Method for reducing shrinkage during firing of green ceramic bodies |
| 07/24/1991 | EP0437980A2 Custom tool printed circuit board |
| 07/24/1991 | EP0437976A2 Voltage-controlled oscillator mounted on laminated printed circuit board |
| 07/24/1991 | EP0437954A1 Optical-electronic interface module |
| 07/24/1991 | EP0437656A1 Composite structure having a specific thermal coefficient of expansion |
| 07/24/1991 | CA2034703A1 Substrate for packaging a semiconductor device |
| 07/24/1991 | CA2034702A1 Method for packaging semiconductor device |
| 07/24/1991 | CA2034700A1 Substrate for packaging a semiconductor device |
| 07/23/1991 | US5034855 Printed circuit assembly |
| 07/23/1991 | US5034850 Thin decoupling capacitor for mounting under integrated circuit package |
| 07/23/1991 | US5034802 Mechanical simultaneous registration of multi-pin surface-mount components to sites on substrates |
| 07/23/1991 | US5034357 Heat-conductive aluminum nitride sintered body and method of manufacturing the same |
| 07/23/1991 | US5034260 Ceramic and circuit substrate and electronic circuit substrate by use thereof |
| 07/23/1991 | US5034257 Conductors and insulators |
| 07/23/1991 | US5033666 Electronics |
| 07/23/1991 | CA1286792C Embedded catalyst receptors for metallization of dielectrics |
| 07/23/1991 | CA1286740C Ic package extracting mechanism used in ic socket |
| 07/23/1991 | CA1286586C Finish laminates for high frequency circuits |
| 07/20/1991 | CA2032921A1 Thermosettable composition |
| 07/17/1991 | EP0437166A2 Thermal cutoff and resistor assembly |
| 07/17/1991 | EP0436943A1 Improved card edge connector |
| 07/17/1991 | EP0436891A2 Electronic keying of multi-board systems |
| 07/17/1991 | EP0436848A2 Matched impedance vertical conductors in multilevel metal dielectric laminated wiring |
| 07/17/1991 | EP0436652A1 Hybrid microchip bonding article |
| 07/17/1991 | EP0436525A1 Wire/disk board-to-board interconnect device |
| 07/16/1991 | US5032892 Depletion mode chip decoupling capacitor |
| 07/16/1991 | US5032803 Directional stripline structure and manufacture |
| 07/16/1991 | US5032737 Ignition circuit module and method of manufacture |
| 07/16/1991 | US5032691 Electric circuit assembly with voltage isolation |
| 07/16/1991 | US5032490 Photosensitive aqueous developable copper conductor composition |
| 07/16/1991 | US5032478 Resolution |
| 07/16/1991 | US5032467 Polyimides, bonding strength |
| 07/16/1991 | US5032451 Toughness |
| 07/16/1991 | US5031461 Matched pair of sensor and amplifier circuits |
| 07/16/1991 | US5031308 Method of manufacturing multilayered printed-wiring-board |
| 07/16/1991 | CA1286440C Flame-retardant resin composition |
| 07/16/1991 | CA1286439C Solderable polymer thick films |
| 07/13/1991 | CA2032654A1 Optical-electronic interface module |
| 07/12/1991 | WO1991011090A1 Method for manufacturing flexible printed circuits, printed circuit thereby manufactured, and device for implementing the method |
| 07/12/1991 | CA2055452A1 Flexible printed circuit fabrication method and device and printed circuit fabricated by said method |
| 07/11/1991 | WO1991010338A1 High-frequency heating device |
| 07/11/1991 | DE4000372A1 Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet |
| 07/11/1991 | DE3943261A1 IC element correcting circuit - has conducting paths punched from metal foil and pressed into U=channels formed in plastic board or casing |
| 07/10/1991 | EP0436212A2 Polyphenylene ether-polyepoxide compositions rapidly curable to flame retardant, solderable materials |
| 07/10/1991 | EP0436134A2 IC card |
| 07/10/1991 | EP0436074A1 Wire bond connection system |
| 07/10/1991 | EP0436006A1 Flexible circuit connector |
| 07/10/1991 | CN1052873A Quaternary ammonium polyarylamides, articles of manufacture formed therefrom, and processes for preparation thereof |
| 07/09/1991 | US5031073 Fault-isolating apparatus and method for connecting circuitry |
| 07/09/1991 | US5031071 Heat spreading device for component leads |
| 07/09/1991 | US5031069 Integration of ceramic capacitor |
| 07/09/1991 | US5031027 Shielded electrical circuit |
| 07/09/1991 | US5030800 Printed wiring board with an electronic wave shielding layer |
| 07/09/1991 | US5030499 Hermetic organic/inorganic interconnection substrate for hybrid circuit manufacture |
| 07/09/1991 | US5030137 Flat cable jumper |
| 07/09/1991 | US5030113 One-piece insulator body and flexible circuit |
| 07/09/1991 | US5030110 Case assembly for stacking integrated circuit packages |
| 07/09/1991 | CA2031743A1 Electronic keying of multi-board systems |
| 07/09/1991 | CA1286010C Electrical connector terminal for a flexible printed circuit board |