| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/19/1994 | US5330365 Adapter for mating two connectors |
| 07/19/1994 | US5330096 Method of wave soldering with unique solder pad configuration |
| 07/19/1994 | US5329696 Method of manufacturing electronic device |
| 07/19/1994 | US5329695 Method of manufacturing a multilayer circuit board |
| 07/14/1994 | DE4300342A1 Vehicle air-bag control device |
| 07/13/1994 | EP0606104A2 Rechargeable type small electric appliance |
| 07/13/1994 | EP0606043A1 Printed circuit board for injection molding system |
| 07/13/1994 | EP0605982A2 Multi-chip module board |
| 07/13/1994 | EP0605842A1 Arrangement for a vehicle |
| 07/13/1994 | EP0605807A1 Trifunctional cyanate esters, polymers thereof, use and preparation thereof |
| 07/13/1994 | EP0605712A1 Packaging electrical components |
| 07/13/1994 | EP0605421A1 Low dielectric constant substrate and method of making |
| 07/13/1994 | CN1089423A Printing wiring board |
| 07/13/1994 | CN1089213A Polynorbornene prepreg laminated to conductive surface |
| 07/12/1994 | US5329428 High-density packaging for multiple removable electronics subassemblies |
| 07/12/1994 | US5329418 3-D communication and interconnect technique for increased number of computational modules in large-scale electronic equipment |
| 07/12/1994 | US5329159 Semiconductor device employing an aluminum clad leadframe |
| 07/12/1994 | US5329158 Surface mountable semiconductor device having self loaded solder joints |
| 07/12/1994 | US5329047 Aromatic allyl amine thermosetting resin composition |
| 07/12/1994 | US5328751 Ceramic circuit board with a curved lead terminal |
| 07/12/1994 | US5328715 Process for making metallized vias in diamond substrates |
| 07/12/1994 | US5328566 Process for producing inorganic fiber-based prepreg sheet and process for producing insulating laminate |
| 07/12/1994 | US5328376 Patterned laminar electrical interconnection |
| 07/07/1994 | WO1994015399A1 Programmable interconnect architecture |
| 07/07/1994 | WO1994015344A1 Water-based polymer thick film conductive ink |
| 07/07/1994 | DE4342635A1 Überspannungsschutz für elektrische Geräte Surge protection for electrical equipment |
| 07/07/1994 | DE4317184C1 Smart card mfr. e.g. for credit, debit esp. telephone card |
| 07/06/1994 | EP0605399A2 Multilayered wiring board and method for manufacturing the same |
| 07/06/1994 | EP0605346A2 Improved ceramic green sheets of controlled microporosity and method for producing same |
| 07/06/1994 | EP0604893A2 Liquid crystal apparatus |
| 07/06/1994 | EP0604838A1 Multiaxially reinforced liquid crystal polymer sheet |
| 07/06/1994 | EP0604799A1 Coated filler and use thereof |
| 07/06/1994 | EP0598006A4 Solder plate reflow method for forming a solder bump on a circuit trace. |
| 07/05/1994 | US5327326 Large scale integrated package structure |
| 07/05/1994 | US5326937 Grounding structure of a printed wiring board |
| 07/05/1994 | US5326813 Rigidity, heat resistance |
| 07/05/1994 | US5326794 Barbituric acid-modified bismaleimide with diamine and polyisocyanate-modified epoxy resin |
| 07/05/1994 | US5326671 Triazine polymers |
| 07/05/1994 | US5326643 Terminally unsaturated polyimide |
| 07/05/1994 | US5326636 Assembly using electrically conductive cement |
| 07/05/1994 | US5326623 Multilayer circuits with ceramic substrates, patterns bonded with titanium and conductors |
| 07/05/1994 | US5326593 Surface roughening of resin molded articles for metallizing |
| 07/05/1994 | US5326428 Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
| 07/05/1994 | US5326284 Circuit assemblies of printed circuit boards and telecommunications connectors |
| 07/05/1994 | US5326161 Assembly and elastomeric seating member for providing a flexable seat for a member |
| 07/05/1994 | US5326051 Electro-expulsive deicing system having circuit board expulsive members |
| 07/05/1994 | US5325583 Method for manufacturing printed circuit board |
| 07/05/1994 | CA2049626C Matt film |
| 06/30/1994 | DE4344791A1 Electrical connector for connecting two PCBs |
| 06/30/1994 | DE4343706A1 Heat-resistant electronic constructional element |
| 06/30/1994 | DE4343127A1 Load secure electronic component assembly |
| 06/30/1994 | DE4342818A1 Zusammengesetztes elektronisches Bauteil The composite electronic component |
| 06/30/1994 | DE4326825A1 HF screening method for PCB |
| 06/29/1994 | EP0604333A1 Device of interconnected boards for a rapid information system |
