| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/03/1991 | US5045437 Method for producing a structured ceramic film or a ceramic member constructed of such films by sintering and useful as ultrasound transducers |
| 09/03/1991 | US5045402 Zirconia toughening of glass-ceramic materials |
| 09/03/1991 | US5045400 Composition for and method of metallizing ceramic surface, and surface-metallized ceramic article |
| 09/03/1991 | US5045381 Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board |
| 09/03/1991 | US5045236 Copper conductive composition |
| 09/03/1991 | US5045159 Derivatives of compounds containing a carbonyl group conjugated to an aromatic moiety and electrophilic methods of fabrication thereof |
| 09/03/1991 | US5045141 Method of making solderable printed circuits formed without plating |
| 09/03/1991 | US5044966 Electrical panel for physically supporting and electrically connecting electrical components |
| 09/03/1991 | US5044963 Surface connector for radio frequency signals |
| 09/03/1991 | US5044312 Conformal coat contact insertion strip mask |
| 09/03/1991 | US5044074 Method for manufacturing metal core printed circuit boards |
| 09/03/1991 | US5044053 Method of manufacturing a curved array ultrasonic transducer assembly |
| 09/03/1991 | CA1288327C Flexible copper-clad circuit substrates |
| 09/03/1991 | CA1288238C Thick film conductor composition |
| 08/29/1991 | DE4006078A1 Ground connection for circuit board - provides conduction track, accessible from both sides, with very small potential difference of even distribution |
| 08/28/1991 | EP0443717A2 Component mounting circuit board |
| 08/28/1991 | EP0443578A1 Multilayer ceramic wiring substrate and pin connecting structure |
| 08/28/1991 | EP0443527A2 Backlighted display panel device |
| 08/28/1991 | EP0443483A1 Soldering procedure for fixing an element as for example a substrate of a hybrid circuit on a heat dissipating base |
| 08/28/1991 | EP0443401A2 Ceramic filled fluoropolymer composite material |
| 08/28/1991 | EP0443400A1 Dielectric composite |
| 08/28/1991 | EP0443311A1 Cable connector for the multipole connection of cables to a board equipped with electrical components |
| 08/28/1991 | EP0443097A1 Three dimensional plating or etching process and masks therefor |
| 08/28/1991 | EP0443009A1 Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing the same |
| 08/28/1991 | CN1054147A Thin film electrical component |
| 08/27/1991 | US5043848 Shielded printed circuit board |
| 08/27/1991 | US5043845 High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact |
| 08/27/1991 | US5043682 Printed circuit dispersive transmission line |
| 08/27/1991 | US5043526 Printed circuit board capable of preventing electromagnetic interference |
| 08/27/1991 | US5043411 Flexible strength and(or) modulus |
| 08/27/1991 | US5043367 Brominated bisphenol-epichlorohydrin adducts |
| 08/27/1991 | US5043302 Glassy binder system for ceramic substrates, thick films and the like |
| 08/27/1991 | US5043227 Polyimide and copper metal laminates |
| 08/27/1991 | US5043223 Multilayer ceramic substrate and method for making the same |
| 08/27/1991 | US5043201 Thin layer of an alkali resistant material overlying a web |
| 08/27/1991 | US5043184 Method of forming electrically conducting layer |
| 08/27/1991 | US5042971 Method of manufacturing an electrical circuit system and electrical circuit system |
| 08/27/1991 | US5042145 Method for mounting an electronic component and memory card using same |
| 08/27/1991 | CA1288189C Epoxy resin composition |
| 08/27/1991 | CA1288140C Surface mount connector |
| 08/24/1991 | WO1991013445A1 Copper alloy composition |
| 08/24/1991 | CA2036818A1 Three dimensional plating or etching process and masks therefor |
| 08/23/1991 | CA2036771A1 Multilayer ceramic wiring substrate and pin connecting structure |
| 08/22/1991 | WO1991012705A1 Thick-film hybrid unit with a plug connection |
| 08/22/1991 | WO1991012108A1 Particle-enhanced joining of metal surfaces |
| 08/22/1991 | DE4005113A1 Dickschichthybridbaugruppe mit einem steckanschluss Thick-film hybrid assembly with a plug connection |
| 08/22/1991 | DE4005076A1 Overvoltage protection for data processing appts. - has common board with overvoltage protection members, and terminal for supply and data sides |
| 08/21/1991 | EP0442703A2 Photoimageable compositions containing fugitive colorants |
| 08/21/1991 | EP0442674A2 Thin film electrical component with polymer substrate |
| 08/21/1991 | EP0442465A2 Thermoplastic resin composition |
| 08/21/1991 | EP0442363A1 Fluorinated polymeric composition, fabrication and use thereof |
| 08/21/1991 | EP0442145A2 Printed circuit board |
