| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 06/27/2001 | EP1111970A2 Circuit board for use at high voltage |
| 06/27/2001 | EP1111969A1 Method and structure for reducing power noise |
| 06/27/2001 | EP1111731A1 Conductors guide plate |
| 06/27/2001 | EP1111725A2 Connector for circuit board |
| 06/27/2001 | EP1111708A1 Composite high frequency apparatus and method of forming same |
| 06/27/2001 | EP1111694A2 Thin film device with a trimmable capacitor |
| 06/27/2001 | EP1111679A2 Device with thin-film circuit |
| 06/27/2001 | EP1111676A2 Unit interconnection substrate for electronic parts |
| 06/27/2001 | EP1111674A2 Circuit component built-in module, radio device having the same, and method for producing the same |
| 06/27/2001 | EP1111090A2 Method for partially plating on a base |
| 06/27/2001 | EP1111021A2 Double-sided adhesive tape |
| 06/27/2001 | EP1110647A2 Paste to be fired for forming circuit board and method for preparing surface-modified silver powder |
| 06/27/2001 | EP1110438A1 Smd component with planar contact surfaces and method for producing planar surfaces for smd connecting legs |
| 06/27/2001 | EP1110277A1 Printed circuit board arrangement with a multipole plug-in connector |
| 06/27/2001 | EP1110270A1 Microwave dielectric material |
| 06/27/2001 | EP1110268A1 Method for vertical connection of conductors in a device in the microwave range |
| 06/27/2001 | EP0858684B1 Reduced cross talk electrical connector |
| 06/27/2001 | EP0787161B1 Low voc laminating formulations |
| 06/27/2001 | CN1301480A Printed circuit board and method of production thereof |
| 06/27/2001 | CN1301479A Multiple printed panel for electronic components, and method for constructing bumps, soldering frames, spaces and similiar on said multiple printed panel |
| 06/27/2001 | CN1301426A Embedded backup energy storage unit |
| 06/27/2001 | CN1301316A Base webs for printed circuit board production using the foam process and aramid fibers |
| 06/27/2001 | CN1301130A Binding treatment of copper sheet with improved binding strength and bottom cutting resistant |
| 06/27/2001 | CN1301041A Modules having thin film circuit with refittable capacitors |
| 06/27/2001 | CN1300877A Local electroplating method for substrate |
| 06/27/2001 | CN1300683A Method for presetting up low resistor on circuit board and high-current detector for electric vehicle |
| 06/26/2001 | US6253071 Method and apparatus for a cross-connect system with automatic facility information transference to a remote location |
| 06/26/2001 | US6252791 Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems |
| 06/26/2001 | US6252780 Construction of scanning or imaging arrays suitable for large documents |
| 06/26/2001 | US6252779 Ball grid array via structure |
| 06/26/2001 | US6252778 Complex electronic component |
| 06/26/2001 | US6252775 Electronic apparatus having printed circuit board module accommodated in case thereof |
| 06/26/2001 | US6252761 Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrate |
| 06/26/2001 | US6252179 Electronic package on metal carrier |
| 06/26/2001 | US6252178 Semiconductor device with bonding anchors in build-up layers |
| 06/26/2001 | US6252177 Low inductance capacitor mounting structure for capacitors of a printed circuit board |
| 06/26/2001 | US6252176 Printed wiring board, and manufacture thereof |
| 06/26/2001 | US6252175 Electronic assembly comprising a substrate and a plurality of springable interconnection elements secured to terminals of the substrate |
| 06/26/2001 | US6252173 Non-aqueous organic polymer formulations for electric or fiber optical wire or cable |
| 06/26/2001 | US6251766 Method for improving attachment reliability of semiconductor chips and modules |
| 06/26/2001 | US6251507 Flexible aromatic polymide film/metal film composite sheet |
| 06/26/2001 | US6250968 Electrical connector system with cross-talk compensation |
| 06/26/2001 | US6249962 Process for manufacturing a multi-layer circuit board with supporting layers of different materials |
| 06/21/2001 | WO2001045479A1 High density, high frequency memory chip modules having thermal management structures |
| 06/21/2001 | WO2001045477A1 Circuit forming board and method of manufacturing circuit forming board |
| 06/21/2001 | WO2001045475A1 Surface-treated copper foil and method for manufacturing the surface-treated copper foil |
| 06/21/2001 | WO2001045254A1 Planar wideband inductive devices and method |
| 06/21/2001 | WO2001045172A1 Method and device for interconnecting electronic components in three dimensions |
| 06/21/2001 | WO2001045169A1 Power transistor module, power amplifier and methods in the fabrication thereof |
| 06/21/2001 | WO2001045117A1 Ultra-thin inductive component |
| 06/21/2001 | WO2001044605A1 Key with integrated, electronic control circuit for a vehicle security system |
| 06/21/2001 | WO2001044143A1 Joint body of glass-ceramic and aluminum nitride sintered compact and method for producing the same |
