| Patents for H05K 1 - Printed circuits (98,583) |
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| 07/05/2001 | WO2001048071A1 Flame retardant benzocyclobutene resin with reduced brittleness |
| 07/05/2001 | US20010006868 Electrically insulating non-woven fabric, a prepreg and a laminate |
| 07/05/2001 | US20010006854 Pin header and a method of making same |
| 07/05/2001 | US20010006538 Symbol-based signaling device for an elctromagnetically-coupled bus system |
| 07/05/2001 | US20010006457 Printed-circuit board and method of mounting electric components thereon |
| 07/05/2001 | US20010006455 Method for mounting semiconductor device and structure thereof |
| 07/05/2001 | US20010006453 Disk drive enclosure |
| 07/05/2001 | US20010006252 Stacked microelectronic assembly and method therefor |
| 07/05/2001 | US20010006119 Circuit board-providing article, circuit board, semiconductor device and process for the production of the same |
| 07/05/2001 | US20010006118 Non-contact type IC card and process for manufacturing same |
| 07/05/2001 | US20010006117 Mechanical -laser structure on printed circuit board and carrier |
| 07/05/2001 | US20010006114 Curved ceramic moulded part |
| 07/05/2001 | US20010005936 Electrically conductive paste and method of forming circuit |
| 07/05/2001 | DE19961116A1 Leiterplattenanordnung Printed circuit board assembly |
| 07/05/2001 | DE19961103A1 Dielektrische Füllung von elektrischen Verdrahtungsebenen Dielectric filling of electrical wiring levels |
| 07/05/2001 | DE10063251A1 Wire-contacted pluggable contact arrangement with high density e.g. for electronics and automobiles, uses circuit board having several lamination layers with several sites provided for wire-bonding |
| 07/05/2001 | DE10061866A1 An einer Fahrzeugdecke montierbare elektrische Anordnung Mounted on a vehicle ceiling electrical arrangement |
| 07/04/2001 | EP1113712A2 Process for manufacturing conductive lines |
| 07/04/2001 | EP1113533A2 Cap and low insertion force connector for printed circuit board |
| 07/04/2001 | EP1113526A2 Procedure to mount an insulation displacement contact |
| 07/04/2001 | EP1113521A1 Method of forming a composite high frequency apparatus |
| 07/04/2001 | EP1113520A1 Composite high frequency apparatus |
| 07/04/2001 | EP1113519A1 Composite high frequency apparatus |
| 07/04/2001 | EP1113463A1 Planar inductor |
| 07/04/2001 | EP1113459A2 Composite dielectric material containing ceramic powders and substrate coated with this material |
| 07/04/2001 | EP1112676A1 Method and device for processing substrates |
| 07/04/2001 | EP1112673A1 Printed conductors made of polyalkylene dioxythiophene |
| 07/04/2001 | EP1112672A1 Low-impedance high-density deposited-on-laminate structures having reduced stress |
| 07/04/2001 | EP1112671A1 Door-dependent system for enabling and adjusting options on hearing aids |
| 07/04/2001 | EP1112314A1 Flame retardant resin compositions containing phosphoramides, and method for making |
| 07/04/2001 | EP0891646B1 Signal conductor |
| 07/04/2001 | EP0876619B1 Machine for the electric test of printed circuits with adjustable position of the testing needles |
| 07/04/2001 | EP0830671B1 Integrated head-electronics interconnection suspension for a data recording disk drive |
| 07/04/2001 | EP0764393B1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 07/04/2001 | CN1302418A Flat carrier with display device |
| 07/04/2001 | CN1302177A Flexible wiring board and electronic device using said board |
| 07/04/2001 | CN1302176A Single system module for electric/electronic equiopment |
| 07/04/2001 | CN1302097A Connector for module |
| 07/04/2001 | CN1302095A Printed circuit board cover and low plug-in force connector |
| 07/03/2001 | US6256769 Printed circuit board routing techniques |
| 07/03/2001 | US6256572 Remote programming of an ABS electronic control module |
| 07/03/2001 | US6256523 Low-noise optical probes |
| 07/03/2001 | US6256217 Apparatus for on-board programming of serial EEPROMS |
| 07/03/2001 | US6256208 Adaptable expansion card with a multi-position daughter card and method therefore |
| 07/03/2001 | US6256203 Free standing, three dimensional, multi-chip, carrier package with air flow baffle |
| 07/03/2001 | US6255776 Display device and method therefor |
| 07/03/2001 | US6255602 Multiple layer electrical interface |
| 07/03/2001 | US6255600 Electronic interconnection medium having offset electrical mesh plane |
| 07/03/2001 | US6255599 Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination |
| 07/03/2001 | US6255588 Arrangement for supplying power from a buss bar to a circuit board |
| 07/03/2001 | US6255586 Interlocked bonding pad structures and methods of fabrication therefor |
| 07/03/2001 | US6255581 Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace |
| 07/03/2001 | US6255135 Quad flat pack integrated circuit package |
| 07/03/2001 | US6254972 Polytetrafluoroethylene matrix containing particules overlaying conductive layer |
