| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/03/2001 | US6210592 Deposition of resistor materials directly on insulating substrates |
| 04/03/2001 | US6210537 Forming solution comprising pyrrole monomer and an electron acceptor; evenly applying film of solution onto substrate; photochemically polymerizing portions of film to form electronically conducting polymer; removing solution |
| 04/03/2001 | US6210522 Adhesive bonding laminates |
| 04/03/2001 | US6210518 Method and fixture for manufacturing flexible printed circuit board |
| 03/29/2001 | WO2001022789A1 An electrically conductive ink |
| 03/29/2001 | WO2001022786A1 Conductor structure on a dielectric material, and method for producing such a conductor structure |
| 03/29/2001 | WO2001022784A1 Base webs for printed circuit board production using the foam process and acrylic fibers |
| 03/29/2001 | WO2001022489A2 Control device, particularly for use in automotive engineering |
| 03/29/2001 | WO2001022488A1 Grid array electronic component, wire reinforcing method for the same, and method of manufacturing the same |
| 03/29/2001 | WO2001022449A1 Electronic device of ceramic |
| 03/29/2001 | WO2001022446A1 Split inductor with fractional turn of each winding and pcb including same |
| 03/29/2001 | WO2001022360A1 Chip card and source material therefor |
| 03/29/2001 | DE19946034A1 Electrical and electronic components assembly method e.g. for mobile communications engineering, involves use of cut-outs in electrical circuit board in order to provide additional space for installation of additional electrical components |
| 03/29/2001 | DE19945866A1 Verfahren zur Herstellung einer leitfähigen Beschichtung auf Glas oder emailliertem Stahl und hiernach beschichtete Substrate A method for producing a conductive coating on glass or enamelled steel, and thereafter coated substrates |
| 03/29/2001 | DE19939586A1 Electrical press-in connection for PCB assembly has press-in contact that is pressed into orifice on printed circuit board to connect component to printed circuit board |
| 03/29/2001 | DE10048132A1 Aromatic polyimide laminate, useful for flexible plates with printed circuits, comprises polyimide laminate and metal films and separating foil |
| 03/29/2001 | DE10044183A1 Connector for printed circuit board, includes side ribs in resin housing of female connector having through-holes through which longer end of U-shaped terminals are inserted before connecting to PCB |
| 03/29/2001 | DE10041622A1 Siebdruckvorrichtung Screen printing apparatus |
| 03/29/2001 | CA2385326A1 Base webs for printed circuit board production using the foam process and acrylic fibers |
| 03/28/2001 | EP1087652A1 Improvements in cooled electrical assemblies, especially for a control module for a discharge head lamp of a vehicle |
| 03/28/2001 | EP1087649A2 Printed wiring board and display apparatus |
| 03/28/2001 | EP1087648A2 Multi-purpose finish for printed wiring boards and method of manufacture of such boards |
| 03/28/2001 | EP1087647A2 Thin integral resistor/capacitor/inductor package, method of manufacture |
| 03/28/2001 | EP1087646A2 Process for producing a conductive coating on glass or enamelled steel and substrates coated thereby |
| 03/28/2001 | EP1087524A2 Laminated chip component and manufacturing method |
| 03/28/2001 | EP1087440A2 Modeling technique to increase device reliability |
| 03/28/2001 | EP1087411A2 Multilayer capacitor |
| 03/28/2001 | EP1087300A2 Computer bus bar assembly |
| 03/28/2001 | EP1087263A2 Photosensitive resin composition, pattering method, and electronic components |
| 03/28/2001 | EP1087261A1 Photosensitive resin composition, multilayer printed wiring board and process for production thereof |
| 03/28/2001 | EP1086930A1 Glass fiber having low dielectric constant and woven fabric of glass fiber made therefrom |
| 03/28/2001 | EP1086337A1 Control and signaling device or signaling device with a luminous element |
| 03/28/2001 | EP0799279B1 Moulded Article |
| 03/28/2001 | CN1289354A Thermosetting polyphenylene ether resin composition, cured resin composition obtained therefrom, and lamiated structure |
| 03/28/2001 | CN1289225A Electro-deposition copper foil through surface-processing, its mfg. method and use thereof |
| 03/28/2001 | CN1063859C 磁头单元 Head unit |
| 03/27/2001 | US6208526 Mounting multiple substrate frame and leadless surface mountable assembly using same |
| 03/27/2001 | US6208525 Process for mounting electronic device and semiconductor device |
| 03/27/2001 | US6208521 Film carrier and laminate type mounting structure using same |
| 03/27/2001 | US6208234 Resistors for electronic packaging |
| 03/27/2001 | US6208225 Filter structures for integrated circuit interfaces |
| 03/27/2001 | US6208219 Broadband RF circuits with microstrips laid out in randomly meandering paths |
| 03/27/2001 | US6208156 Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems |
| 03/27/2001 | US6208078 Display device and display device assembly |
| 03/27/2001 | US6208023 Lead frame for use with an RF powered semiconductor |
| 03/27/2001 | US6207906 PCB having holes between terminals and method of making the same |
