Patents for H05K 1 - Printed circuits (98,583)
07/2001
07/18/2001EP1116413A2 Apparatus including an electroacoustic transducer having terminal contacts which extend in the direction of the transducer axis and including a printed circuit board having mating contacts
07/18/2001EP1116326A1 Conductive member
07/18/2001EP1116305A1 Removable connecting system
07/18/2001EP1116180A1 Method for contacting a circuit chip
07/18/2001EP1116159A1 Electrical connector for the simultaneous connection of two electronic-memory cards
07/18/2001EP1115786A1 Flame retardant resin compositions containing phosphoramides, and method for making
07/18/2001EP1115567A1 Resin/copper/metal laminate and method of producing same
07/18/2001EP1115563A1 Phenol-novolacs with improved optical properties
07/18/2001CN1304636A Method for producing contact between two circuit layers separated by insulating layer
07/18/2001CN1304635A Method for producing wirings having solder bumps
07/18/2001CN1304634A Wiring method and wiring device
07/18/2001CN1304633A Flexible circuit assembly
07/18/2001CN1304536A Polymer thick-film resistor printed on planar circuit board surface
07/18/2001CN1304535A Rigid/flex printed circuit board and manufacturing method therefor
07/18/2001CN1304488A Instpection of printed circuit board using color
07/18/2001CN1304284A Flexible wiring board with multilayer structure and its making method
07/18/2001CN1304281A Electric linking parts and its manufacturing method
07/18/2001CN1304279A Multi-layer printed circuit board
07/18/2001CN1304278A Multi-layer printed circuit board
07/18/2001CN1304174A Electronic packaged component with high density interconnection layer
07/18/2001CN1304141A Heat-proofing insulating shield sleeve
07/18/2001CN1304121A Multifunction circuit board
07/18/2001CN1068621C Polyimide compositions for electrodeposition and coatings formed of the same
07/17/2001US6263198 Multi-layer printed wiring board having integrated broadside microwave coupled baluns
07/17/2001US6262890 Computer system utilizing front and backside mounted memory controller chipsets
07/17/2001US6262706 Retroreflective electrophoretic displays and materials for making the same
07/17/2001US6262579 Method and structure for detecting open vias in high density interconnect substrates
07/17/2001US6262488 Semiconductor memory module having double-sided memory chip layout
07/17/2001US6262477 Ball grid array electronic package
07/17/2001US6262392 Printed circuit boards
07/17/2001US6261856 Method and system of laser processing
07/17/2001US6261703 Copper circuit junction substrate and method of producing the same
07/17/2001US6261697 Oxidation surface treatment; plating
07/17/2001US6261680 Electronic assembly with charge-dissipating transparent conformal coating
07/17/2001US6261481 Insulating composition
07/17/2001US6261467 Direct deposit thin film single/multi chip module
07/17/2001US6261414 Laminate base material, method of preparing the same, prepreg and laminate
07/17/2001US6261104 Riser card assembly and method for its installation
07/17/2001US6261091 Process and apparatus for heat-treating substrate having film-forming composition thereon
07/17/2001US6260265 Circuit board stiffener
07/12/2001WO2001050827A1 Printed circuit board comprising a heat dissipating aluminium plate and a method for producing same
07/12/2001WO2001050826A1 Method and device for producing a conductive structure on a substrate
07/12/2001WO2001050825A1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product
07/12/2001WO2001050823A1 Self-aligned coaxial via capacitors
07/12/2001WO2001050822A1 Composite material for obtaining printed circuits, production method thereof and printed circuit board obtained from said composite material
07/12/2001WO2001050614A2 System and method for high speed processing of turbo codes
07/12/2001WO2001050547A1 Variable capacitance coupling antenna
07/12/2001WO2001050198A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
07/12/2001WO2001049903A1 Electrolytic copper foil and method for inspecting physical property thereof, and copper clad laminate using the electrolytic copper foil
07/12/2001WO2001005200A3 Printed circuit fabrication
07/12/2001WO2000074436A3 Mounting of the coil in an electroacoustic transducer
07/12/2001US20010008006 Method for bus capacitance reduction
