Patents for H05K 1 - Printed circuits (98,583)
04/2001
04/12/2001DE19948285A1 Communications module has radio receiver and/or transmitter mounted on circuit board, plug connector for internal equipment cable connections, antenna plug and/or antenna
04/12/2001DE19948091A1 Notebook computer with pivotably attached display
04/12/2001DE19945794A1 Verfahren zum Herstellen einer Leiterplatte sowie Leiterplatte A method of manufacturing a PCB and PCB
04/12/2001DE19945708A1 Chipkarte und Vorstufe hierfür Chip Card and precursor thereof
04/12/2001DE10048379A1 Electronic control unit e.g. for actuator, spark plug in vehicle, has separate driver circuit card and control circuit card within housing, with connector for external, connected by flexible printed circuit card
04/12/2001DE10035990A1 Ceramic electronic component manufacture for production of dielectric resonator, involves forming a glass-ceramic compact, to which a silver conductor pattern is provided and heat treated at specific conditions
04/12/2001DE10030742A1 Surface mounting type electronic component has extraction ends of internal electrode exposed to end faces of electronic component and exposed sections covered by protective coat
04/12/2001CA2366413A1 Method and apparatus for aligning optical interconnections between printed circuit boards
04/12/2001CA2330781A1 Verification of pwb electrical parameters
04/11/2001EP1091626A1 Circuit board of protective circuit for storage battery, protective circuit for storage battery, and storage battery pack
04/11/2001EP1091625A2 Printed circuit with high heat dissipation capacity
04/11/2001EP1091371A2 Aqueous dispersion for electrodeposition, high dielectric constant film and electronic parts
04/11/2001EP1091009A2 Alloy for electrical contacts and electrodes and method of making
04/11/2001EP1090538A1 Surface mount technology compatible emi gasket and a method of installing an emi gasket on a ground trace
04/11/2001EP1090536A1 Flexible circuit assembly
04/11/2001EP1090535A1 Flip chip devices with flexible conductive adhesive
04/11/2001EP1090401A1 Photodefined integral capacitor with self-aligned dielectric and electrodes and method therefor
04/11/2001EP0890297A4 Solder bonded electronic module
04/11/2001EP0809676B1 Polyamide 4.6 composition
04/11/2001CN1291301A Positive active photodielectric composition
04/11/2001CN1291070A Multilayer flexible wiring board
04/11/2001CN1290995A Non-directional frequency generator fixing plate
04/11/2001CN1064457C Circuit assemly and process for production thereof
04/11/2001CN1064414C Electrolytic copper foil for printed circuit board and its producing method
04/11/2001CN1064308C All aromatic polyamide fiber sheet
04/10/2001US6215687 Semiconductor device and process for manufacturing the same
04/10/2001US6215681 Bus bar heat sink
04/10/2001US6215672 Mounting structure for an acceleration sensor
04/10/2001US6215671 Method and apparatus for connecting circuit boards
04/10/2001US6215670 Method for manufacturing raised electrical contact pattern of controlled geometry
04/10/2001US6215663 Printed circuit board assembly with improved thermal performance
04/10/2001US6215649 Printed circuit board capacitor structure and method
04/10/2001US6215647 Multilayer capacitor
04/10/2001US6215387 Thick film low value high frequency inductor
04/10/2001US6215377 Low cost wideband RF port structure for microwave circuit packages using coplanar waveguide and BGA I/O format
04/10/2001US6215373 Method for edge termination of parallel conductive planes including estimating the characteristic impedance of the structure
04/10/2001US6215372 Method and apparatus for reducing electrical resonances in power and noise propagation in power distribution circuits employing plane conductors
04/10/2001US6215321 Probe card for wafer-level measurement, multilayer ceramic wiring board, and fabricating methods therefor
04/10/2001US6215320 High density printed circuit board
04/10/2001US6215269 Method of exposing a path on a curved, or otherwise irregularly shaped, surface
04/10/2001US6215184 Optimized circuit design layout for high performance ball grid array packages
04/10/2001US6215181 Method and apparatus providing redundancy for fabricating highly reliable memory modules
04/10/2001US6215076 Printed circuit board with noise suppression
04/10/2001US6214923 Polyimide-based composite, electronic parts using the composite, and polyimide-based aqueous dispersion
04/10/2001US6214716 Semiconductor substrate-based BGA interconnection and methods of farication same
04/10/2001US6214527 Photosensitive conductor paste
04/10/2001US6214523 Laser irradiation to remove unwanted areas of green ceramic paste pad positioned onto green ceramic substrate to write a label pattern, then sintering
04/10/2001US6214468 Flame retardant epoxy resin composition for printed board, and prepreg and metal foil clad laminate using the same
04/10/2001US6214445 Printed wiring board that has built-in capacitor in vicinity of an integrated circuit chip to be mounted thereon; simplified fabrication; minimizing loss due to defective capacitor during fabrication