| 08/21/1991 | EP0408588A4 Inductive element and method of manufacture |
| 08/21/1991 | CA2034897A1 Support for auxiliary circuit card |
| 08/20/1991 | US5041903 Vertical semiconductor interconnection method and structure |
| 08/20/1991 | US5041800 Lower power oscillator with heated resonator (S), with dual mode or other temperature sensing, possibly with an insulative support structure disposed between the resonator (S) and a resonator enclosure |
| 08/20/1991 | US5041700 Circuit board including an aluminum nitride substrate and a multilayered metal oxynitride structure |
| 08/20/1991 | US5041699 Laminated thermally conductive substrate |
| 08/20/1991 | US5041519 Composition comprising epoxy resin, bismaleimide and barbituric acid |
| 08/20/1991 | US5041478 Maleimidized cyclic phosphonitrile with an aromatic amine and/or aromatic maleimide; heat resistant, moisture resistant |
| 08/20/1991 | US5041327 Different dielectric constant portion with in same substrate |
| 08/20/1991 | US5041187 Mounting light emitting and receiving components on a conductor covered with elongated, flexible dielectric film |
| 08/20/1991 | US5041183 Method for the preparation of a hot-melt adhesive interconnector |
| 08/20/1991 | US5041016 Flexible link connector |
| 08/20/1991 | US5040996 Central circuit arrangement for motor vehicles |
| 08/20/1991 | US5040993 Interchangeable adapter module for electronic devices |
| 08/20/1991 | US5040992 Mounting structure for electronic device |
| 08/20/1991 | US5040501 Valves and valve components |
| 08/20/1991 | US5040292 Method of forming dielectric layer on a metal substrate having improved adhesion |
| 08/20/1991 | CA1287926C Connection transfer contact for fixing a sprong pin on the edge of a hybrid circuit substrate |
| 08/17/1991 | CA2034623A1 Photoimageable compositions containing fugitive colorants |
| 08/14/1991 | EP0441549A1 Matched pair of sensor and amplifier circuits |
| 08/14/1991 | EP0441441A2 Composite dielectric and printed-circuit use substrate utilizing the same |
| 08/14/1991 | EP0441398A2 Display panel unit |
| 08/14/1991 | EP0441294A1 Resistance for hybrid circuits, in particular for high power |
| 08/14/1991 | EP0441238A2 Electrodeposited invar composite foil |
| 08/14/1991 | EP0441164A2 Composition and coating to prevent current induced electro-chemical dendrite formation between conductors on dielectric substrate |
| 08/14/1991 | EP0441159A2 Fluoropolymer insulating material containing hollow microspheres |
| 08/14/1991 | EP0441047A2 Thermosettable composition |
| 08/14/1991 | EP0440945A2 Method of pressing plates from layers of impregnated material using a pressure equalising cushion, and cushion for use in this process |
| 08/14/1991 | EP0440929A2 Process for manufacturing a printed circuit board comprising rigid and flexible parts |
| 08/14/1991 | EP0440928A2 Process for manufacturing a printed circuit board comprising rigid and flexible parts |
| 08/14/1991 | EP0440918A2 Flame retardant, low dielectric constant microsphere filled laminate |
| 08/14/1991 | EP0440822A1 Conductive pattern forming composition and method of producing the same |
| 08/14/1991 | EP0440615A1 Uses of uniaxially electrically conductive articles |
| 08/14/1991 | EP0362213B1 Process for manufacturing a structured ceramic film or a ceramic object composed of such films |
| 08/14/1991 | CN1053818A Electrodeposited foil with controlled properties for printed circuit board applications and procedures and electrolyte bath solutions for preparing same |
| 08/13/1991 | US5040050 Hybrid circuit comprising a cascade connection of parallel-transistor stages |
| 08/13/1991 | US5039965 Radio frequency filter feedthrough structure for multilayer circuit boards |
| 08/13/1991 | US5039964 Inductance and capacitance noise filter |
| 08/13/1991 | US5039836 Radiation manufacturing apparatus and method |
| 08/13/1991 | US5039824 Printed circuit having twisted conductor lines printed thereon |
| 08/13/1991 | US5039730 Fiber reinforced heat-resistant polyolefin compositions |
| 08/13/1991 | US5039628 Flip substrate for chip mount |
| 08/13/1991 | US5039577 Bonded composite;,particle reinforced metal, graphite reinforced metal |
| 08/13/1991 | US5039570 Resistive laminate for printed circuit boards, method and apparatus for forming the same |
| 08/13/1991 | US5039552 Method of making thick film gold conductor |
| 08/13/1991 | US5039472 Isopropanl and methylene chloride or resorcinol solvents before printed circuit pattern is transferred |
| 08/13/1991 | CA1287694C Composite dielectric structure for optimizing electrical performance in highperformance chip support packages |
| 08/13/1991 | CA1287693C Tape automated bonding package |