| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/08/2001 | WO2001009944A1 Method for producing via-connections in a substrate and substrate equipped with same |
| 02/08/2001 | WO2001009247A1 Cyanate ester based thermoset compositions |
| 02/08/2001 | WO2001009226A1 Impregnated glass fiber strands and products including the same |
| 02/08/2001 | WO2001009060A1 Paste for screenprinting electric structures onto carrier substrates |
| 02/08/2001 | WO2001009054A1 Impregnated glass fiber strands and products including the same |
| 02/08/2001 | DE19937843C1 Verfahren zur Herstellung einer selbsttragenden Kupferfolie A process for producing a self-supporting copper foil |
| 02/08/2001 | DE19935677A1 Paste für den Siebdruck von elektrischen Strukturen auf Trägersubstraten Paste for screen printing of electrical structures to support substrates |
| 02/08/2001 | DE19935527A1 Aktive Folie für Chipkarten mit Display Active film for smart cards with display |
| 02/08/2001 | DE19907295C1 Electronic and/or optical component mounting method for rear side of flexible printed circuit board has molded material used for encasing components on front side of circuit board before inversion of latter |
| 02/08/2001 | CA2380975A1 Impregnated glass fiber strands and products including the same |
| 02/08/2001 | CA2380594A1 Impregnated glass fiber strands and products including the same |
| 02/07/2001 | EP1075170A1 Method for attaching an antenna socket to a circuit board and article produced thereby |
| 02/07/2001 | EP1075169A1 Method for producing components with electrical conductor tracks arranged in them and components produced by this method, in particular as door modules for motor vehicles |
| 02/07/2001 | EP1075050A1 Electrical connector assembly |
| 02/07/2001 | EP1075049A1 Surface-mounted low profile connector |
| 02/07/2001 | EP1075048A1 Board-to-board connector capable of readily electrically connecting two parallel boards to each other |
| 02/07/2001 | EP1075026A2 Multilayer circuit board layout |
| 02/07/2001 | EP1075012A2 Fuse device |
| 02/07/2001 | EP1074524A1 Glass-ceramic composition, circuit substrate using the same and manufacture method thereof |
| 02/07/2001 | EP1074369A1 Method for manufacturing highly stressed composite pieces |
| 02/07/2001 | EP1073781A1 Method of electrophoretic deposition of ceramic bodies for use in manufacturing dental appliances |
| 02/07/2001 | CN1283380A Multilayer printed wiring board |
| 02/07/2001 | CN1282953A Circuit base plate for preventing destruction by electrostatic field and magnetic head using said circuit base plate |
| 02/07/2001 | CN1282940A IC card |
| 02/07/2001 | CN1282770A Adhesive coating |
| 02/07/2001 | CN1061712C Glass fabric product with continuous yarn twisted and use thereof |
| 02/06/2001 | US6185648 Printer circuit board for an optoelectric computer system |
| 02/06/2001 | US6185354 Printed circuit board having integral waveguide |
| 02/06/2001 | US6185108 Equipment control panel with operation signal generating switch |
| 02/06/2001 | US6185105 Discharge structure of printed circuit board |
| 02/06/2001 | US6185101 Electronic circuit apparatus and method for assembling the same |
| 02/06/2001 | US6184965 Circuit connection structure |
| 02/06/2001 | US6184872 Coordinate data input device and method of fabricating the same |
| 02/06/2001 | US6184736 Sinusoidal radio-frequency clock distribution system for synchronization of a computer system |
| 02/06/2001 | US6184658 Battery pack protective circuit with external terminals on opposite side of part mounting surface of circuit board |
| 02/06/2001 | US6184587 Resilient contact structures, electronic interconnection component, and method of mounting resilient contact structures to electronic components |
| 02/06/2001 | US6184579 Double-sided electronic device |
| 02/06/2001 | US6184577 Electronic component parts device |
| 02/06/2001 | US6184568 Integrated circuit module having on-chip surge capacitors |
| 02/06/2001 | US6184494 Printed circuit board having a heating element and heating method thereof |
| 02/06/2001 | US6184479 Multilayer printed circuit board having a concave metal portion |
| 02/06/2001 | US6184478 Printed wiring device with base layer having a grid pattern |
| 02/06/2001 | US6184477 Multi-layer circuit substrate having orthogonal grid ground and power planes |
| 02/06/2001 | US6184476 Thin multi-layer circuit board having a remodeling pad layer and a metallic barrier layer with an exclusion zone |
| 02/06/2001 | US6183880 Composite foil of aluminum and copper |
| 02/06/2001 | US6183875 Composite material which is prepared by directly solidifying molten aluminum or aluminum alloy on at least portion of ceramic substrate |
| 02/06/2001 | US6183669 Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate |
| 02/06/2001 | US6183592 Method for minimizing warp in the production of electronic assemblies |
| 02/06/2001 | US6183330 Display device and method therefor |
| 02/06/2001 | US6183290 Electrical connection configuration |
| 02/06/2001 | US6183272 Compressible elastomeric contact and mechanical assembly therewith |
