| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 09/20/1994 | US5349155 Insulating material for wiring substrate and method of producing multi-layered wiring substrate |
| 09/20/1994 | US5348792 Multilayered wiring board with wiring configurations to reduce crosstalk |
| 09/20/1994 | US5348632 Method of plasma treating a surface of a workpiece, vacuum treatment apparatus and previously plasma treated plastic article |
| 09/20/1994 | US5348574 Electroless deposition |
| 09/20/1994 | US5347712 Method for manufacturing a multilayer wiring board |
| 09/20/1994 | US5347710 Parallel processor and method of fabrication |
| 09/20/1994 | CA2119091A1 Sulfonate and carbamate derivatives of 3-aroylbenzo¬b|thiophenes |
| 09/15/1994 | WO1994021098A1 Feedthrough via connection method and apparatus |
| 09/15/1994 | WO1994021014A1 Arc detection in neon lighting systems |
| 09/15/1994 | DE4407092A1 Printed circuit board for surface-mounted electrical components |
| 09/15/1994 | DE4405224A1 Method for the connection of a bipolar transistor |
| 09/15/1994 | DE4337111A1 Printed circuit board for preliminary coating with solder metal layers, and a printed circuit board which has been preliminary coated with it |
| 09/15/1994 | DE4307900A1 Method and device for perforating ceramic films |
| 09/14/1994 | EP0615290A2 Electronic structures having a joining geometry providing reduced capacitive loading |
| 09/14/1994 | EP0615185A1 Integrated computer terminal |
| 09/14/1994 | EP0614470A1 Phosporous containing resin. |
| 09/14/1994 | CN1092240A Method of manufacturing organic substrate used for printed circuits and organic substrate manufactured thereby |
| 09/13/1994 | US5347426 Electronic device including a passive electronic component |
| 09/13/1994 | US5347258 Annular resistor coupled with printed circuit board through-hole |
| 09/13/1994 | US5347182 Device for indicating that an optional component is mounted on a board |
| 09/13/1994 | US5347091 Multilayer circuit card connector |
| 09/13/1994 | US5346751 Electronic package using closed pore composites |
| 09/13/1994 | US5346750 Porous substrate and conductive ink filled vias for printed circuits |
| 09/13/1994 | US5346747 Thermotropic liquid crystal polymers |
| 09/13/1994 | US5346719 Vapordeposition of thin coating of refractory metal, heating to form metal-carbon bonding and continuing deposition |
| 09/13/1994 | US5346651 Silver containing conductive coatings |
| 09/13/1994 | US5346597 By placing in an etching solution containing acid or alkali and applying an alternating current |
| 09/13/1994 | US5346402 Electronic circuit device and manufacturing method thereof |
| 09/13/1994 | US5346401 Electrical connector for translating between first and second sets of terminals having different pitches |
| 09/13/1994 | US5346117 Method of fabricating a parallel processor package |
| 09/13/1994 | US5345673 Method of manufacturing a printed wiring board |
| 09/13/1994 | CA2031058C Directional stripline structure and manufacture |
| 09/13/1994 | CA2015772C Process for making hybrid microcircuits providing accurate thick film resistor printing |
| 09/13/1994 | CA1331914C Micro-electronics devices and methods of manufacturing same |
| 09/08/1994 | DE4307613A1 Arrangement for keyboards of communication terminals |
| 09/08/1994 | DE4307134A1 Male connector strip for electrical controllers in motor vehicles |
| 09/08/1994 | DE4306416A1 Coil structure for a printed circuit board arrangement |
| 09/07/1994 | EP0614331A2 Printed circuit board |
| 09/07/1994 | EP0614328A1 Composite molded product having three-dimensional multi-layered conductive circuits and method of its manufacture |
| 09/07/1994 | EP0614221A1 Integrated transmission line structure |
| 09/07/1994 | EP0614220A2 Multichip module |
| 09/07/1994 | EP0614202A2 Three-terminal capacitor and assembly |
| 09/07/1994 | EP0613765A1 Method for the manufacture of subdividable tiles from a brittle material and device for fixing and grinding the edges of the tiles |
| 09/07/1994 | EP0613610A1 Magnetic vias within multi-layer, 3-dimensional structures/substrates. |
| 09/07/1994 | EP0613609A1 Dielectric vias within multilayer 3-dimensional structures/substrates |
| 09/07/1994 | EP0613608A1 Field control and stability enhancement in multilayer, 3-dimensional structures. |
| 09/06/1994 | US5345412 Memory IC and memory device capable of expansion of storage capacity |
| 09/06/1994 | US5345364 Edge-connecting printed circuit board |
