Patents for H05K 1 - Printed circuits (98,583) |
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07/18/2001 | EP1116413A2 Apparatus including an electroacoustic transducer having terminal contacts which extend in the direction of the transducer axis and including a printed circuit board having mating contacts |
07/18/2001 | EP1116326A1 Conductive member |
07/18/2001 | EP1116305A1 Removable connecting system |
07/18/2001 | EP1116180A1 Method for contacting a circuit chip |
07/18/2001 | EP1116159A1 Electrical connector for the simultaneous connection of two electronic-memory cards |
07/18/2001 | EP1115786A1 Flame retardant resin compositions containing phosphoramides, and method for making |
07/18/2001 | EP1115567A1 Resin/copper/metal laminate and method of producing same |
07/18/2001 | EP1115563A1 Phenol-novolacs with improved optical properties |
07/18/2001 | CN1304636A Method for producing contact between two circuit layers separated by insulating layer |
07/18/2001 | CN1304635A Method for producing wirings having solder bumps |
07/18/2001 | CN1304634A Wiring method and wiring device |
07/18/2001 | CN1304633A Flexible circuit assembly |
07/18/2001 | CN1304536A Polymer thick-film resistor printed on planar circuit board surface |
07/18/2001 | CN1304535A Rigid/flex printed circuit board and manufacturing method therefor |
07/18/2001 | CN1304488A Instpection of printed circuit board using color |
07/18/2001 | CN1304284A Flexible wiring board with multilayer structure and its making method |
07/18/2001 | CN1304281A Electric linking parts and its manufacturing method |
07/18/2001 | CN1304279A Multi-layer printed circuit board |
07/18/2001 | CN1304278A Multi-layer printed circuit board |
07/18/2001 | CN1304174A Electronic packaged component with high density interconnection layer |
07/18/2001 | CN1304141A Heat-proofing insulating shield sleeve |
07/18/2001 | CN1304121A Multifunction circuit board |
07/18/2001 | CN1068621C Polyimide compositions for electrodeposition and coatings formed of the same |
07/17/2001 | US6263198 Multi-layer printed wiring board having integrated broadside microwave coupled baluns |
07/17/2001 | US6262890 Computer system utilizing front and backside mounted memory controller chipsets |
07/17/2001 | US6262706 Retroreflective electrophoretic displays and materials for making the same |
07/17/2001 | US6262579 Method and structure for detecting open vias in high density interconnect substrates |
07/17/2001 | US6262488 Semiconductor memory module having double-sided memory chip layout |
07/17/2001 | US6262477 Ball grid array electronic package |
07/17/2001 | US6262392 Printed circuit boards |
07/17/2001 | US6261856 Method and system of laser processing |
07/17/2001 | US6261703 Copper circuit junction substrate and method of producing the same |
07/17/2001 | US6261697 Oxidation surface treatment; plating |
07/17/2001 | US6261680 Electronic assembly with charge-dissipating transparent conformal coating |
07/17/2001 | US6261481 Insulating composition |
07/17/2001 | US6261467 Direct deposit thin film single/multi chip module |
07/17/2001 | US6261414 Laminate base material, method of preparing the same, prepreg and laminate |
07/17/2001 | US6261104 Riser card assembly and method for its installation |
07/17/2001 | US6261091 Process and apparatus for heat-treating substrate having film-forming composition thereon |
07/17/2001 | US6260265 Circuit board stiffener |
07/12/2001 | WO2001050827A1 Printed circuit board comprising a heat dissipating aluminium plate and a method for producing same |
07/12/2001 | WO2001050826A1 Method and device for producing a conductive structure on a substrate |
07/12/2001 | WO2001050825A1 Method, facility and device for producing an electrical connecting element, electrical connecting element and semi-finished product |
07/12/2001 | WO2001050823A1 Self-aligned coaxial via capacitors |
07/12/2001 | WO2001050822A1 Composite material for obtaining printed circuits, production method thereof and printed circuit board obtained from said composite material |
07/12/2001 | WO2001050614A2 System and method for high speed processing of turbo codes |
07/12/2001 | WO2001050547A1 Variable capacitance coupling antenna |
07/12/2001 | WO2001050198A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
07/12/2001 | WO2001049903A1 Electrolytic copper foil and method for inspecting physical property thereof, and copper clad laminate using the electrolytic copper foil |
07/12/2001 | WO2001005200A3 Printed circuit fabrication |
07/12/2001 | WO2000074436A3 Mounting of the coil in an electroacoustic transducer |