| 06/29/1994 | EP0603909A1 Microwave tubular core transformer |
| 06/29/1994 | EP0603745A1 Composite printed circuit board substrate and process for its manufacture |
| 06/29/1994 | EP0603739A1 Stress resistant electronic assembly |
| 06/29/1994 | EP0603532A1 Liquid crystal display device |
| 06/29/1994 | EP0603339A1 Polyimide copolymers containing 3,3',4,4'-tetracarboxybiphenyl dianhydride (bpda) moieties |
| 06/29/1994 | EP0603282A1 Method of making co-fired, multilayer substrates |
| 06/29/1994 | EP0494879B1 Coil arrangement for a focussing or track control circuit |
| 06/28/1994 | US5325267 Remote driver board having input/output connector circuitry molded therein |
| 06/28/1994 | US5325072 High-frequency power amplifier device and high-frequency module including the same |
| 06/28/1994 | US5324936 Hybrid optical/electrical circuit module with thermal insulation |
| 06/28/1994 | US5324810 Low thermal expansion, dielectric; waterproof |
| 06/28/1994 | US5324766 Resin composition for forming plated layer and use thereof |
| 06/28/1994 | US5324475 Process for preparing biaxially stretched isotropic polyimide film |
| 06/28/1994 | US5324370 Firing hybrid laminate |
| 06/28/1994 | US5323534 Process for producing coaxial conductor interconnection wiring board |
| 06/28/1994 | US5323533 Method of producing coaxial connections for an electronic component, and component package |
| 06/28/1994 | US5323520 Process for fabricating a substrate with thin film capacitor |
| 06/23/1994 | WO1994013867A1 Adhesive metal foil and laminates comprising said metal foil |
| 06/23/1994 | WO1994013485A1 Electrical insulation from biaxially oriented penbb film |
| 06/23/1994 | DE4343934A1 Thick-film substrate mfg. method |
| 06/23/1994 | DE4343526A1 Vermiculite foil prodn. for thermal insulation and flame retardant coat - by applying unflocculated colloidal dispersion of delaminated flake to flexible carrier retaining wet foil and release dry foil |
| 06/23/1994 | DE4242944A1 Electric control device |
| 06/23/1994 | DE4242943A1 Electric device |
| 06/22/1994 | EP0603098A1 Magneto-repulsion punching with dynamic damping |
| 06/22/1994 | EP0602664A2 Specifically shaped sheet members for improving electromagnetic compatibility |
| 06/22/1994 | EP0602610A1 Electrical interconnection system with raised connection means |
| 06/22/1994 | EP0602609A1 Electrical interconnects having a supported bulge configuration |
| 06/22/1994 | EP0602484A2 Electrically balanced connector assembly |
| 06/22/1994 | EP0602328A2 Wire interconnect structures for connecting an integrated circuit to a substrate |
| 06/22/1994 | EP0602298A1 Process for dissipating heat from a semiconductor package |
| 06/22/1994 | EP0602258A1 Printed circuit with local higher wiring density and conical via holes and method of manufacturing such printed circuits |
| 06/22/1994 | EP0602257A1 Printed circuits with local higher wiring density and method for manufacturing such printed circuits |
| 06/22/1994 | EP0602252A1 Ceramic green sheet |
| 06/22/1994 | CN1088338A Specifically configured sheet members or articles for use in improving sound or image quality |
| 06/21/1994 | USRE34641 Method of producing electrical conductor |
| 06/21/1994 | US5322976 Process for forming polyimide-metal laminates |
| 06/21/1994 | US5321884 Multilayered flexible circuit package |
| 06/21/1994 | CA2041765C Surface mounted electrical connector |
| 06/21/1994 | CA2011205C Method of making laminated ptfe-containing composites and products thereof |
| 06/16/1994 | DE4341867A1 Micro-assemblies printed mounting and assembly connectors printing method - involves pressing micro-components against connection areas on substrate to expand connecting material layers on these areas |
| 06/16/1994 | DE4242097A1 EM compatibility protection for hybrid components - is provided by chip capacitor filter on ceramic carrier for suppression of direct irradiation and cable-conducted interference |
| 06/16/1994 | DE4240996C1 Circuit board assembly with islands of rapid setting fusible adhesive - positioned in adhesive layer before components are positioned for rapid assembly and mounting irrespective of adhesive setting time |
| 06/15/1994 | EP0601621A1 Three dimensional imaging system |
| 06/15/1994 | EP0601354A2 Dicyanate prepolymers, use and preparation thereof |
| 06/15/1994 | EP0601203A1 Photosensitive resin composition |
| 06/15/1994 | EP0601011A1 Manufacturing method for electrical circuit board |