| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/18/1994 | DE4304654A1 Method and arrangement for the temperature regulation of a component |
| 08/18/1994 | DE4304437A1 Integrated circuit, in particular for contact switches, and method for producing an integrated circuit |
| 08/17/1994 | EP0611121A2 Systems for patterning dielectrics and structures therefrom |
| 08/17/1994 | EP0611091A1 Process for making metallized vias in diamond substrates |
| 08/17/1994 | EP0611068A1 Circuit card assembly |
| 08/17/1994 | EP0611064A1 Solder pad configuration for wave soldering |
| 08/17/1994 | EP0610929A1 Film forming solution, porous film obtained therefrom and coated material with the porous film |
| 08/17/1994 | EP0610631A1 Electrical connector |
| 08/17/1994 | EP0610556A1 Localized surface glazing of ceramic articles |
| 08/17/1994 | EP0610425A1 Process for preparing a polyimide film with a preselected value for cte. |
| 08/17/1994 | EP0610385A1 Low thermal expansion coefficient polyimides with improved elongation. |
| 08/17/1994 | EP0538280B1 Rheostatic switching arrangement |
| 08/17/1994 | CN1090834A Localized surface glazing of ceramic articles |
| 08/16/1994 | US5339269 Semiconductor memory module |
| 08/16/1994 | US5339219 Modulated electronic breadboard |
| 08/16/1994 | US5339218 Surface mount device |
| 08/16/1994 | US5339217 Composite printed circuit board and manufacturing method thereof |
| 08/16/1994 | US5338710 Ceramic substrate sintered at low temperatures |
| 08/16/1994 | US5338567 Printed circuits and base materials precatalyzed for metal deposition |
| 08/16/1994 | US5337475 Filling the aperturs in self-supporting dielectric layer with a mixture of a glass-ceramic powder, a metal or alloy particle and binders, heating to burn off the binder, sintering to form electroconductive passageway |
| 08/16/1994 | US5337466 Method of making a multilayer printed wiring board |
| 08/16/1994 | CA1331442C Fabrication of flexible electronic circuitry using a modified latex polymer laminating adhesive composition |
| 08/11/1994 | DE4303908A1 Controller |
| 08/11/1994 | DE4303793A1 Busbar arrangement |
| 08/11/1994 | CA2115334A1 Film forming solution, porous film obtained therefrom and coated material with the porous film |
| 08/10/1994 | EP0646048A4 Electrically conductive compositions and methods for the preparation and use thereof. |
| 08/10/1994 | EP0610089A2 A composition including a catalytic metal-polymer complex and a laminate preform or a laminate formed therefrom |
| 08/10/1994 | EP0610075A1 Polyphenylene oxide epoxy prepegs |
| 08/10/1994 | EP0609861A2 Ceramic substrate and manufacturing method thereof |
| 08/10/1994 | EP0609774A1 Printed circuit board or card for direct chip attachment and fabrication thereof |
| 08/10/1994 | EP0609552A2 Front closure for electrical cabinets, cases, frames and the like |
| 08/09/1994 | US5337218 Circuit card interconnecting structure |
| 08/09/1994 | US5336855 Multilayer printed circuit board, in particular, for high-frequency operation |
| 08/09/1994 | US5336752 Reacting a phenol and the Diels-Alder product of a diene using an acid catalyst; deactivating and removing the catalyst by treating with a hydrotalcite |
| 08/09/1994 | US5336444 Fritless metallurgical paste containing copper and iron, nickel or cobalt dispersed in organic medium |
| 08/09/1994 | US5336391 Nickel-phosphorus electrical resistant layer |
| 08/09/1994 | US5336368 Method for depositing conductive metal traces on diamond |
| 08/09/1994 | US5336348 Heat insulation in printed circuits, flame retardant wrappings |
| 08/09/1994 | US5336301 Conductive copper paste |
| 08/09/1994 | US5336113 Connection device |
| 08/09/1994 | US5336094 Apparatus for interconnecting electrical contacts |
| 08/09/1994 | US5335553 Fluidic gas meter provided with a printed wiring board |
| 08/09/1994 | CA2089060A1 Intelligent foil transfer |
| 08/09/1994 | CA1331279C Magnesium titanate ceramic and dual dielectric substrate using same |
| 08/04/1994 | WO1994017541A1 Conductive lacquer contact surface |
| 08/04/1994 | WO1994017140A1 Resin composition for electronic parts |
| 08/04/1994 | WO1994017129A1 Process for surface treatment of moulded polymers of cyclo-olefins and polymer mould obtainable therewith |
| 08/03/1994 | EP0609074A2 Assembly structure of a flat type device |
| 08/03/1994 | EP0608726A1 Process for plating through-connections between conducting foils |
| 08/03/1994 | EP0608603A1 Improved copper-based metallizations for hybrid integrated circuits |