07/12/2001 | US20010008006 Method for bus capacitance reduction |
07/12/2001 | US20010007437 Voltage controlled oscillator and communication device using same |
07/12/2001 | US20010007373 Tape carrier for semiconductor device and method of producing same |
07/12/2001 | US20010007289 Full additive process with filled plated through holes |
07/12/2001 | US20010007287 Electronics module having power components, and a method of manufacture |
07/12/2001 | DE19961842A1 Mehrschichtleiterplatte Multi-layer printed circuit board |
07/12/2001 | DE10064394A1 Plug connector for printed circuit board, has distance part with windows in grid formation that far end sections of accommodation sockets pass through for protection |
07/12/2001 | DE10064374A1 Plug connector for connecting circuit boards has locking arms on side walls, connecting terminal accommodation space in plug housing, and distance holder for engaging plug housing |
07/12/2001 | DE10059808A1 Verfahren zur Verbindung einer integrierten Schaltung und einer flexiblen Schaltung A method of connecting an integrated circuit and a flexible circuit |
07/11/2001 | EP1115274A1 Electrical power module and method for its manufacture |
07/11/2001 | EP1115154A1 Power semiconductor module and motor drive system |
07/11/2001 | EP1115086A2 Non-contact type IC card and process for manufacturing same |
07/11/2001 | EP1114573A1 A method for controlling stress in thin film layers deposited over a high density interconnect common circuit base |
07/11/2001 | EP1114439A2 Method for forming low-impedance high-density deposited-on-laminate structures having reduced stress |
07/11/2001 | EP1114077A1 Liquid crystalline polyesters having a surprisingly good combination of a low melting point, a high heat distortion temperature, a low melt viscosity, and a high tensile elongation |
07/11/2001 | EP1113885A1 Printing of electronic circuits and components |
07/11/2001 | EP0832448B1 Method of manufacturing passive elements using conductive polypyrrole formulations |
07/11/2001 | EP0749600B1 Modular architecture for high bandwidth computers |
07/11/2001 | CN1303229A Thin integrated resistor and capacitor and inductor component element and its manufacturing method |
07/11/2001 | CN1303086A Resin hermetically sealed type semiconductor device and liquid crystal display assembly block |
07/11/2001 | CN1303085A 液晶显示器 LCD Monitor |
07/11/2001 | CN1068350C Epoxy resin mixture for prepregs and composites |
07/11/2001 | CN1068349C Epoxy resin mixture for prepregs and composities |
07/11/2001 | CN1068348C Epoxy resin mixtures for prepregs and composites |
07/10/2001 | US6259608 Conductor pattern for surface mount devices and method therefor |
07/10/2001 | US6259603 Electronic control unit |
07/10/2001 | US6259573 Preamplifier circuit with magnetoresistive sensor ESD protection |
07/10/2001 | US6259159 Reflowed solder ball with low melting point metal cap |
07/10/2001 | US6259157 Hybrid integrated circuit device, and method of manufacturing thereof |
07/10/2001 | US6259039 Surface mount connector with pins in vias |
07/10/2001 | US6259038 Semiconductor chip mounting board and method of inspecting the same mounting board |
07/10/2001 | US6259037 Polytetrafluoroethylene thin film chip carrier |
07/10/2001 | US6259022 Chip card micromodule as a surface-mount device |
07/10/2001 | US6258927 Synergistic mixture; fireproofing |
07/10/2001 | US6258449 Low-thermal expansion circuit board and multilayer circuit board |
07/10/2001 | US6258203 Base webs for printed circuit board production using the foam process and acrylic fibers |
07/10/2001 | US6258192 Multi-thickness, multi-layer green sheet processing |
07/10/2001 | US6257904 Connector with BGA arrangement for connecting to PC board |
07/10/2001 | US6257898 Mounting structure for flat circuitry |
07/10/2001 | US6257771 Opitcal/electrical hybrid wiring board and its manufacturing method |
07/10/2001 | US6257329 Thermal management system |
07/10/2001 | US6257215 Resin-sealed electronic apparatus for use in internal combustion engines |
07/10/2001 | US6256880 Method for preparing side attach pad traces through buried conductive material |
07/10/2001 | US6256877 Method for transforming a substrate with edge contacts into a ball grid array |
07/10/2001 | US6256866 Polymer thick-film resistor printed on planar circuit board surface |
07/10/2001 | US6256850 Method for producing a circuit board with embedded decoupling capacitance |
07/05/2001 | WO2001049083A1 Electronic ballast and electronic transformer |
07/05/2001 | WO2001048821A1 Integrated circuit |
07/05/2001 | WO2001048272A1 Electrolytic copper foil |