| 02/06/2001 | US6183101 Cover arrangement including an electro-luminescent element |
| 02/06/2001 | US6183056 Thermal inkjet printhead and printer energy control apparatus and method |
| 02/06/2001 | US6182358 Process for producing a metal-ceramic substrate |
| 02/02/2001 | CA2314734A1 Method for attaching an antenna to a circuit board and article produced thereby |
| 02/01/2001 | WO2001008459A1 Electronic assembly comprising a sole plate forming a heat sink |
| 02/01/2001 | WO2001008304A1 Conductive member |
| 02/01/2001 | WO2001008251A1 Microstrip for microwave applications |
| 02/01/2001 | WO2001008219A1 Semiconductor module |
| 02/01/2001 | WO2001008177A1 Method of manufacturing ceramic electronic components |
| 02/01/2001 | WO2001007713A1 Wholly aromatic polyamide fiber paper and laminated sheet therefrom |
| 02/01/2001 | WO2001007255A1 Solder-paste printing device and printing method |
| 02/01/2001 | WO2001007195A1 Method of producing microbore holes |
| 02/01/2001 | DE19936056A1 Fehlerstromgeschützte Steckvorrichtung Fault current protected plug device |
| 02/01/2001 | DE19931004A1 Chipmodul, insbesondere BGA-Package, mit einem Interconnect zur stressfreien Lötverbindung mit einer Leiterplatte Chip module, in particular BGA package, with an interconnect for stress-free soldered to a circuit board |
| 02/01/2001 | DE10036934A1 Mother-board as backplane e.g. for 32-bit or 64-bit microcomputer, has several connector elements installed on plate carrying the bus-line |
| 02/01/2001 | DE10031487A1 Circuit connection structure for installing in motor vehicle door, uses flat flexible circuit boards for standard circuit unit and for control of optional fitting |
| 01/31/2001 | EP1073321A2 Processing method of printed wiring board |
| 01/31/2001 | EP1073320A2 Glass fabric material/thermosetting resin copper-clad laminate having a high-elasticity |
| 01/31/2001 | EP1073319A2 Substrate material for wiring and substrate material for printed circuit using the same |
| 01/31/2001 | EP1073161A2 Plug with differential current protection |
| 01/31/2001 | EP1073072A1 Method of making a module with an inductive winding and corresponding module |
| 01/31/2001 | EP1073009A2 IC card |
| 01/31/2001 | EP1072664A1 Adhesive sheets |
| 01/31/2001 | CN1282503A Hybrid circuit with heat dissipation system |
| 01/31/2001 | CN1282203A Printed-wiring board processing method |
| 01/31/2001 | CN1282124A Connector for printed wiring board |
| 01/31/2001 | CN1061299C Single side metalfoil-cladding laminated board |
| 01/30/2001 | US6181950 Radiotelephones with coplanar antenna connectors and related assembly methods |
| 01/30/2001 | US6181571 Printed-wiring board and electronic device having the same wiring board |
| 01/30/2001 | US6181562 Device and method for mounting electronic components on printed circuit boards |
| 01/30/2001 | US6181551 Pin soldering enhancement and method |
| 01/30/2001 | US6181219 Printed circuit board and method for fabricating such board |
| 01/30/2001 | US6181033 Printed circuit assembly for a dynamoelectric machine |
| 01/30/2001 | US6181004 Digital signal processing assembly and test method |
| 01/30/2001 | US6180725 Resin compositions for electric circuit boards |
| 01/30/2001 | US6180723 Producing an epoxy agent by reacting certain p-hydroxystyrene novolak polymers and epichlorohydrin in the presence of one or more alkali agents; low melt viscosity prior to cure and high glass transition temperature after curing |
| 01/30/2001 | US6180261 On which a semiconductor element can be mounted with ease and high reliability, which comprises an insulating layer 3 having an ni--fe-based alloy foil as a core, a wiring conductor 4 on both sides thereof, and an adhesive resin |
| 01/30/2001 | US6180250 Epoxy resin obtained by glycidyl etherifying a condensation product of a phenol and hydroxybenzaldehyde; condensation product of bisphenol a and formaldehyde; and a urea derivative. |
| 01/30/2001 | US6180221 Conductive elastomer for grafting to thermoplastic and thermoset substrates |
| 01/30/2001 | US6180215 Phenolic resin-laminated paper |
| 01/30/2001 | US6180055 Copper, nickel, tin alloy |
| 01/30/2001 | US6179953 Heating a surface of a nickel/aluminun alloy in an oxygen-containing gas to form an adherent alumina dielectric layer; printing, drying, and firing a conductive paste and positioning a adherent conductive element; heat resistance |
| 01/30/2001 | US6179664 64PCI-ISA add-on card with a card edge connector that can plug into both 64PCI-ISA and 32PCI-ISA slots |
| 01/30/2001 | US6179648 Connector assembly and male connector assembly associated therewith |
| 01/30/2001 | US6179629 Electrical connector with improved contact tail aligning effectiveness |
| 01/30/2001 | US6178630 Conductive bonding design and method for aluminum backed circuits |
| 01/30/2001 | CA2189204C Transmission bandwidth extender/category 5 protector |
| 01/29/2001 | CA2314621A1 Process for obtaining a module including an inductive coil and associated module |
| 01/25/2001 | WO2001006821A1 Encapsulated packaging in between 2 pcbs |