| 07/03/2001 | US6254971 Resin-having metal foil for multilayered wiring board, process for producing the same, multilayered wiring board, and electronic device |
| 07/03/2001 | US6254415 Zero insertion force electrical connector |
| 07/03/2001 | CA2188007C Solder active braze |
| 06/28/2001 | WO2001047330A1 Multilayer printed wiring board and method of manufacturing the same |
| 06/28/2001 | WO2001047328A1 Flanged terminal pins for dc/dc converters |
| 06/28/2001 | WO2001047327A2 Method for applying polymer film to a metal foil |
| 06/28/2001 | WO2001047326A1 Multilayer printed board |
| 06/28/2001 | WO2001047018A1 Electrostatic discharge proteciton network having distributed components connected with inductors |
| 06/28/2001 | WO2001047016A1 Method and apparatus for encoding information in an ic package |
| 06/28/2001 | WO2001047015A2 Electronic component protection devices and methods |
| 06/28/2001 | WO2001046904A1 Method for producing contactable conductor loops for transponders |
| 06/28/2001 | WO2001046106A1 High purity 4,4-isopropylidene-bis-(2,6 dibromophenol) and process for the preparation of such high purity 4,4-isopropylidene-bis-(2,6 dibromophenol) |
| 06/28/2001 | WO2001045935A1 Method of manufacture of printed wiring boards and flexible circuitry |
| 06/28/2001 | WO2000068972A3 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 06/28/2001 | US20010005817 Circuit trace probe and method |
| 06/28/2001 | US20010005730 Polyamic acid varnish composition and a flexible printed board |
| 06/28/2001 | US20010005653 Double row modular gang jack for board edge application |
| 06/28/2001 | US20010005643 Method and apparatus for connecting circuit boards |
| 06/28/2001 | US20010005548 Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same |
| 06/28/2001 | US20010005544 Printed pattern defect repair sheet, and repair device and method for printed pattern defect |
| 06/28/2001 | US20010005313 Unit interconnection substrate, interconnection substrate, mount structure of electronic parts, electronic device, method for mounting electronic parts, and method for manufacturing electronic device |
| 06/28/2001 | US20010005304 Printed circuit board capacitor structure and method |
| 06/28/2001 | US20010005299 Magnetic disk apparatus |
| 06/28/2001 | US20010005240 Signal processing circuit board and liquid crystal display apparatus with variable resistor which are hardly declined in the mechanical strength while its variable resistor is not limited to one particular location for the installation |
| 06/28/2001 | US20010005083 Vehicle ceiling-mounting electric equipment assembly |
| 06/28/2001 | US20010005048 Circuit board arrangement |
| 06/28/2001 | US20010005047 Flip chip C4 extension structure and process |
| 06/28/2001 | US20010004944 Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board |
| 06/28/2001 | US20010004942 Method and structure for reducing power noise |
| 06/28/2001 | US20010004941 Circuit module and method for mounting the same |
| 06/28/2001 | US20010004857 Comprising surface-modified silver powder consisting of metal silver particles having an average particle size of not more than 10 mu m and at least one member selected from the group consisting of oxides of Groups 2 to 14 of Periodic Table |
| 06/28/2001 | DE19963292A1 Electronic voltage adapter has variable output frequency converter supplied with direct voltage and operated at frequencies above 1 MHz for ignition and during operation |
| 06/28/2001 | DE19963290A1 Planare Induktivität Planar inductor |
| 06/28/2001 | DE19963287A1 Verfahren zum Montieren eines Schneidkontaktes Method for mounting a blade contact |
| 06/28/2001 | DE19963281A1 Verfahren zum Herstellen von Leiterbahnen A method for producing conductor tracks |
| 06/28/2001 | DE19962194A1 Production of conductor loops for transponders comprises forming conductor loop on one side of deformable substrate, lengthening loop and folding substrate between lengthened outer end and outer end of loop |
| 06/28/2001 | DE19961683A1 Bauteil mit Dünnschichtschaltkreis Component with thin-film circuit |
| 06/28/2001 | DE19961675A1 Bauteil mit Dünnschichtschaltkreis mit trimmbarem Kondensator Component with thin-film circuit with capacitor trimmbarem |
| 06/28/2001 | DE19960857A1 Steckverbinder Connectors |
| 06/28/2001 | DE19960856A1 Steckverbinder Connectors |
| 06/28/2001 | DE19959248A1 Isolationsverbesserung bei Hochleistungs-Halbleitermodulen Isolation improvement in high-power semiconductor modules |
| 06/28/2001 | DE10064629A1 Making connections between printed circuits, including bonding of ribbon cables, employs hydrocarbon flux and melt- or diffusion-bonding |
| 06/28/2001 | DE10015269A1 Manufacturing method for electrical resistance inserted into circuit-board especially multilayer circuit board |
| 06/28/2001 | CA2395651A1 Flanged terminal pins for dc/dc converters |
| 06/27/2001 | EP1111972A2 Flexible printed substrate |
| 06/27/2001 | EP1111971A1 Method for producing circuit-forming board, circuit-forming board, and carbon sheet |