| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/25/2001 | WO2001006819A1 Optical radiation conducting zones and associated bonding and alignment systems |
| 01/25/2001 | WO2001006818A1 Circuitry with integrated passive components and method for producing same |
| 01/25/2001 | WO2001006631A1 An intrinsically safe universal switching power supply |
| 01/25/2001 | DE19951916C1 Electronic control device for automobile door electrics has incorporated electronic circuit board for one variation of door electrics modified for different variation via circuit board contained in separate housing |
| 01/25/2001 | DE19940163A1 Strip conductor for microwave applications comprises dielectric made of a relaxed polymer film coated on one side with a self-adhering layer and arranged between a metallic base electrode and a metallic signal conductor |
| 01/25/2001 | DE19933757A1 Manufacturing chip card with integral battery involves applying first conducting track structure, electrolyte and second conducting track structure to form opposite polarity electrodes |
| 01/25/2001 | DE19933395A1 Adjustment method for board manufacture, involves successively aligning conductor pattern and circuit board relative to each other taking account of first and then other position markers |
| 01/25/2001 | DE19931944A1 Coupling for surface of light guide embedded in circuit board |
| 01/25/2001 | DE19931189A1 Verfahren zur Herstellung von Bauteilen mit darin angeordneten elektrischen Leiterbahnen sowie danach hergestellte Bauteile, insbesondere als Türmodule für Kraftfahrzeuge A process for the production of components having electrical conductor tracks arranged therein and thereafter made components, in particular as a door module for motor vehicles |
| 01/25/2001 | DE10031950A1 Crystal glass composition used In the production of ICs and LSIs comprises a main component represented by silicon dioxide, magnesium oxide and aluminum oxide, and boron oxide |
| 01/25/2001 | DE10030436A1 Verfahren zur Herstellung einer Masse für eine elektrisch leitfähige Dickschicht, Masse für eine elektrisch leitfähige Dickschicht und laminiertes keramisches Elektronikteil A process for preparing a composition for an electrically conductive thick film composition for an electrically conductive thick film and laminated ceramic electronic part |
| 01/25/2001 | DE10018931A1 Circuit connection structure of wire harness in vehicles, includes connector joint with fitting hole, which is integrally molded in bracket for connecting equipment terminals |
| 01/24/2001 | EP1071316A2 Multilayer circuit board |
| 01/24/2001 | EP1071164A1 Header or receptacle for use in a power connector |
| 01/24/2001 | EP1071162A1 Junction connector for wire harness |
| 01/24/2001 | EP1071142A2 Method of mounting leds on printed circuit boards |
| 01/24/2001 | EP1071131A1 Large non-hermetic multichip module package |
| 01/24/2001 | EP1071054A2 Lens for a motion detector |
| 01/24/2001 | EP1070892A2 Electric power supply apparatus for solenoid valve manifold |
| 01/24/2001 | EP1070445A1 Hybrid circuit with contact surfaces (solder pads) |
| 01/24/2001 | EP1070425A1 Modular video signal matrix switcher with color-coded components |
| 01/24/2001 | EP1070389A1 Component carrier |
| 01/24/2001 | EP1070269A2 Optoelectric multichip module |
| 01/24/2001 | EP1004141A4 A system and method for packaging integrated circuits |
| 01/24/2001 | CN1281629A Method of manufacturing multilayer printed wiring board |
| 01/24/2001 | CN1281331A Multilayer ceramic supporting base with anchored welding pad |
| 01/24/2001 | CN1281256A Welding pad structure for semi-conductor package |
| 01/24/2001 | CN1281110A Power supply device of electro magnetic valve multipath block |
| 01/24/2001 | CN1281008A Thermosetting resin composition used in ink stocking method |
| 01/23/2001 | US6178526 Testing memory modules with a PC motherboard attached to a memory-module handler by a solder-side adaptor board |
| 01/23/2001 | US6178318 Shielding housing and a method of producing a shielding housing |
| 01/23/2001 | US6178311 Method and apparatus for isolating high frequency signals in a printed circuit board |
| 01/23/2001 | US6178093 Information handling system with circuit assembly having holes filled with filler material |
| 01/23/2001 | US6178082 High temperature, conductive thin film diffusion barrier for ceramic/metal systems |
| 01/23/2001 | US6177732 Multi-layer organic land grid array to minimize via inductance |
| 01/23/2001 | US6177729 Rolling ball connector |
| 01/23/2001 | US6177635 Wiring substrate and manufacturing method thereof |
| 01/23/2001 | US6177632 Metal case for circuit board for horizontal or vertical mounting |
| 01/23/2001 | US6177184 Method of making an interface layer for stacked lamination sizing and sintering |
| 01/23/2001 | US6176743 Electrical adapter |
| 01/23/2001 | US6176709 Socket and adapter integrated circuit, and integrated circuit assembly |
| 01/23/2001 | US6176706 Subminiature lamp for indication light |
| 01/23/2001 | US6176004 Method of forming a sensor for sensing signals on conductors |
| 01/18/2001 | WO2001005202A1 Noise suppressor unit |
| 01/18/2001 | WO2001005201A1 Printed wiring board unit, hierarchical mounting auxiliary substrate and electronic apparatus |
| 01/18/2001 | WO2001005200A2 Printed circuit fabrication |
