| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/20/2001 | US6204454 Wiring board and process for the production thereof |
| 03/20/2001 | US6204453 Two signal one power plane circuit board |
| 03/20/2001 | US6204448 High frequency microwave packaging having a dielectric gap |
| 03/20/2001 | US6204356 Polybenzoxazole resin and precursor thereof |
| 03/20/2001 | US6203967 Method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
| 03/20/2001 | US6203926 Corrosion resistant multilayer metal structure with cushionsand diffusion barriers then gold layer and encapsulation |
| 03/20/2001 | US6203918 Multilayer element with steel support and layers of polyimides |
| 03/20/2001 | US6203912 Thin film of triazine fluoropolymers by trimerization of cyano groups with fluoropolymers |
| 03/20/2001 | US6203658 Processing system and method for making spherical shaped semiconductor integrated circuits |
| 03/20/2001 | US6203387 Solderable metallized plastic contact |
| 03/20/2001 | US6203365 Multi-port receptacle connector unit |
| 03/20/2001 | US6203347 High-density electrical interconnect system |
| 03/20/2001 | US6202916 Method of wave soldering thin laminate circuit boards |
| 03/15/2001 | WO2001019149A1 Printed wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 03/15/2001 | WO2001019148A1 Printed wiring board and method of producing the same |
| 03/15/2001 | WO2001019147A1 Method of forming transferable printed pattern, and glass with printed pattern |
| 03/15/2001 | WO2001019145A1 Substrate of circuit board |
| 03/15/2001 | DE19937865A1 Kunststofformteil mit elektrischen Kontakten Plastic molding with electrical contacts |
| 03/15/2001 | DE19936013A1 Manufacturing method for circuit boards and electronic components fixture devices, involves breaking out part of circuit board provided with nominal rupture point before breakout |
| 03/15/2001 | DE10039392A1 Multilayered conductor printed circuit board used in IC's and LSI's comprises bulk layers laminated on the upper and lower sides of a power source layer having wiring via first insulating material layers |
| 03/15/2001 | DE10030154A1 Elektronisches Gerät mit einer einseitig bedruckten Schaltplatte Electronic device with a single-sided circuit board |
| 03/14/2001 | EP1083779A1 Printed circuit board and method of production thereof |
| 03/14/2001 | EP1083778A1 Process for mounting components on a printed circuit board |
| 03/14/2001 | EP1083629A2 Pin header and a method of making same |
| 03/14/2001 | EP1083600A2 Multilayered circuit substrate |
| 03/14/2001 | EP1083594A2 Fired body for and manufacture of a substrate |
| 03/14/2001 | EP1083578A1 Conductive paste, ceramic multilayer substrate, and method for manufacturing ceramic multilayer substrate |
| 03/14/2001 | EP1083249A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use thereof |
| 03/14/2001 | EP1083248A2 Electrodeposited copper foil with its surface prepared, process for producing the same and use therof |
| 03/14/2001 | EP1083198A2 Curable epoxy resin compositions with brominated triazine flame retardants |
| 03/14/2001 | EP1082884A1 Method for producing wirings having solder bumps |
| 03/14/2001 | EP1082882A1 Method of manufacturing resistors |
| 03/14/2001 | EP1082777A1 Wideband rf port structure using coplanar waveguide and bga i/o |
| 03/14/2001 | EP1082765A1 Opto-electronic element |
| 03/14/2001 | EP1082732A1 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
| 03/14/2001 | EP1082473A1 Plasma catalysis of carbon nanofibers |
| 03/14/2001 | EP0938836B1 A board magazine for printed circuit boards |
| 03/14/2001 | EP0646845B1 Color filter, material thereof and resin |
| 03/14/2001 | CN1287687A Semiconductor device and manufacturing method thereof, semiconductor module, circuit board and electronic equipment |
| 03/14/2001 | CN1287672A Conductive paste, conductive structure using the same, electronic part, module, circuit board, method for electrical connection, method for manufacturing circuit board, and ceramic electronic part |
| 03/14/2001 | CN1287471A Element mounting base plate and its producing method |
| 03/14/2001 | CN1287469A Electro-deposition copper foil through surface processing and its producing method and use |
| 03/14/2001 | CN1287394A Pin base and its producing method |
| 03/14/2001 | CN1287382A Semiconductor apparatus and its mounting structure |
| 03/14/2001 | CN1287285A Flexible wiring base plate, electrooptical apparatus and electronic apparatus |
| 03/14/2001 | CN1287140A Electroconductive thick film paste and its producing process and laminated ceramic electronic element |
| 03/14/2001 | CN1287045A Cutting blade |
| 03/14/2001 | CN1063134C Medlin-metal foil composite film |
| 03/13/2001 | US6202110 Memory cards with symmetrical pinout for back-to-back mounting in computer system |
| 03/13/2001 | US6201908 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 03/13/2001 | US6201708 Backplane slot arrangement for use with single or multiple width circuit boards |
