Patents for H05K 1 - Printed circuits (98,583)
02/2001
02/27/2001US6194056 Accurate etching
02/27/2001US6194053 Apparatus and method fabricating buried and flat metal features
02/27/2001US6194024 Connecting two circuit carriers; filling hole with solder sphere
02/27/2001US6193911 Combustion chemical vapor deposition (ccvd) solution in which is dissolved an additive which forms an electroconductivity adjusting metal oxide in the resulting thin film resistor
02/27/2001US6193910 Paste for through-hole filling and printed wiring board using the same
02/27/2001US6193568 Mid connector with extending solder creeping paths
02/27/2001US6193544 Flexible circuit service connector
02/27/2001US6193526 Wiring unit with angled insulation displacement contacts
02/27/2001US6193523 Contact for electrical connector
02/27/2001US6192599 Drying process for woven fabric intended for use as a reinforcing laminate in printed circuit boards
02/27/2001US6192581 Method of making printed circuit board
02/27/2001US6192580 Method of making laminate printed circuit board with leads for plating
02/27/2001US6192579 Tape carrier and manufacturing method therefor
02/27/2001US6192577 Method for shielding of electronics
02/25/2001CA2316109A1 Aluminum nitride sintered body and manufacturing method thereof
02/22/2001WO2001013405A1 Ion reflectron comprising a flexible printed circuit board
02/22/2001WO2001012880A2 Method for the production of a self-supporting copper foil
02/22/2001WO2001012874A1 Surface preparation of a substrate for thin film metallization
02/22/2001WO2001012702A1 Impregnated glass fiber strands and products including the same
02/22/2001WO2001012701A1 Impregnated glass fiber strands and products including the same
02/22/2001WO1999064195A3 Curved ceramic moulded part
02/22/2001DE10040143A1 Resonator for band-pass filter has two similar conductor patterns facing each other on two dielectric substrates joined by adhesive layer
02/22/2001DE10040142A1 Circuit element for band-pass filter on printed circuit board, has ground conductor with conductive members arranged to achieve desired frequency characteristic
02/22/2001CA2382188A1 Impregnated glass fiber strands and products including the same
02/22/2001CA2381959A1 Ion reflectron comprising a flexible printed circuit board
02/22/2001CA2381171A1 Impregnated glass fiber strands and products including the same
02/21/2001EP1077507A1 Radio wave absorber
02/21/2001EP1076927A1 Method for mechanically tuning a voltage controlled oscillator
02/21/2001EP0988029A4 Device and methods for wound treatment
02/21/2001CN1284835A Multi-layer printed circuit board
02/21/2001CN1284746A Electronic Package for electronic element and manufacturing method thereof
02/21/2001CN1284521A Aromatic ester compound and its prep., expoxy resin composition using the same and coper-coated laminate
02/21/2001CN1284520A Arylester compound and its prep, epoxy resin composition using the compound and copper-coated laminated
02/20/2001US6192431 Method and apparatus for configuring the pinout of an integrated circuit
02/20/2001US6191955 Encapsulation and enclosure of electronic modules
02/20/2001US6191954 Controlled low impedance high current circuit board interconnect
02/20/2001US6191934 High dielectric constant embedded capacitors
02/20/2001US6191838 Circuit board connecting structure, electro-optical device, electronic apparatus provided with the same, and manufacturing method for electro-optical device
02/20/2001US6191506 Method of manufacturing a dynamoelectric machine
02/20/2001US6191486 Technique for producing interconnecting conductive links
02/20/2001US6191475 Substrate for reducing electromagnetic interference and enclosure
02/20/2001US6191472 Hole geometry of a semiconductor package substrate
02/20/2001US6191471 Tape carrier package with two regions having leds that connect upon folding
02/20/2001US6191369 Printed circuit board having a marker trace for component alignment
02/20/2001US6191367 Wiring construction body with conductive lines in a resin binder
02/20/2001US6190941 Method of fabricating a circuit arrangement with thermal vias
02/20/2001US6190833 Radiation-sensitive resin composition
02/20/2001US6190759 Electronic package comprising dielectric layer and conductive layer, said dielectric layer including reinforcing material, resin material selected from epoxy, cyanate and bismaleimide resins, coloring agent, and fluorescing agent
02/20/2001US6190731 Method for isolating ultrafine and fine particles and resulting particles