04/10/2001US6214444 Reacts to operate buzzer or an alert lamp of detector; used to avoid shoplifting the resonant tags are attached to goods and the like in department stores, discount stores, rental shops for video tapes, compact disk (cd) shops
04/10/2001US6214259 Dispersion containing Cu ultrafine particles individually dispersed therein
04/10/2001US6213153 Electric power supply apparatus for solenoid valve manifold
04/10/2001US6212768 Flip chip mounting method and apparatus therefor
04/05/2001WO2001023190A1 Method and compositions for printing substrates
04/05/2001US20010000100 Method for mounting devices on a printed circuit board despite misalignment of resist
04/05/2001DE19947047A1 Method of detecting defects as "X-Out" identified circuit boards in circuit board manufacturing output enables more cost-effective detection than by conventional methods
04/05/2001DE19946712A1 Verfahren und Zusammensetzungen zum Bedrucken von Substraten Methods and compositions for printing substrates
04/05/2001DE19946195C1 Removal of alumina particle layer sintered onto sintered multilayer ceramic substrate, employs two stages of dry grit blasting followed by electrostatic repulsion of submicron residue
04/05/2001DE19944752A1 Light has circuit board fitted with one or more LEDs forming replacement light source; voltage converter is bridged or removed to operate LEDs with direct voltage
04/05/2001DE19941690A1 Steuergerät und Lötverfahren Control unit and soldering
04/05/2001DE19939584A1 Zur Montage auf eine Leiterplatte ausgelegtes Bauteil For mounting on a printed circuit board out blank component
04/05/2001DE10038429A1 Verbundlaminat und Verfahren zur Herstellung desselben A composite laminate and method of manufacturing the same
04/05/2001DE10035446A1 Micro bore hole generation method involves determining substrate position using interferometer; computer system processes position signal into table position
04/05/2001DE10034309A1 Boundary layer voltage reducing device for IC package, has ring portion with high thermal coefficient and opening having form and size corresponding to external perimeter of IC at given temperature
04/05/2001DE10026187A1 Verfahren und Vorrichtung zum Herstellen einer elektronischen Komponente Method and apparatus for manufacturing an electronic component
04/04/2001EP1089603A2 Copper foil bonding treatment with improved bond strength and resistance to undercutting
04/04/2001EP1089385A2 Electrical connector with electrical shield having latch and mounting arms
04/04/2001EP1089375A2 High frequency circuit module and communication device
04/04/2001EP1089336A2 Integrated circuit packages with improved EMI characteristics
04/04/2001EP1089334A2 Ceramic circuit board
04/04/2001EP1088848A1 Porous materials
04/04/2001EP1088802A1 Method for producing ceramic green sheet
04/04/2001EP1088470A1 Ic stack utilizing flexible circuits with bga contacts
04/04/2001EP1088345A1 System and method for determining the desired decoupling components for power distribution systems using a computer system
04/04/2001EP1088344A1 Method for determining the desired decoupling components for power distribution systems
04/04/2001EP1087869A1 Ultrahigh molecular weight polyethylene composite for printed circuit board and antenna base material
04/04/2001EP1053580A4 An improved connector scheme for a power pod power delivery system
04/04/2001CN2426262Y Electric circuit board for clamp connected connector
04/04/2001CN2426261Y 柔性印刷线路板 Flexible printed circuit boards
04/04/2001CN1290121A Printed circuit board and display device
04/04/2001CN1290066A Flat electronic device and installating structure thereof
04/04/2001CN1290033A Ultrasonic generator, multi-layer flexible circuit board and manufacture thereof
04/04/2001CN1064055C Epoxy acrylates
04/03/2001US6212086 Packaging of a DC-to-DC converter
04/03/2001US6212078 Nanolaminated thin film circuitry materials
04/03/2001US6212076 Enhanced heat-dissipating printed circuit board package
04/03/2001US6212072 Electronics package on a plate, and a method of making such a package
04/03/2001US6212071 Electrical circuit board heat dissipation system
04/03/2001US6212057 Flexible thin film capacitor having an adhesive film
04/03/2001US6211936 Liquid crystal display device and method of making the same
04/03/2001US6211935 Alignment device for an IC-mounted structure
04/03/2001US6211785 Method of manufacturing and testing an electronic device, and an electronic device
04/03/2001US6211690 Apparatus for electrically testing bare printed circuits
04/03/2001US6211487 Printed circuit board and method of manufacturing the same
04/03/2001US6211485 Blind via laser drilling system
04/03/2001US6211469 Printed circuit substrate with comb-type electrodes capable of improving the reliability of the electrode connections
04/03/2001US6211468 Flexible circuit with conductive vias having off-set axes
04/03/2001US6211463 Electronic circuit package with diamond film heat conductor
04/03/2001US6211080 Repair of dielectric-coated electrode or circuit defects
04/03/2001US6210771 Electrically active textiles and articles made therefrom