Patents for H05K 1 - Printed circuits (98,583)
06/1999
06/22/1999US5914864 Shock and vibration attenuating structure for an electronic assembly
06/22/1999US5914862 Radio frequency identification tag
06/22/1999US5914861 Circuit-board overlaid with a copper material on both sides or in multiple layers and a method of fabricating same
06/22/1999US5914859 Electronic component mounting base board and method of producing the same
06/22/1999US5914644 Printed-circuit board-mountable ferrite EMI filter
06/22/1999US5914577 Power train partition for 10 horsepower motor controller
06/22/1999US5914536 Semiconductor device and soldering portion inspecting method therefor
06/22/1999US5914534 Three-dimensional multi-layer molded electronic device and method for manufacturing same
06/22/1999US5914530 Semiconductor device
06/22/1999US5914481 Portable data collection terminal with handwritten input area
06/22/1999US5914358 Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same
06/22/1999US5914283 Low dielectric polymer and film, substrate and electronic part using the same
06/22/1999US5914216 Multilayer circuit board and photosensitive resin composition used therefor
06/22/1999US5914179 Flexible circuit board and production method therefor
06/22/1999US5914002 Method and system for producing a reinforcement for a composite component
06/22/1999US5913702 Low cross-talk network connector
06/22/1999US5913552 From heat
06/19/1999CA2225268A1 Electrical connection arrangement
06/19/1999CA2225235A1 A line interface module
06/17/1999WO1999030542A1 Method of manufacturing multilayer printed wiring board
06/17/1999WO1999030388A1 A method of reducing high frequency coupling between pairs of conductors in a connector, and a connector for transferring differential signals
06/17/1999WO1999030376A2 Battery-included pcb
06/17/1999WO1999029761A2 Poly(arylene ether) compositions and methods of manufacture thereof
06/17/1999DE19822782A1 Monolithic multilayer electronic part exhibits minimal silver diffusion from internal electrodes
06/17/1999DE19755619A1 Control- or regulation system
06/17/1999DE19753060A1 Electronic circuit board module
06/17/1999CA2311802A1 A method of reducing high frequency coupling between pairs of conductors in a connector, and a connector for transferring differential signals
06/16/1999EP0923277A2 Printed circuit board
06/16/1999EP0923120A1 Method for manufacturing semiconductor device
06/16/1999EP0923094A2 Multilayer ceramic electronic element and manufacturing method therefor
06/16/1999EP0923085A1 Resistance wiring board and method for manufacturing the same
06/16/1999EP0922379A1 Apparatus for cooling an electronic component
06/16/1999EP0922317A1 Electrical terminal with integral capacitive filter
06/16/1999EP0922313A1 Circuit connector
06/16/1999EP0922301A1 Substrate with conductor formed of low-resistance aluminum alloy
06/16/1999EP0921887A1 Method and apparatus for forming termination stripes
06/16/1999EP0886894A4 Contact carriers (tiles) for populating larger substrates with spring contacts
06/16/1999EP0719353B1 Glass fabric produced with zero-twist yarn
06/16/1999CN1220077A Method for mounting terminal on circuit board and circuit board
06/16/1999CN1219837A Built-in circuit device assembly and its manufacturing method
06/16/1999CN1219821A Tuning assembly for TV set
06/16/1999CN1219743A Multilayered electronic part with minimum silver diffusion and its manufacturing method
06/16/1999CN1219555A Flame retardant resin composition and laminate using the same
06/16/1999CN1219546A Polymer resin and uses thereof
06/16/1999CN1219469A Method of manufacturing composite laminate comprising unidirectional reinforcing fibres, for use in printed wire boards
06/15/1999US5913109 Fixtures and methods for lead bonding and deformation
06/15/1999US5912984 Method and apparatus for in-line solder paste inspection
06/15/1999US5912809 Printed circuit board (PCB) including channeled capacitive plane structure
06/15/1999US5912808 Semiconductor component
06/15/1999US5912654 Electric-circuit board for a display apparatus
06/15/1999US5912597 Printed circuit board
06/15/1999US5912507 Solderable pad with integral series termination resistor