02/20/2001US6190477 Method and apparatus for preparing a release layer of ceramic particulates
02/20/2001US6190211 Isolation displacement connector
02/20/2001US6190196 Cable connector assembly
02/20/2001US6189203 Method of manufacturing a surface mountable power supply module
02/20/2001US6189201 Method of tuning a high frequency printed resonance circuit
02/15/2001WO2001011932A1 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
02/15/2001WO2001011727A1 Interface adapter
02/15/2001WO2001010572A1 Diffusion barrier and adhesive for parmod application to rigi d printed wiring boards
02/15/2001WO2000052982A3 Multifonctional laminate structure and process
02/15/2001DE19955603C1 Integrated control device for motor vehicle especially for automatic transmission
02/15/2001DE19939347C1 Chip card manufacture, of e.g. credit cards or admission cards, which allows for fitting with displays or keys, involves laminating circuit board with several perforated layers and machining cut-outs
02/15/2001DE19936661A1 Noise insensitive means of transmitting data between electronic circuit boards, has optical transmitter on first board, and optical receiver on second board
02/15/2001DE10037908A1 Connecting device for joining connector housing to circuit board has V-shaped locking parts, the angle between limbs increasing from one side to other
02/14/2001EP1076480A2 Mask-printing method and mask-printing apparatus
02/14/2001EP1076479A1 Integrated sensor/controller assembly and method of manufacturing same
02/14/2001EP1076361A2 Chip assembly module of bump connection type using a multi-layer printed circuit substrate
02/14/2001EP1076071A2 Photosensitive ceramic compositions containing polycarbonate polymers
02/14/2001EP1075782A1 Adapted electrically conductive layer
02/14/2001EP0800711B1 Process and arrangement for connecting a plurality of mutually remote electric contact points
02/14/2001CN1283883A Plate-plate connector able to easily electrically connect two parallel plantes
02/14/2001CN1283769A Electronic controller
02/14/2001CN1283549A Composite laminated plate and its mfg process
02/13/2001US6188583 Contact bridge arrangement for conductively interconnecting circuit boards
02/13/2001US6188579 Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage
02/13/2001US6188578 Integrated circuit package with multiple heat dissipation paths
02/13/2001US6188565 Multilayer capacitor
02/13/2001US6188391 Two-layer capacitive touchpad and method of making same
02/13/2001US6188368 Slot antenna
02/13/2001US6188305 Transformer formed in conjunction with printed circuit board
02/13/2001US6188299 Dielectric filter and method of manufacturing the same
02/13/2001US6188297 Low-EMI circuit board and low-EMI cable connector
02/13/2001US6188295 Frequency adjustments by patterning micro-strips to form serially connected capacitors or inductor-capacitor (LC) Circuit
02/13/2001US6188133 Semiconductor with plurality of connecting parts arranged on lower surface of a substrate
02/13/2001US6188128 Monoblock structure for stacked components
02/13/2001US6187886 Maleimide containing formulations and uses therefor
02/13/2001US6187877 Process for producing a polyamide based on a dicarboxylic acid and a diamine
02/13/2001US6187852 Dustless; blend containing pure talc
02/13/2001US6187610 Flexible thin film ball grid array containing solder mask
02/13/2001US6187442 Thermosetting resin compositions, electrical laminates obtained therefrom and process of producing these
02/13/2001US6187418 Multilayer ceramic substrate with anchored pad
02/13/2001US6187417 Substrate having high optical contrast and method of making same
02/13/2001US6187416 Resin composition for copper-clad laminate, resin-coated copper foil, multilayered copper-clad laminate, and multilayered printed circuit board
02/13/2001US6187372 Method for producing large area thick film resistors with uniform thickness
02/13/2001US6186842 Revenue meter bayonet assembly and method of attachment
02/13/2001US6186673 Package for optical semiconductor module
02/13/2001US6186106 Apparatus for routing electrical signals in an engine
02/08/2001WO2001010177A1 A circuit singulation system and method
02/08/2001WO2001010047A1 Isolator with built-in power amplifier
02/08/2001WO2001010000A1 Universal energy conditioning interposer with circuit architecture
02/08/2001WO2001009963A1 Light-emitting diode
02/08/2001WO2001009954A1 Active film for chip cards with a display