Patents for H05K 1 - Printed circuits (98,583)
06/2001
06/19/2001US6249114 Electronic component continuity inspection method and apparatus
06/19/2001US6249049 Ceramic package type electronic part which is high in connection strength to electrode
06/19/2001US6249047 Ball array layout
06/19/2001US6249045 Tented plated through-holes and method for fabrication thereof
06/19/2001US6249042 Member for lead
06/19/2001US6248961 Wave solder application for ball grid array modules and solder plug
06/19/2001US6248960 Ceramics substrate with electronic circuit and its manufacturing method
06/19/2001US6248959 Substrate with die area having same CTE as IC
06/19/2001US6248958 Resistivity control of CIC material
06/19/2001US6248957 Printed-circuit board reinforcing member and a system board device having the printed-circuit board reinforcing member
06/19/2001US6248455 Alloy-plated sheet steel cured with a thin layer of insulating polymer material forming an electrically nonconductive breachable metal substrate
06/19/2001US6248449 Flexible printed substrate having a conductive pattern formed thereon
06/19/2001US6248424 Method and apparatus for indicating degree of manufacture of an article
06/19/2001US6248401 Process for treating a metallic body with vapor-deposited treatment layer(s) and adhesion-promoting layer
06/19/2001US6247937 Circuit board insertable with minimized force
06/19/2001US6247228 Electrical connection with inwardly deformable contacts
06/19/2001US6247221 Method for sealing and/or joining an end of a ceramic filter
06/14/2001WO2001043515A1 Multilayered printed circuit board
06/14/2001WO2001043513A1 Mounting electrical devices to circuit boards
06/14/2001WO2001043497A1 Flexible circuit board assembly for a hearing aid
06/14/2001WO2001043234A1 Undetachable electrical and mechanical connection, contact element for an undetachable electrical and mechanical connection and method for producing such an electrical and mechanical connection
06/14/2001WO2001043192A1 A method and an arrangement relating to electronic circuitry
06/14/2001WO2001043188A1 Electronic part module, method of producing the same, etc.
06/14/2001WO2001043146A1 Non-silicone conductive paste for the electrical industry, and its use
06/14/2001WO2001042893A1 Semiconductor module
06/14/2001WO2001042359A1 Flame retardant phosphorus element-containing epoxy resin compositions
06/14/2001WO2001042253A2 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
06/14/2001WO2001042083A1 Light emitting diode assembly for use as an aircraft position light
06/14/2001WO2001042006A1 Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same
06/14/2001US20010003771 Cured polyepoxides or epoxidized novolaks containing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide group; high elastic modulus, and decomposition temperature, use in printed circuit and semiconductor encapsulant applications
06/14/2001US20010003614 Composite substrate, thin-film electroluminescent device using the substrate, and production process for the device
06/14/2001US20010003380 Method and an arrangement relating to electronic circuitry
06/14/2001US20010003371 Unit type clip lead terminal, clip lead terminal connecting method, lead terminal connecting board, and method of producing board with lead terminals
06/14/2001US20010003362 Composed of two or more unit particles joined through neck portions; fillers dispersed in a resin as a paste of high electroconductivity and low viscosity suitable for multilayer circuit boards for high-density mounting
06/14/2001CA2394050A1 Non-silicone conductive paste for the electrical industry, and its use
06/13/2001EP1107654A1 Sheet for printed wiring board, method of forming via, resin sheet having filled via, printed wiring board and method of manufacturing the same
06/13/2001EP1107642A2 Condenser microphone
06/13/2001EP1107375A1 Device for clamping a flexible circuit for motor vehicle and motorcycle dashboards
06/13/2001EP1107374A2 Connexion system for two circuit boards
06/13/2001EP1107362A2 Electrical connection box
06/13/2001EP1107312A2 Multiple line grids incorporating therein circuit elements
06/13/2001EP1107310A2 Isolation improvement of high power semiconductor modules
06/13/2001EP1107305A2 Method for mounting a semiconductor device
06/13/2001EP1106656A1 Process for preparing green pigment composition containing no halogen
06/13/2001EP1106040A1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections
06/13/2001EP1106039A1 Method for producing contact between two circuit layers separated by an insulating layer
06/13/2001EP1105942A1 Contact device mainly intended for contact between electric components and circuit supports and method for producing said device
06/13/2001EP1105941A1 Connector with two rows of terminals having tail portions with similar impedance
06/13/2001EP1105891A1 Planar transformer
06/13/2001EP1105838A1 Support element for an integrated circuit module
06/13/2001EP1105716A1 Inspection of printed circuit boards using color
06/13/2001EP1105248A1 Laser drilling of holes in materials
06/13/2001EP0908076B1 Grid array assembly and method of making
