| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/16/2001 | EP1099247A1 Method for transferring solder to a device and/or testing the device |
| 05/16/2001 | EP1070425A4 Modular video signal matrix switcher with color-coded components |
| 05/16/2001 | CN1295782A Surface mount technology compatible EMI gasket and method of installing EMI gasket on ground trace |
| 05/16/2001 | CN1295542A Inorganic lubricant-coated glass fiber strands and products including the same |
| 05/16/2001 | CN1295541A Impregnated glass fiber strands and products including the same |
| 05/16/2001 | CN1295540A Inorganic particle-coated glass fiber strands and products including the same |
| 05/16/2001 | CN1295539A Glass fiber strands coated with thermally conductive inorganic particles and products including the same |
| 05/16/2001 | CN1295538A Methods for inhibiting abrasive wear of glass fiber strands |
| 05/16/2001 | CN1295432A Printed circuit board capable of suppressing electromagnetic interference and its laminating method |
| 05/16/2001 | CN1295431A Laminating method and product of 8-layer printed circuit board |
| 05/16/2001 | CN1295430A Laminating method and product of 8-layer printed circuit board |
| 05/16/2001 | CN1295429A Laminating method and product of 8-layer printed circuit board |
| 05/16/2001 | CN1295428A Printed circuit board capable of suppressing electromagnetic interference and its laminating method |
| 05/16/2001 | CN1295427A Laminating method and product of 8-layer printed circuit board |
| 05/16/2001 | CN1295268A Device for measuring relative position error |
| 05/15/2001 | US6233157 Printed circuit board and method for wiring signal lines on the same |
| 05/15/2001 | US6233154 Single-piece molded module housing |
| 05/15/2001 | US6233122 Capacitance controlled flexible circuit suspension |
| 05/15/2001 | US6232868 Hybrid circuit arrangement with overload protection |
| 05/15/2001 | US6232849 RF waveguide signal transition apparatus |
| 05/15/2001 | US6232724 Light emitting diode array |
| 05/15/2001 | US6232564 Printed wiring board wireability enhancement |
| 05/15/2001 | US6232562 Hybrid integrated circuit device |
| 05/15/2001 | US6232561 Process for producing wire connections on an electronic component assembly carrier made by the process |
| 05/15/2001 | US6232560 Arrangement of printed circuit traces |
| 05/15/2001 | US6232559 Multi-layer printed circuit board registration |
| 05/15/2001 | US6232558 Electronic component mounting base board having heat slug with slits and projections |
| 05/15/2001 | US6232399 Flame retardant |
| 05/15/2001 | US6232398 Alkali or acid corrodible organic or composite particles in resin matrix |
| 05/15/2001 | US6232251 Diopside oxide crystal phase; at least one crystal phase selected from the group consisting of a quartz crystal phase and a composite oxide crystal phase containing ti and mg or zn; and a glass phase; coefficient of thermal expansion |
| 05/15/2001 | US6232042 Microelectronics; resistor on substrate |
| 05/15/2001 | US6231986 Inorganic composition for low temperature firing |
| 05/15/2001 | US6231959 Prepreg of epoxy resin, hardener, and organodialkyurea promotor |
| 05/15/2001 | US6231742 Hardness; heat treatment |
| 05/15/2001 | US6231707 Method of forming a multilayer ceramic substrate with max-punched vias |
| 05/15/2001 | US6231402 Press-in contact and manufacturing method thereof |
| 05/15/2001 | US6231367 Method for achieving substantially uniform expansion of dielectric plate and electrical connector made in accordance therewith |
| 05/15/2001 | US6231363 Low profile interconnection |
| 05/15/2001 | US6230403 Interconnection system |
| 05/15/2001 | US6230401 Method and an arrangement in an electronics system |
| 05/15/2001 | US6230399 Backside encapsulation of tape automated bonding device |
| 05/15/2001 | CA2198088C Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 05/10/2001 | WO2001033927A1 Inter-circuit encapsulated packaging for power delivery |
| 05/10/2001 | WO2001033926A2 Electronic control device |
| 05/10/2001 | WO2001033922A1 Printed circuit board |
| 05/10/2001 | WO2001033630A2 Methods and compositions for detection and treatment of breast cancer, based on breast cancer-associated polypeptides |
| 05/10/2001 | WO2001033582A1 Multi-layered planar coil arrangement and method for production of a planar coil arrangement |
| 05/10/2001 | WO2001033272A1 Optical device using chip-on-board technology |
| 05/10/2001 | WO2001032964A1 Aqueous dispersion for forming conductive layer, conductive layer, electronic component, circuit board and method for manufacturing the same, and multilayer wiring board and method for manufacturing the same |
| 05/10/2001 | WO2001032555A1 Substrate with feedthrough and method for manufacturing the same |
