| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/24/2001 | US6222741 Mounting arrangement for microwave power amplifier |
| 04/24/2001 | US6222740 Multilayer circuit board having at least one core substrate arranged therein |
| 04/24/2001 | US6222739 High-density computer module with stacked parallel-plane packaging |
| 04/24/2001 | US6222738 Packaging structure for a semiconductor element flip-chip mounted on a mounting board having staggered bump connection location on the pads and method thereof |
| 04/24/2001 | US6222737 Universal package and method of forming the same |
| 04/24/2001 | US6222732 Electrical device, in particular a switching and control unit for motor vehicles |
| 04/24/2001 | US6222665 Opto-electric module |
| 04/24/2001 | US6222332 Low cost high performance single board motor controller |
| 04/24/2001 | US6222280 Test interconnect for semiconductor components having bumped and planar contacts |
| 04/24/2001 | US6222265 Method of constructing stacked packages |
| 04/24/2001 | US6222246 Flip-chip having an on-chip decoupling capacitor |
| 04/24/2001 | US6222135 Circuit board for preventing solder failures |
| 04/24/2001 | US6222131 Flat cable |
| 04/24/2001 | US6222126 Woven mesh interconnect |
| 04/24/2001 | US6221939 Thermoplastic resin blend |
| 04/24/2001 | US6221869 N-aminoalkyldibenzothiophenecarboxamides new dopamine receptor subtype specific ligands |
| 04/24/2001 | US6221799 Mixed oxide containing lithium, sodium, calcium, titanium, samarium and one of aluminum or gallium |
| 04/24/2001 | US6221693 High density flip chip BGA |
| 04/24/2001 | US6221514 Dispersion of metal particles in solder alloy |
| 04/24/2001 | US6221511 Metal-ceramic composite substrates, producing methods thereof and brazing materials for use in such method |
| 04/24/2001 | US6221459 Controlling the heat expansion of electrical couplings |
| 04/24/2001 | US6221427 Interface regions between metal and ceramic in a metal/ceramic substrate |
| 04/24/2001 | US6221269 Removal of extra molybdenum from electronics, applying ceramics, sintering and rinsing |
| 04/24/2001 | US6221193 Defect reduction method for screened greensheets and article produced therefrom |
| 04/24/2001 | US6221176 Surface treatment of copper to prevent microcracking in flexible circuits |
| 04/24/2001 | US6220873 Modified contact traces for interface converter |
| 04/24/2001 | US6219912 Method for manufacture electronic component device |
| 04/24/2001 | US6219909 Method of mounting disk drive apparatus |
| 04/24/2001 | CA2236193C Semiconductor microwave amplifier |
| 04/24/2001 | CA2142055C Annular circuit components coupled with printed circuit board through-hole |
| 04/19/2001 | WO2001028303A1 Electromagnetic shield wiring structure of wiring board |
| 04/19/2001 | WO2001028302A1 Electronic card for an electrical system of a vehicle |
| 04/19/2001 | WO2001028293A1 Thermally controlled circuit using planar resistive elements |
| 04/19/2001 | WO2001028081A2 Single board motor controller |
| 04/19/2001 | WO2001028043A1 Miniaturised electrical interconnection system |
| 04/19/2001 | WO2001027983A1 Method and apparatus for forming interconnection |
| 04/19/2001 | WO2001027942A1 Dielectric ceramic composition |
| 04/19/2001 | WO2001027941A1 Conductor composition |
| 04/19/2001 | WO2001009054A8 Impregnated glass fiber strands and products including the same |
| 04/19/2001 | DE19945821A1 Electrical circuit arrangement for printed circuit board has connections of data tracks through FET device stages connected to edge connectors |
| 04/19/2001 | DE19944383A1 Gehäuse für elektrische oder elektronische Vorrichtungen mit integrierten Leiterbahnen Housings for electrical or electronic devices with integrated conductor tracks |
| 04/19/2001 | DE19930207A1 Verfahren zum Herstellen von Substraten mit strukturierten Metallisierungen sowie Halte- und Fixierelement zur Verwendung bei diesem Verfahren A method of manufacturing substrates with structured metallizations as well as the holding and fixing element for use in this method |
| 04/18/2001 | EP1093328A2 Laser imaging of thin layer electronic circuitry material |
| 04/18/2001 | EP1093327A2 An improved method to embed passive components |
| 04/18/2001 | EP1093326A2 Printed-circuit board module |
| 04/18/2001 | EP1093325A2 Multilayer assembly with electrical connecting pins |
| 04/18/2001 | EP1093189A1 Electrical interconnection system |
| 04/18/2001 | EP1093082A2 Combination card having an IC chip module |
| 04/18/2001 | EP1092339A1 Molded housing with integral heatsink |
| 04/18/2001 | EP1092338A1 Assembly of an electronic component with spring packaging |
| 04/18/2001 | EP1092337A1 Apparatus and method for improving computer memory speed and capacity |
| 04/18/2001 | EP1092248A1 Pcb to metallic ground connection method |
| 04/18/2001 | EP1091915A1 Composite injection mouldable material |
| 04/18/2001 | CN1292150A Low-inductance gate-controlled thyristor |