| 08/03/1994 | EP0608529A2 Shield flat cable |
| 08/03/1994 | EP0608221A1 Interconnector. |
| 08/03/1994 | CN1090399A Photosensitive dielectric sheet composition and multilayer interconnect circuits |
| 08/02/1994 | US5335146 High density packaging for device requiring large numbers of unique signals utilizing orthogonal plugging and zero insertion force connetors |
| 08/02/1994 | US5335145 IC card and method of manufacturing the same |
| 08/02/1994 | US5334875 Stacked semiconductor memory device and semiconductor memory module containing the same |
| 08/02/1994 | US5334809 Particle enhanced joining of metal surfaces |
| 08/02/1994 | US5334804 Wire interconnect structures for connecting an integrated circuit to a substrate |
| 08/02/1994 | US5334800 Flexible shielded circuit board |
| 08/02/1994 | US5334798 Interconnect cable with built-in shielding and method of use |
| 08/02/1994 | US5334696 Polyimide resin laminates |
| 08/02/1994 | US5334645 Inorganic fibers has high dielectric constant, low dielectric loss tangent, acid and alkali resistance, waterproofing, high strain points |
| 08/02/1994 | US5334487 Method for forming a patterned layer on a substrate |
| 08/02/1994 | US5334422 Electrical connector having energy-formed solder stops and methods of making and using the same |
| 08/02/1994 | US5334330 Mixture of electrically conductive particles and electrically nonconductive but thermally conductive particles in polymer matrix |
| 08/02/1994 | US5334279 Forming a three dimensional female molds by photolithography on metal plates |
| 08/02/1994 | US5334030 PCMCIA bus extender card for PCMCIA system development |
| 08/02/1994 | US5333379 Method of producing a three-dimensional wiring board |
| 08/02/1994 | CA1331245C Thermally conductive ceramic/polymer composites |
| 07/28/1994 | DE4302196A1 Functional variation of surface mount technology circuit on baseboard |
| 07/27/1994 | EP0608007A2 Styrene polymer composition |
| 07/27/1994 | EP0607929A2 Flexible printed circuit board and ink jet recording head using the same |
| 07/27/1994 | EP0607846A1 One piece plastic part, especially injection molded part |
| 07/27/1994 | EP0607845A1 One piece insulating part, especially injection molded part |
| 07/27/1994 | EP0607844A1 One piece insulating part, especially injection molded part |
| 07/27/1994 | EP0607843A1 One piece insulating part, especially injection molded part |
| 07/27/1994 | EP0607842A1 One piece insulating part which is covered with a metal film on at least one side |
| 07/27/1994 | EP0607732A2 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal |
| 07/27/1994 | EP0607730A1 Method of direct transferring of electrically conductive elements into a substrate |
| 07/27/1994 | EP0607534A2 Method of manufacturing multilayered printed-wiring-board |
| 07/27/1994 | EP0607532A2 Method of manufacturing multilayered printed-wiring-board |
| 07/27/1994 | EP0607255A1 Silver-rich conductor compositions for high thermal cycled and aged adhesion. |
| 07/26/1994 | US5333099 Electrical component having a sandwich-like sub-assembly |
| 07/26/1994 | US5332869 Printed circuit board, a method of its fabrication and a method of attaching electronic parts thereto |
| 07/26/1994 | US5332439 Screen printing apparatus for filling through-holes in circuit board with paste |
| 07/26/1994 | US5332348 Fastening devices |
| 07/21/1994 | WO1994015816A1 Junction box having integrally formed shunt |
| 07/21/1994 | DE4300899A1 Array of mounted electronic components |
| 07/20/1994 | EP0606947A1 Epoxy resin and epoxy resin compositions for electric laminates |
| 07/20/1994 | EP0606813A2 Process for corrosion free multi-layer metal conductors |
| 07/20/1994 | EP0606645A1 Method for forming via holes in multilayer circuits |
| 07/20/1994 | EP0606500A1 Thermosetting resin composition and production of copper-clad laminated board therefrom |
| 07/20/1994 | EP0606216A1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias. |
| 07/19/1994 | US5331516 Portable semiconductor apparatus |
| 07/19/1994 | US5331515 Module with leads from multiple chips shorted together only at edge contact locations |
| 07/19/1994 | US5331512 Surface-mount LED |
| 07/19/1994 | US5331040 Adhesives for laminating polyimide film to copper foil, flexible circuits |
| 07/19/1994 | US5331029 Resin for bonding polyarylene sulfide and adhesive |
| 07/19/1994 | US5330825 Printed circuit substrate with projected electrode and connection method |
| 07/19/1994 | US5330613 Electric connection method |