| 09/06/1994 | US5345040 Device including a conductor truck foil |
| 09/06/1994 | US5344868 Polyglutarimide/glass fiber combinations |
| 09/06/1994 | US5344729 Rigid shell, metal film, photoresist |
| 09/06/1994 | US5344592 Organic vehicle for electronic composition |
| 09/06/1994 | US5344503 Method of preventing oxidation of copper powder |
| 09/06/1994 | US5343616 Method of making high density self-aligning conductive networks and contact clusters |
| 09/06/1994 | CA2030826C Composite circuit board with thick embedded conductor and method of manufacturing the same |
| 09/01/1994 | WO1994019725A1 Photosensitive resin composition and process for forming relief pattern therefrom |
| 09/01/1994 | WO1994019385A1 Process for preparation of stable, moulded thermoset polymers of cyclo-olefins and thermoset moulded polymers |
| 09/01/1994 | DE4305793A1 Power module |
| 08/31/1994 | EP0613331A1 Method of attaching a hybrid circuit on a pcb |
| 08/31/1994 | EP0613330A1 Discrete wiring method for printed circuit boards and/or electronic component assemblies |
| 08/31/1994 | EP0613170A1 Method and apparatus for fabrication of thin film semiconductor devices using non-planar, exposure beam lithography |
| 08/31/1994 | EP0613076A1 Circuit board receptacle and IC packages for multiple and single supply circuits |
| 08/31/1994 | EP0612812A2 Resin composites and method for producing the same |
| 08/31/1994 | EP0612783A1 Cyanate resin composition and copper-clad laminate |
| 08/31/1994 | EP0612782A1 Cyanate resin composition and copper-clad laminate using the composition |
| 08/31/1994 | EP0612778A1 Epoxy resin composition |
| 08/31/1994 | EP0612610A1 A liquid crystal polymer film and a manufacturing process therefor |
| 08/31/1994 | EP0612439A1 High-voltage insulating disk |
| 08/31/1994 | EP0411142B1 Outer layer material of multilayer printed wiring board and production thereof |
| 08/30/1994 | US5343366 Packages for stacked integrated circuit chip cubes |
| 08/30/1994 | US5343365 PCB relay having an improved terminal structure |
| 08/30/1994 | US5343359 Apparatus for cooling daughter boards |
| 08/30/1994 | US5343075 Composite stacked semiconductor device with contact plates |
| 08/30/1994 | US5342999 Apparatus for adapting semiconductor die pads and method therefor |
| 08/30/1994 | US5342736 Method of wet etching of polyimide |
| 08/30/1994 | US5342674 For electronic computers |
| 08/30/1994 | US5342654 Surface roughening of resin molded articles for metallizing |
| 08/30/1994 | US5342207 Electrical interconnection method and apparatus utilizing raised connecting means |
| 08/25/1994 | DE4319599C1 Hearing aid |
| 08/24/1994 | EP0611627A2 Organic vehicle for electronic composition |
| 08/24/1994 | EP0611389A1 Uses of 1,1,1,3,3,3-hexafluoropropane. |
| 08/24/1994 | CN1091233A Method for forming via holes in multilayer circuits |
| 08/24/1994 | CA2115537A1 Cyanate resin composition and copper-clad laminate using the composition |
| 08/24/1994 | CA2115409A1 Cyanate resin composition and copper-clad laminate |
| 08/23/1994 | US5341509 Parallel processing system including a stack of bus-printed disks and a plurality of radially exending processing unit boards |
| 08/23/1994 | US5341419 Capacitive unbalancing for reduction of differential mode cross-talk |
| 08/23/1994 | US5341274 Printed circuit board with enhanced EMI suppression |
| 08/23/1994 | US5341115 Reinforced wrap around ground and method |
| 08/23/1994 | US5340947 Copper, silver and gold, or alloys thereof |
| 08/23/1994 | US5340914 Microwave processing |
| 08/23/1994 | US5340641 Electrical overstress pulse protection |
| 08/23/1994 | US5340640 Conductive ink for use with printed circuit modules |
| 08/23/1994 | US5340617 Electrostatic patterning of multi-layer module lamina |
| 08/23/1994 | US5340451 Process for producing a metal organic polymer combination |
| 08/23/1994 | US5340436 Demetallizing procedure |
| 08/23/1994 | US5340296 Resilient interconnection bridge |
| 08/23/1994 | US5339519 Method of cooling an electrical device using a heat sink attached to a circuit board containing heat conductive layers and channels |
| 08/18/1994 | WO1994018812A1 A circuit board arrangement including shielding grids, and constructing thereof |
| 08/18/1994 | WO1994018701A1 Stress-resistant semiconductor chip-circuit board interconnect |
| 08/18/1994 | WO1994018003A1 Metal on plastic films with adhesion-promoting layer |