| 03/13/2001 | US6201707 Wiring substrate used for a resin-sealing type semiconductor device and a resin-sealing type semiconductor device structure using such a wiring substrate |
| 03/13/2001 | US6201706 Power supply device with externally disconnectable “Y” capacitors |
| 03/13/2001 | US6201701 Integrated substrate with enhanced thermal characteristics |
| 03/13/2001 | US6201689 Electronic appliance |
| 03/13/2001 | US6201684 Capacitor, formed of a dielectric body having a high dielectric constant |
| 03/13/2001 | US6201683 Ceramic electronic part and mounting structure for the same |
| 03/13/2001 | US6201682 Thin-film component |
| 03/13/2001 | US6201502 Antenna device and communication apparatus including the same |
| 03/13/2001 | US6201346 EL display device using organic EL element having a printed circuit board |
| 03/13/2001 | US6201307 Ceramics for wiring boards and method of producing the same |
| 03/13/2001 | US6201305 Making solder ball mounting pads on substrates |
| 03/13/2001 | US6201304 Flip chip adaptor package for bare die |
| 03/13/2001 | US6201300 Printed circuit board with thermal conductive structure |
| 03/13/2001 | US6201286 Multilayer wiring substrate for hybrid integrated circuit and method for manufacturing the same |
| 03/13/2001 | US6201215 Method of making a thick film low value high frequency inductor |
| 03/13/2001 | US6201193 Printed circuit board having a positioning marks for mounting at least one electronic part |
| 03/13/2001 | US6201185 Substrate for mounting electronic part having conductive projections and process for manufacturing the same |
| 03/13/2001 | US6201094 Phenol-novolacs with improved optical properties |
| 03/13/2001 | US6200829 Microelectronic assembly with connection to a buried electrical element, and method for forming same |
| 03/13/2001 | US6200630 Producing a metallic layer on the surface of a detail for shielding against electromagnetic radiation |
| 03/13/2001 | US6200407 Method of making a multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area |
| 03/13/2001 | US6200400 Method for making high k dielectric material with low k dielectric sheathed signal vias |
| 03/13/2001 | US6200373 Method for controlling of certain second phases in aluminum nitride |
| 03/13/2001 | US6200146 Right angle connector |
| 03/13/2001 | US6200142 Assembly including a flex circuit and a gas tight chamber |
| 03/13/2001 | US6199756 Memory card, and receptacle for same |
| 03/13/2001 | US6199741 Enhanced pad design for substrate |
| 03/13/2001 | US6199273 Method of forming connector structure for a ball-grid array |
| 03/08/2001 | WO2001017324A1 Bottom or top jumpered foldable electronic assembly, and method for manufacture |
| 03/08/2001 | WO2001017323A1 Method and article for the connection and repair of flex and other circuits |
| 03/08/2001 | WO2001017322A1 Multi-connectable printed circuit board |
| 03/08/2001 | WO2001017321A1 Flex circuit having repairable connector tail |
| 03/08/2001 | WO2001017320A1 Current carrying structure using voltage switchable dielectric material |
| 03/08/2001 | WO2001017069A1 Control device and soldering method |
| 03/08/2001 | WO2001017011A2 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card |
| 03/08/2001 | WO2001016876A2 Chip card and a method for producing a chip card |
| 03/08/2001 | WO2001016643A1 Connector arrangement |
| 03/08/2001 | WO2001016630A1 Packaging enhanced board level opto-electronic interconnects |
| 03/08/2001 | WO2001016402A1 Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 03/08/2001 | DE19942631A1 Verfahren zum Bestücken einer Leiterplatte A method of assembling a printed circuit board |
| 03/08/2001 | DE19941637A1 Chipkarte und Verfahren zur Herstellung einer Chipkarte Chip card and method for manufacturing a smart card |
| 03/08/2001 | DE19940480A1 Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte Conductor carrier layer for Einlaminierung in a smart card, chip card having a conductor carrier layer and method for manufacturing a smart card |
| 03/08/2001 | DE10042344A1 Printed circuit board has conductive elements fitted in openings in insulation layer for providing connections between electrode layers on opposite sides of insulation layer |
| 03/08/2001 | DE10033984A1 Hybridlaminat und Verfahren zur Herstellung desselben Hybrid laminate and method of manufacturing the same |
| 03/07/2001 | EP1081994A2 Board-to-board alignment and securement device. |
| 03/07/2001 | EP1081992A2 Component mounting circuit board with resin-molded section covering circuit pattern and inner components |
| 03/07/2001 | EP1081991A2 Flexible wiring board, electro-optical device and electronic equipment |
| 03/07/2001 | EP1081989A2 High frequency wiring board and its connecting structure |
| 03/07/2001 | EP1081762A2 Constant impedance routing for high performance integrated circuit packaging |