| 04/18/2001 | CN1291963A Glass fiber-reinforced laminates, electronic circuit boards and methods for assembling fabric |
| 04/18/2001 | CN1064788C Power pad/power delivery system |
| 04/17/2001 | US6219823 Method and apparatus for deciding a wiring route and for detecting a critical cut |
| 04/17/2001 | US6219820 Printed circuit board design device |
| 04/17/2001 | US6219733 Transmission line loop |
| 04/17/2001 | US6219495 Arrangement of structure in a camera for reduced thickness |
| 04/17/2001 | US6219255 Method and apparatus for reducing EMI in a computer system |
| 04/17/2001 | US6219253 Molded electronic package, method of preparation using build up technology and method of shielding |
| 04/17/2001 | US6219243 Heat spreader structures for enhanced heat removal from both sides of chip-on-flex packaged units |
| 04/17/2001 | US6219240 Three-dimensional electronic module and a method of its fabrication and repair |
| 04/17/2001 | US6218851 Method and apparatus for testing a printed circuit |
| 04/17/2001 | US6218850 Apparatus for selecting high-reliability integrated circuits |
| 04/17/2001 | US6218847 Test pattern for use in measuring thickness of insulating layer and method for using the same |
| 04/17/2001 | US6218736 Circuit board and semiconductor device, and method of manufacturing the same |
| 04/17/2001 | US6218729 Apparatus and method for an integrated circuit having high Q reactive components |
| 04/17/2001 | US6218630 Printed circuit board having arrays of lands arranged inside and outside of each other having a reduced terminal-pitch |
| 04/17/2001 | US6218628 Foil circuit boards and semifinished products and method for the manufacture thereof |
| 04/17/2001 | US6218074 Flexible, flame-retardant, aqueous-processable photoimageable composition for coating flexible printed circuits |
| 04/17/2001 | US6218030 Soldered product |
| 04/17/2001 | US6218022 Resin etching solution and process for etching polyimide resins |
| 04/17/2001 | US6218015 Fluoropolymer matrix that includes a mixture of a granular first fluoropolymer and a dispersion second fluoropolymer, preferably, both being polytetrafluoroethylene, with different particle size distribution |
| 04/17/2001 | US6218000 Stretching and sintering a tape made of a mixture of polytetrafluoroethylene and nanoparticles; thickness of less than 55 micrometers; abrasion resistance |
| 04/17/2001 | US6217996 Aromatic polyimide film and its composite sheet |
| 04/17/2001 | US6217990 Multilayer circuit board having no local warp on mounting surface thereof |
| 04/17/2001 | US6217989 Conductive line features for enhanced reliability of multi-layer ceramic substrates |
| 04/17/2001 | US6217987 A solder resist comprises an acrylate of novolac type epoxy resin and an imidazole curing agent, has a specific viscosity adjusted with glycol ether comprising diethylene glycol dimethyl ether or dimethyl ether of triethylene glycol |
| 04/17/2001 | US6217821 Applying conductive material to green ceramic tape |
| 04/17/2001 | US6217348 Electrical connector |
| 04/17/2001 | US6217346 Solderless pin connection |
| 04/17/2001 | US6216941 Method for forming high frequency connections to high temperature superconductor circuits and other fragile materials |
| 04/17/2001 | US6216342 Method for fabricating a matrix switchboard and connection pin |
| 04/17/2001 | CA2237923C Reducing electromagnetic noise radiated from a printed board |
| 04/12/2001 | WO2001026434A1 Wiring board having connector and method of manufacturing the same |
| 04/12/2001 | WO2001026433A1 Flexible circuit board and method for making a flexible circuit board |
| 04/12/2001 | WO2001026432A1 Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
| 04/12/2001 | WO2001026255A1 Method and apparatus for aligning optical interconnections between printed circuit boards |
| 04/12/2001 | WO2001026189A1 Offset array adapter |
| 04/12/2001 | WO2001026180A1 Tamper-resistant wireless article including an antenna |
| 04/12/2001 | WO2001026179A1 Method of providing a conductive element and a conductive element thereof |
| 04/12/2001 | WO2001026176A1 Irreversible circuit element and millimeter-wave hybrid integrated circuit board equipped with irreversible circuit element |
| 04/12/2001 | WO2001026162A1 Photo-interrupter and semiconductor device using it |
| 04/12/2001 | WO2001026079A1 Electrooptic device, method for manufacturing electrooptic device, and electronic apparatus |
| 04/12/2001 | WO2001025775A1 Patterned laminates and electrodes with laser defined features |
| 04/12/2001 | WO2001025325A2 Improved pct formulations containing halogenated imides, sodium antimonate, and reinforcing fibers |
| 04/12/2001 | WO2001025007A1 Liquid crystal resin laminated film, method for manufacturing the same, and circuit board comprising liquid crystal resin laminated film |
| 04/12/2001 | DE19952192A1 Method of trimming electronic circuit esp. oscillator circuit |