06/13/2001DE19958776A1 Unlösbare elektrische und mechanische Verbindung, Kontaktteil für eine unlösbare elektrische und mechanische Verbindung und Verfahren zur Herstellung einer unlösbaren elektrischen und mechanischen Verbindung Permanent electrical and mechanical connection, contact part for an undetachable electrical and mechanical connection and method for producing a non-detachable electrical and mechanical connection
06/13/2001DE19954941A1 Verfahren zum Integrieren eines Chips innerhalb einer Leiterplatte A method of integrating a chip within a printed circuit board
06/13/2001DE19954765A1 Electronic circuit carrier, in particular, circuit board comprises areas which are free from solder stop lacquer, and have a size at least equal to the heat-radiating surfaces of the components in danger of overheating
06/13/2001DE19949141A1 Multilayer-Anordnung Multilayer arrangement
06/13/2001DE19940480C2 Leiterbahnträgerschicht zur Einlaminierung in eine Chipkarte, Chipkarte mit einer Leiterbahnträgerschicht und Verfahren zur Herstellung einer Chipkarte Conductor carrier layer for Einlaminierung in a smart card, chip card having a conductor carrier layer and method for manufacturing a smart card
06/13/2001DE10054394A1 Widerstandsfähige Dickschichtleiter Durable thick film conductor
06/13/2001DE10053389A1 Verbindungsstruktur für elektrische Komponenten einer Leiterplatte Connection structure for electrical components of a circuit board
06/13/2001DE10051269A1 Bending fixation tool for flat conductor e.g. flexible PWB, has base piece to which flat conductor is mounted and has intermediate plate bending conductor in parallel plane and top plate locking bent conductor
06/13/2001DE10047644A1 Circuit block for current supply, has construction including small transformer and various electronic components mounted on base plate
06/13/2001DE10019838A1 Laminate capacitor for high frequency circuit has penetration conduction bodies with array pitch set to 0.085mm or less
06/13/2001CN1299581A Method of making microwave, multifunction modules using fluoropolymer substrates
06/13/2001CN1299580A Mounting structure for temp.-sensitive fuse on circuit board
06/13/2001CN1299579A Circuit bord of protective circuit for storage battery, protective circuit for storage battery, and storage pack
06/13/2001CN1299520A Wire bond attachment of a integrated circuit package to a heat sink
06/13/2001CN1299471A Optoelectric multichip module
06/13/2001CN1299318A Ultrahigh molecular weight polyethylene composite for printed circuit board and antenna base material
06/13/2001CN1299229A Printed circuit and its mfg. method
06/13/2001CN1299228A Capacitor type microphone
06/13/2001CN1298788A Method for preparing ceramic mud, ceramic blank and producing single pieces ceramic electronic elements
06/13/2001CN1067178C Circuit board and edg-mountable connector therefor, and method for preparing a circuit board edge
06/13/2001CN1067018C Resin laminates and process for prodn. thereof
06/12/2001US6247078 Computer interface for integrating a first computer into a second computer
06/12/2001US6246590 Substrate junction element
06/12/2001US6246588 Computer motherboard using oppositely configured memory module sockets
06/12/2001US6246581 Heated PCB interconnect for cooled IC chip modules
06/12/2001US6246334 Board ID display system
06/12/2001US6246312 Ball grid array resistor terminator network
06/12/2001US6246310 Noise suppressing apparatus
06/12/2001US6246301 High-frequency circuit apparatus
06/12/2001US6246247 Probe card assembly and kit, and methods of using same
06/12/2001US6246112 Interleaved signal trace routing
06/12/2001US6246102 Integrated circuits, transistors, data processing systems, printed wiring boards, digital computers, smart power devices, and processes of manufacture
06/12/2001US6246016 Edge-mountable integrated circuit package and method of attaching the same to a printed wiring board
06/12/2001US6246014 Printed circuit assembly and method of manufacture therefor
06/12/2001US6246013 Surface mounting structure and surface mount type electronic component included therein
06/12/2001US6246011 Solder joint reliability
06/12/2001US6246010 High density electronic package
06/12/2001US6245841 Cyanate ester based thermoset compositions
06/12/2001US6245630 Spherical shaped semiconductor integrated circuit
06/12/2001US6245490 Method of manufacturing a circuit board having metal bumps and a semiconductor device package comprising the same
06/12/2001US6245432 Circuit substrate, circuit-formed suspension substrate, and production methods therefor
06/12/2001US6245185 Method of making a multilayer ceramic product with thin layers
06/12/2001US6245092 Highly integrated electronic circuit, in particular for use in heart pacemakers
06/12/2001US6244878 Input/output connector with a connector body and terminals for a mobile electric device
06/12/2001US6244877 Electric connection box and molded connection block for printed circuit board, and method of making same
06/12/2001US6244728 Light emitting diode assembly for use as an aircraft position light
06/12/2001US6243946 Method of forming an interlayer connection structure