| 05/10/2001 | US20010001085 Memory module with offset notches for improved insertion and memory module connector |
| 05/10/2001 | US20010001084 Novel zero insertion force sockets using negative thermal expansion materials |
| 05/10/2001 | US20010000988 Single-piece molded module housing |
| 05/10/2001 | US20010000925 Method of forming BGA interconnections having mixed solder profiles |
| 05/10/2001 | US20010000915 Mechanically-stabilized area-array device package |
| 05/10/2001 | DE19953191A1 Elektronisches Steuergerät Electronic control unit |
| 05/10/2001 | DE19951077C1 Stellantrieb zum Verstellen eines Stellglieds in zumindest zwei Freiheitsgraden Actuator for displacing an actuator in at least two degrees of freedom |
| 05/10/2001 | DE10042909A1 Multilayered ceramic substrate comprises substrate ceramic layers each containing a ceramic material that sinters at a low temperature, a shrinkage-preventing layer containing an inorganic material in the non-sintered state and wiring cable |
| 05/10/2001 | DE10023733A1 Befestigungsplatte für einen ungerichteten Frequenzgenerator Mounting plate for a non-directional frequency generator |
| 05/10/2001 | DE10019840A1 Multilayer capacitor for use in high frequency circuits e.g. CPU, has inner electrode electrically connected to main surface connection electrodes, through hole conductor |
| 05/10/2001 | CA2389712A1 Inter-circuit encapsulated packaging for power delivery |
| 05/09/2001 | EP1098556A1 Device for measuring a positioning error |
| 05/09/2001 | EP1098555A2 Printed-wiring board |
| 05/09/2001 | EP1098395A2 Contact for conductive film |
| 05/09/2001 | EP1098368A1 Module component and method of manufacturing the same |
| 05/09/2001 | EP1097959A1 High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these |
| 05/09/2001 | EP1097617A1 Interconnect assembly for printed circuit boards and method of fabrication |
| 05/09/2001 | EP1097616A1 Method for producing printed circuit boards with rough conducting structures and at least one area with fine conducting structures |
| 05/09/2001 | EP1097476A2 Curved ceramic moulded part |
| 05/09/2001 | CN1294757A Inductance device |
| 05/09/2001 | CN1294756A Semiconductor device, circuit board, method of mfg. circuit board, and electronic device |
| 05/09/2001 | CN1294749A Hybrid circuit arrangement with thermal release |
| 05/09/2001 | CN1294730A Display panel |
| 05/09/2001 | CN1294700A Liquid crystal display and mfg. thereof |
| 05/09/2001 | CN1294669A Control and signaling device or signaling device with luminous element |
| 05/09/2001 | CN1294483A Plastic substrate containing metal frame for package and its making method |
| 05/09/2001 | CN1294482A Circuit board |
| 05/09/2001 | CN1294365A Power source deoupling circuit design method |
| 05/08/2001 | US6229712 Printed circuit board for coupling surface mounted optoelectric semiconductor devices |
| 05/08/2001 | US6229711 Flip-chip mount board and flip-chip mount structure with improved mounting reliability |
| 05/08/2001 | US6229420 Proximity switches with mechanical decoupling of connection pins and connection insert |
| 05/08/2001 | US6229404 Crystal oscillator |
| 05/08/2001 | US6229249 Surface-mount type crystal oscillator |
| 05/08/2001 | US6229223 Flexible printed board |
| 05/08/2001 | US6229218 Interconnect device and method for mating dissimilar electronic package footprints |
| 05/08/2001 | US6229099 Multi-layer circuit board with particular pad spacing |
| 05/08/2001 | US6229098 Method for forming a thick-film resistor and thick-film resistor formed thereby |
| 05/08/2001 | US6229097 Substrate having trim window in a C5 array |
| 05/08/2001 | US6229096 Melting, heat treatment and solid phase polymerization of thermotropic crystalline polyester fibers and binder; heat resistance, dimensional stability |
| 05/08/2001 | US6229095 Multilayer wiring board |
| 05/08/2001 | US6228682 Multi-cavity substrate structure for discrete devices |
| 05/08/2001 | US6228511 Structure and process for thin film interconnect |
| 05/08/2001 | US6228500 Adhesive composition and precursor thereof |
| 05/08/2001 | US6228470 Composite substrate for electronic components |
| 05/08/2001 | US6228468 High density ceramic BGA package and method for making same |
| 05/08/2001 | US6228467 Heat-resistant insulating film, raw substrate for printed wiring board using the same and method for producing the substrate |
| 05/08/2001 | US6228466 Printed wiring board and method for manufacturing the same |
| 05/08/2001 | US6228464 Printed pattern defect repair sheet, and repair device and method for printed pattern defect |
| 05/08/2001 | US6228197 Assembly method allowing easy re-attachment of large area electronic components to a substrate |
| 05/08/2001 | US6228196 Method of producing a multi-layer ceramic substrate |