06/15/1999US5912486 Germanium
06/15/1999US5912438 Assembly of electronic components onto substrates
06/15/1999US5912308 Polyepoxides, epoxy resins, polycyanates and polytriazines
06/15/1999US5912047 Borosilicate electronic coatings
06/15/1999US5912046 By placing the liquid having solids in suspension in a centrifuge and spinning it about an axis so that liquid is forced against the surface of component
06/15/1999US5912044 Method for forming thin film capacitors
06/15/1999US5911602 Reduced cross talk electrical connector
06/15/1999US5911583 Stacked electrical circuit having an improved interconnect and alignment system
06/10/1999WO1999029149A1 Method and machine for producing flexible and semirigid printed-circuit boards
06/10/1999WO1999029148A1 Method for surface mounting of a microwave package on a printed circuit and package and printed circuit for implementing said method
06/10/1999WO1999029147A1 Printed circuit board assembly having an integrated fusible link
06/10/1999WO1999028981A1 Product having a rechargeable battery which is held in a mechanically stable manner and is easy to remove
06/10/1999WO1999028917A1 Flat surface-mounted multi-purpose wire
06/10/1999WO1999028543A1 Nonwoven fabric made of glass fiber and printed wiring boards
06/10/1999WO1999028161A1 Interior trim panel and electrical harness apparatus for an automotive vehicle
06/10/1999WO1999028127A1 Ultrahigh molecular weight polyethylene composite for printed circuit board and antenna base material
06/10/1999WO1999028126A1 Prepreg for multilayer printed wiring boards and process for producing the same
06/10/1999WO1999010565A3 Electrochemical deposition of a composite polymer-metal oxide
06/10/1999DE19753993A1 Fire-retardant resin composite
06/10/1999DE19753149A1 Copper-ceramic substrate production by direct copper bond connection of metallization through a via
06/10/1999CA2313459A1 Ultrahigh molecular weight polyethylene composite for printed circuit board and antenna base material
06/10/1999CA2312481A1 Interior trim panel and electrical harness apparatus for an automotive vehicle
06/10/1999CA2311800A1 Process for surface-mounting a microwave package on a printed circuit and package and printed circuit for the implementation of the process
06/09/1999EP0921715A1 PCB for mounting RF band pass filter and method of manufacture
06/09/1999EP0921642A2 Multiband high-frequency switching module
06/09/1999EP0921610A2 Electrical connector assembly for mounting on a printed circuit board and method for mounting it
06/09/1999EP0921594A2 Connection device
06/09/1999EP0921568A2 LED Luminaire
06/09/1999EP0921567A2 Multi-layer circuit board
06/09/1999EP0921158A2 Poly(phenylene ether) thermoset compositions
06/09/1999EP0840676A4 Adhesiveless flexible laminate and process for making adhesiveless flexible laminate
06/09/1999EP0800754A4 Compliant interface for a semiconductor chip
06/09/1999CN1219294A Smart card computer adaptor
06/09/1999CN1219100A Electronic element mounting body and its producing method and electronic apparatus using it
06/09/1999CN1219097A Low thermal expansion circuit board and multi-layer wire circuit board
06/09/1999CN1219095A Flexible printed circuit board unit fixed electronic parts on it
06/09/1999CN1218989A Metallizing system
06/08/1999US5911050 System for connecting either of two supply voltage type PCI cards using a common connector socket
06/08/1999US5910885 Electronic stack module
06/08/1999US5910755 Laminate circuit board with selectable connections between wiring layers
06/08/1999US5910685 Semiconductor memory module having double-sided stacked memory chip layout
06/08/1999US5910394 Radiation sensitive cured coating which exhibits substantial flexibility and reduces line growth
06/08/1999US5910354 Metallurgical interconnect composite
06/08/1999US5910231 Aramid papers of improved solvent resistance and dimensionally stable laminates made therefrom
06/08/1999US5910025 Radiotelephone
06/08/1999US5909915 Resin-molded electronic circuit device
06/08/1999US5909839 Method for dispensing solder paste on a non-planar substrate using an array of ultrasonically agitated pins
06/03/1999WO1999027606A2 Microstrip arrangement