| 01/18/2001 | WO2001005164A1 Printed circuit board for connecting of multi-wire cabling to surge protectors |
| 01/18/2001 | WO2001004988A1 Antenna for contactless cards, hybrid cards and electronic labels |
| 01/18/2001 | WO2001004985A1 High-frequency device and method of manufacture thereof |
| 01/18/2001 | WO2001004711A1 A circuit production method |
| 01/18/2001 | WO2001004228A1 Pressure-sensitive adhesive film being easy to peel |
| 01/18/2001 | WO2001004213A1 Curable composition, cured article, and layered product |
| 01/18/2001 | WO2001003856A1 Method of forming a thin metal layer on an insulating substrate |
| 01/18/2001 | DE19945426C1 Plug connector protecting e.g. components of circuit card from electrostatic discharge, has pins embedded in plastic including material insulating at working voltage, but conducting above it |
| 01/18/2001 | DE19930996A1 SMD-Bauteil mit planaren Kontaktflächen und Verfahren zur Erzeugung planarer Flächen für SMD-Anschlußbeine SMD component with planar contact surfaces and methods for generating planar surfaces for SMD terminal legs |
| 01/18/2001 | DE19929912A1 Trägerelement für einen IC-Baustein A carrier element for an IC module |
| 01/18/2001 | DE19929209A1 Electronic control device for car brake antiblocking systems, comprises carrier in which control connector is fitted and metallic cooling component soldered under it on further side from carrier and encapsulated in plastic |
| 01/18/2001 | DE19924079A1 Electrical circuit board arrangement e.g. for electrical, electronic, electromechanical and electro-optical components |
| 01/18/2001 | DE10032306A1 Controller combined with motor has control components, control circuit, overload protection circuit, current distribution board on motor cover lower section and covered by upper section |
| 01/18/2001 | DE10029025A1 Integrated circuit socket e.g. for ball grid array device, has upper contact pins which are displaceable and mechanically biased to extend beyond upper surface of base |
| 01/17/2001 | EP1069810A1 Printed circuit with at least one electronic component and method for connecting them |
| 01/17/2001 | EP1069784A2 Variable distributing connector |
| 01/17/2001 | EP1069656A2 Electrical connector assembly |
| 01/17/2001 | EP1069655A2 Electrical connector system with cross-talk compensation |
| 01/17/2001 | EP1069617A2 Multilayer wiring board |
| 01/17/2001 | EP1069616A2 Multi-layer flexible printed wiring board |
| 01/17/2001 | EP1069371A2 Light emitting diode device |
| 01/17/2001 | EP1069194A1 Metal material for electronic parts, electronic parts, electronic apparatuses, and method of processing metal materials |
| 01/17/2001 | EP1069173A1 Non-inflammable matter |
| 01/17/2001 | EP1068642A1 An inductance device |
| 01/17/2001 | EP1068639A1 Wire bond attachment of a integrated circuit package to a heat sink |
| 01/17/2001 | EP1068626A1 Hybrid circuit arrangement with a thermal release |
| 01/17/2001 | EP1068255A2 Poly(arylene ether) compositions and methods of manufacture thereof |
| 01/17/2001 | EP0916237B1 Process for producing connecting conductors |
| 01/17/2001 | CN1280718A Surface mount LC filter with polymer layers |
| 01/17/2001 | CN1280638A Nonwoven fabric made of glass fiber and printed wiring boards |
| 01/17/2001 | CN1280455A Method for producing electronic device and electronic device and resin filling method |
| 01/17/2001 | CN1280387A Metal material for electronic unit, electronic unit, electronic equipment and treating method for metal material |
| 01/17/2001 | CN1280370A Flexible wiring base unit and wiring board |
| 01/17/2001 | CN1280056A Multilager base plate |
| 01/17/2001 | CN1060771C Novel aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin |
| 01/16/2001 | USRE37022 Fluorine-containing polymer composition |
| 01/16/2001 | US6175727 Suspended printed inductor and LC-type filter constructed therefrom |
| 01/16/2001 | US6175509 Space efficient local regulator for a microprocessor |
| 01/16/2001 | US6175508 Form factor-configured channel bank card containing form factor non-conformal printed circuit board |
| 01/16/2001 | US6175506 Multilayer printed circuit board |
| 01/16/2001 | US6175504 Multi-member axial flexible circuit |
| 01/16/2001 | US6175500 Surface mount thermal connections |
| 01/16/2001 | US6175480 Thermal trip arrangements |
| 01/16/2001 | US6175238 Binary electrostatic discharge locator |
| 01/16/2001 | US6175161 System and method for packaging integrated circuits |
| 01/16/2001 | US6175151 Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board, and electronic instrument |
| 01/16/2001 | US6175088 Multi-layer printed-wiring boards with inner power and ground layers |
| 01/16/2001 | US6175086 Method for mounting terminal on circuit board and circuit board |
| 01/16/2001 | US6175085 Solder mask configuration for a printed wiring board with improved breakdown voltage performance |
| 01/16/2001 | US6175084 Metal-base multilayer circuit substrate having a heat conductive adhesive layer |
| 01/16/2001 | US6174829 For multilayer ceramic circuit boards |
| 01/16/2001 | US6174589 Printed circuit board and method for producing the same |
| 01/16/2001 | US6174562 Manufacturing of solder stop in at least one through plated hole |
| 01/16/2001 | US6174462 Conductive paste composition including conductive metallic powder |