| 03/27/2001 | US6207905 Glass-ceramic composition, circuit substrate using the same and manufacture method thereof |
| 03/27/2001 | US6207904 Printed wiring board structure having continuous graphite fibers |
| 03/27/2001 | US6207739 Composition containing organic solvent, polyamide acid which is precursor to non-thermosetting polyimide, inorganic or organic metallic compound, gelation inhibitor |
| 03/27/2001 | US6207595 Laminate and method of manufacture thereof |
| 03/27/2001 | US6207550 Method for fabricating bump electrodes with a leveling step for uniform heights |
| 03/27/2001 | US6207522 Formation of thin film capacitors |
| 03/27/2001 | US6207476 Methods of packaging an integrated circuit and methods of forming an integrated circuit package |
| 03/27/2001 | US6207354 Method of making an organic chip carrier package |
| 03/27/2001 | US6207288 Conductive composition chemically bonded to substrate |
| 03/27/2001 | US6207268 A transfer sheet suitable for forming high-precision patterns for layers such as electrode layers, dielectric or barrier layers in plasma display panels; ink layer consists an glass frit, and a thermoplastic resin |
| 03/27/2001 | US6207259 Wiring board |
| 03/27/2001 | US6207234 Via formation for multilayer inductive devices and other devices |
| 03/27/2001 | US6207077 Luminescent gel coats and moldable resins |
| 03/27/2001 | US6207003 Fabrication of structure having structural layers and layers of controllable electrical or magnetic properties |
| 03/27/2001 | US6206708 Through via plate electrical connector and method of manufacture thereof |
| 03/27/2001 | US6206507 Printer |
| 03/27/2001 | US6205660 Method of making an electronic contact |
| 03/27/2001 | US6205657 Printed circuit board and method for producing the same |
| 03/27/2001 | CA2241927C Resistor and protector for transmission line |
| 03/27/2001 | CA2216683C Metal powder and process for preparing the same |
| 03/22/2001 | WO2001020957A1 Laminated reflow soldering |
| 03/22/2001 | WO2001020955A1 A printed circuit board assembly |
| 03/22/2001 | WO2001020743A1 Protector module for protecting electronic equipment from energy surges |
| 03/22/2001 | WO2001020737A1 Component alignment casing system |
| 03/22/2001 | WO2001020668A2 AN INTEGRATED RF MxN SWITCH MATRIX |
| 03/22/2001 | WO2001020660A1 Method of mounting optical and electrical devices, and mounting structure |
| 03/22/2001 | WO2001019889A1 Highly stable packaging substrates and brominated indane derivatives |
| 03/22/2001 | WO2001019602A1 Copper coated polyimide with metallic protective layer |
| 03/22/2001 | DE19944170A1 Electronic equipment manufactured on glass substrate, employs transparent, thin-film tracks in functional, e.g. display areas, whilst conventional thick film technology is employed in areas of circuitry |
| 03/22/2001 | DE10035851A1 Wire harness extraction structure for switch unit in motor vehicles, has restraining members provided in upper case, which presses the wire harness to hobs in lower case, when upper case in fit to lower case |
| 03/22/2001 | CA2384962A1 Highly stable packaging substrates and brominated indane derivatives |
| 03/21/2001 | EP1085794A1 Junction box for electronic components |
| 03/21/2001 | EP1085793A2 Electrical compact device for swich mode power supply |
| 03/21/2001 | EP1085792A1 Process for manufacturing a circuit board, and circuit board |
| 03/21/2001 | EP1085788A2 Composite flexible wiring board, method of manufacturing the same, electro-optical device, and electronic equipment |
| 03/21/2001 | EP1085787A2 Enclosure for electrical or electronic devices with integrated conducting tracks |
| 03/21/2001 | EP1085666A2 Receiver / transmitter apparatus |
| 03/21/2001 | EP1085594A2 High frequency circuit apparatus |
| 03/21/2001 | EP1085571A1 Method for increasing device reliability of a BGA package |
| 03/21/2001 | EP1085539A2 Multilayer capacitor |
| 03/21/2001 | EP1085529A2 Dielectric composition |
| 03/21/2001 | EP1085326A2 Multilayer wiring board, manufacturing method thereof, and wafer block contact board |
| 03/21/2001 | EP1085310A1 Transmitter |
| 03/21/2001 | EP1084498A1 Rigid/flex printed circuit board and manufacturing method therefor |
| 03/21/2001 | CN1288591A Semiconductor device and method of prodn. thereof and semiconductor mounting structure and method |
| 03/21/2001 | CN1288171A composite and flexible circuit distributing plate, and it mfg method, photo electrc device, electronic device |
| 03/21/2001 | CN1063570C Viscoelastically dampled slider suspension system |
| 03/20/2001 | US6205364 Method and apparatus for registration control during processing of a workpiece particularly during producing images on substrates in preparing printed circuit boards |
| 03/20/2001 | US6205032 Low temperature co-fired ceramic with improved registration |
| 03/20/2001 | US6205028 Circuit substrate including printed circuit board having heat-shielding portion |
| 03/20/2001 | US6205027 Structure and method for mounting a circuit module |
| 03/20/2001 | US6204712 Method and apparatus for clock uncertainty minimization |
| 03/20/2001 | US6204552 Semiconductor device |
| 03/20/2001 | US6204456 Filling open through holes in a multilayer board |