| 06/21/2001 | US20010004557 Flat conductor ribbon cable |
| 06/21/2001 | US20010004556 Contact structure and production method thereof and probe contact assembly using same |
| 06/21/2001 | US20010004555 Plug connector |
| 06/21/2001 | US20010004539 Dielectric layer comprising at least one polymer material selected from the group consisting of polybenzoxazole, polynorbornene, and their derivatives |
| 06/21/2001 | US20010004496 Metallic foil, e.g. copper, having a polyimide layer produced by forming a film of a polyamic acid varnish followed by imidating and having a specific expansion coefficient and softening point; printed circuits; noncurling |
| 06/21/2001 | US20010004347 Optical pickup device with high-frequency superpostion circuit |
| 06/21/2001 | US20010004314 Module with thin-film circuit comprising a trimmable capacitor |
| 06/21/2001 | US20010004208 Static event detection / protection device |
| 06/21/2001 | US20010004134 Electronic device and method of producing same |
| 06/21/2001 | US20010004133 Semiconductor device and manufacturing method therefor |
| 06/21/2001 | US20010004130 Semiconductor device and production method thereof |
| 06/21/2001 | US20010004024 Ball grid array modules |
| 06/21/2001 | DE19963264A1 Support material for electronic high heat-dissipation component in surface mounted device technology; has metal core, insulation layer with top and bottom connection structures and metal coating |
| 06/21/2001 | DE19960465A1 Flachleiter-Bandleitung Flat-conductor ribbon cable |
| 06/21/2001 | DE19960250A1 Flexible i.e. foldable circuit board for equipping with electronic components, uses separate equipping boards which fold over one another via flexible hinge areas |
| 06/21/2001 | DE19959262A1 Leitfähiges pastöses Material und dessen Verwendung Conductive paste-like material and its use |
| 06/21/2001 | DE19957789A1 Kontaktierungssystem für zwei Leiterplatten Connection system for two printed circuit boards |
| 06/21/2001 | DE10059234A1 Electrically conducting paste used in the production of printed circuit boards comprises complexes produced by mixing an electrically conducting filler and a heating element, and a resin |
| 06/21/2001 | DE10057115A1 Method for forming circuit using electrically conductive paste forming circuit arrangement on base-board, involves hardening circuit arrangement by applying magnetic field |
| 06/21/2001 | DE10019839A1 Laminate capacitor for high frequency circuit has penetration conduction bodies connected internal electrodes and peripheral conduction bodies connected to peripheries of internal electrodes |
| 06/21/2001 | DE10004222A1 Remote control transmitter used in e.g. light control system, has ring antenna having interrupt for interposing of tuning components and single feed point connected to high-frequency transmission circuit |
| 06/20/2001 | EP1109430A2 Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board |
| 06/20/2001 | EP1109428A2 Thermal and mechanical stress stabilized circuit substrate |
| 06/20/2001 | EP1109259A2 Electrical connector for circuit board |
| 06/20/2001 | EP1109258A2 Flexible wiring board and wiring board connecting structure |
| 06/20/2001 | EP1109220A2 Dielectric filling of electrical wiring levels |
| 06/20/2001 | EP1109219A2 Semiconductor device having a wiring layer |
| 06/20/2001 | EP1109175A2 Ribbon cable with flat conductors |
| 06/20/2001 | EP1108762A2 Polyamic acid varnish composition and a flexible printed board |
| 06/20/2001 | EP1108532A1 Resin-coated metal foil |
| 06/20/2001 | EP1108348A1 A flexible circuit with conductive vias and a method of making |
| 06/20/2001 | CN1300526A Ceramic circuit board and method of manufacture thereof |
| 06/20/2001 | CN1300520A Composite substrate, thin film el element using it, and method of producing the same |
| 06/20/2001 | CN1300484A Signal transmission method and motherboard structure |
| 06/20/2001 | CN1300247A Sheet retainer for punching ceramic green sheet and punching device |
| 06/20/2001 | CN1300180A Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
| 06/20/2001 | CN1300117A Connector |
| 06/20/2001 | CN1300116A Connector |
| 06/20/2001 | CN1300101A Carrier-belt automatic bonding type semiconductor device |
| 06/20/2001 | CN1300088A Mfg. method and apparatus for laminated electronic element |
| 06/19/2001 | US6249440 Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board |
| 06/19/2001 | US6249439 Millimeter wave multilayer assembly |
| 06/19/2001 | US6249434 Surface mounted conduction heat sink |
| 06/19/2001 | US6249404 Head gimbal assembly with a flexible printed circuit having a serpentine substrate |
| 06/19/2001 | US6249271 Retroreflective electrophoretic displays and materials for making the same |
| 06/19/2001 | US6249267 Display apparatus having heat dissipation |
| 06/19/2001 | US6249227 RFID integrated in electronic assets |
| 06/19/2001 | US6249131 Electronics package having a ball grid array which is electrically accessible |