07/12/2001US20010007437 Voltage controlled oscillator and communication device using same
07/12/2001US20010007373 Tape carrier for semiconductor device and method of producing same
07/12/2001US20010007289 Full additive process with filled plated through holes
07/12/2001US20010007287 Electronics module having power components, and a method of manufacture
07/12/2001DE19961842A1 Mehrschichtleiterplatte Multi-layer printed circuit board
07/12/2001DE10064394A1 Plug connector for printed circuit board, has distance part with windows in grid formation that far end sections of accommodation sockets pass through for protection
07/12/2001DE10064374A1 Plug connector for connecting circuit boards has locking arms on side walls, connecting terminal accommodation space in plug housing, and distance holder for engaging plug housing
07/12/2001DE10059808A1 Verfahren zur Verbindung einer integrierten Schaltung und einer flexiblen Schaltung A method of connecting an integrated circuit and a flexible circuit
07/11/2001EP1115274A1 Electrical power module and method for its manufacture
07/11/2001EP1115154A1 Power semiconductor module and motor drive system
07/11/2001EP1115086A2 Non-contact type IC card and process for manufacturing same
07/11/2001EP1114573A1 A method for controlling stress in thin film layers deposited over a high density interconnect common circuit base
07/11/2001EP1114439A2 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress
07/11/2001EP1114077A1 Liquid crystalline polyesters having a surprisingly good combination of a low melting point, a high heat distortion temperature, a low melt viscosity, and a high tensile elongation
07/11/2001EP1113885A1 Printing of electronic circuits and components
07/11/2001EP0832448B1 Method of manufacturing passive elements using conductive polypyrrole formulations
07/11/2001EP0749600B1 Modular architecture for high bandwidth computers
07/11/2001CN1303229A Thin integrated resistor and capacitor and inductor component element and its manufacturing method
07/11/2001CN1303086A Resin hermetically sealed type semiconductor device and liquid crystal display assembly block
07/11/2001CN1303085A 液晶显示器 LCD Monitor
07/11/2001CN1068350C Epoxy resin mixture for prepregs and composites
07/11/2001CN1068349C Epoxy resin mixture for prepregs and composities
07/11/2001CN1068348C Epoxy resin mixtures for prepregs and composites
07/10/2001US6259608 Conductor pattern for surface mount devices and method therefor
07/10/2001US6259603 Electronic control unit
07/10/2001US6259573 Preamplifier circuit with magnetoresistive sensor ESD protection
07/10/2001US6259159 Reflowed solder ball with low melting point metal cap
07/10/2001US6259157 Hybrid integrated circuit device, and method of manufacturing thereof
07/10/2001US6259039 Surface mount connector with pins in vias
07/10/2001US6259038 Semiconductor chip mounting board and method of inspecting the same mounting board
07/10/2001US6259037 Polytetrafluoroethylene thin film chip carrier
07/10/2001US6259022 Chip card micromodule as a surface-mount device
07/10/2001US6258927 Synergistic mixture; fireproofing
07/10/2001US6258449 Low-thermal expansion circuit board and multilayer circuit board
07/10/2001US6258203 Base webs for printed circuit board production using the foam process and acrylic fibers
07/10/2001US6258192 Multi-thickness, multi-layer green sheet processing
07/10/2001US6257904 Connector with BGA arrangement for connecting to PC board
07/10/2001US6257898 Mounting structure for flat circuitry
07/10/2001US6257771 Opitcal/electrical hybrid wiring board and its manufacturing method
07/10/2001US6257329 Thermal management system
07/10/2001US6257215 Resin-sealed electronic apparatus for use in internal combustion engines
07/10/2001US6256880 Method for preparing side attach pad traces through buried conductive material
07/10/2001US6256877 Method for transforming a substrate with edge contacts into a ball grid array
07/10/2001US6256866 Polymer thick-film resistor printed on planar circuit board surface
07/10/2001US6256850 Method for producing a circuit board with embedded decoupling capacitance
07/05/2001WO2001049083A1 Electronic ballast and electronic transformer
07/05/2001WO2001048821A1 Integrated circuit
07/05/2001WO2001048272A1 Electrolytic copper foil