| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/30/2001 | CN1066605C Drawer of circuit board |
| 05/30/2001 | CN1066494C Process for producing metal-bonded-ceramic material |
| 05/29/2001 | US6239985 High speed signals distribution for backplanes |
| 05/29/2001 | US6239982 Electronic device having a single-sided circuit board |
| 05/29/2001 | US6239981 Packaging substrate |
| 05/29/2001 | US6239977 Technique for mounting electronic components on printed circuit boards |
| 05/29/2001 | US6239687 Variable voltage protection structures and method for making same |
| 05/29/2001 | US6239485 Reduced cross-talk noise high density signal interposer with power and ground wrap |
| 05/29/2001 | US6239400 Method and device for connecting two millimeter elements |
| 05/29/2001 | US6239387 Sinusoidal radio-frequency clock distribution system for synchronization of a computer system |
| 05/29/2001 | US6239386 Electrical connections with deformable contacts |
| 05/29/2001 | US6239385 Surface mountable coaxial solder interconnect and method |
| 05/29/2001 | US6239384 Microelectric lead structures with plural conductors |
| 05/29/2001 | US6239382 Device and method of controlling the bowing of a soldered or adhesively bonded assembly |
| 05/29/2001 | US6239372 Electrical connection of a movably disposed electrical component with a flexible, elastic conductor track carrier |
| 05/29/2001 | US6239370 Electrical line penetration through a housing wall |
| 05/29/2001 | US6239248 Phenol-novolacs with improved optical properties |
| 05/29/2001 | US6238802 Laminate for sealing capsules |
| 05/29/2001 | US6238777 Printed-circuit board |
| 05/29/2001 | US6238624 A self-addressable, self-assembling microelectronic device is designed and fabricated to actively carry out and control multi-step and multiplex molecular biological reactions in microscopic formats. |
| 05/29/2001 | US6238599 Adhesive paste comprising a network of interconnected particles adhered through a coating of fusible material, having spaces therebetween containing a thermoplastic epoxy resin or an allyl alcohol-styrene copolymer |
| 05/29/2001 | US6238225 Bus bar assembly |
| 05/29/2001 | US6238220 Communication main layout rack structure |
| 05/29/2001 | CA2202576C Electronic circuit assembly |
| 05/29/2001 | CA2182438C Circuit connector |
| 05/25/2001 | WO2001037622A2 Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer |
| 05/25/2001 | WO2001037620A1 Resistor structure of wiring board |
| 05/25/2001 | WO2001037338A2 Method for integrating a chip in a printed board and integrated circuit |
| 05/25/2001 | WO2001037233A1 Programmable connector |
| 05/25/2001 | WO2001037090A1 A memory expansion module with stacked memory packages |
| 05/25/2001 | WO2001036349A1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body |
| 05/25/2001 | WO2001036231A1 Control device for a motor vehicle and method for producing the same |
| 05/25/2001 | WO2000063950A3 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 05/24/2001 | US20010001840 Method and apparatus for registration control during processing of a workpiece, particularly during producing images on substrates in preparing printed circuit boards |
| 05/24/2001 | US20010001747 Multi-connectable printed circuit board |
| 05/24/2001 | US20010001508 Enhanced pad design for substrate |
| 05/24/2001 | US20010001505 Tape ball grid array with interconnected ground plane |
| 05/24/2001 | US20010001428 Circuit board and semiconductor device, and method of manufacturing the same |
| 05/24/2001 | US20010001406 Embossing a channel or opening into the green tape of the desired size under heat and pressure, screen printing an ink of conductive material to fill embossed channel or openings, firing the green tape |
| 05/23/2001 | EP1102525A1 Printed wiring board and method for producing the same |
| 05/23/2001 | EP1102522A2 Substrate coated with a conductive layer and manufacturing method thereof |
| 05/23/2001 | EP1102355A2 Electrical connecting element and method of producing the same |
| 05/23/2001 | EP1102351A1 A wire laying plate assembly and a molding process for an insulation plate |
| 05/23/2001 | EP1102338A1 Ptc element, ptc element-mounted pcb board, secondary cell protection circuit device and secondary cell assembly |
| 05/23/2001 | EP1102256A2 Recording/playback apparatus |
| 05/23/2001 | EP1102236A2 Display apparatus and assembly of its driving circuit |
| 05/23/2001 | EP1101750A1 Method of preparing an aluminum nitride substrate for bonding with a copper layer |
| 05/23/2001 | EP1101608A1 Articles having imageable coatings |
| 05/23/2001 | EP1101228A1 Polymer thick-film resistor printed on planar circuit board surface |
| 05/23/2001 | EP1101193A1 Open-worked antenna for integrated circuit card, and integrated circuit card comprising same |
| 05/23/2001 | EP1101169A1 Isolated high-speed communication bus |
| 05/23/2001 | EP0645416B1 Resin-impregnated fiber sheet |
| 05/23/2001 | DE19949429A1 Through-hole-plated printed circuit board with a printed circuit board hole has an inner contact removed in the printed circuit board hole to prevent solder from flowing off and any later contact layer from forming in a gap. |
| 05/23/2001 | DE10054110A1 Ceiling-mounted photoelectric smoke detector has hybrid circuit board with integrated circuit, housed in holder with light receiving face is directed towards smoke detection space |
| 05/23/2001 | CN2431670Y Connector for controlling circuit in fan |
| 05/23/2001 | CN1296728A Thin film transferable electric components |
| 05/23/2001 | CN1296642A RF circuit module |
| 05/23/2001 | CN1295896A Machine for punching sheet material |
| 05/22/2001 | US6237056 Apparatus and method for high speed board-to board ribbon cable data transfer |
| 05/22/2001 | US6236786 Substrate with optical waveguide and method of making the same |
| 05/22/2001 | US6236572 Controlled impedance bus and method for a computer system |
| 05/22/2001 | US6236565 Chip stack with active cooling system |
| 05/22/2001 | US6235995 Flexible printed cable with ground plane and required impedance |
| 05/22/2001 | US6235994 Thermal/electrical break for printed circuit boards |
| 05/22/2001 | US6235991 Recessed mechanical fasteners for circuit boards |
| 05/22/2001 | US6235986 Electromagnetic interference gasket |
| 05/22/2001 | US6235985 Low profile printed circuit board RF shield for radiating pin |
| 05/22/2001 | US6235984 Photovoltaic solar module in plate form |
| 05/22/2001 | US6234832 Double row modular gang jack for board edge application |
| 05/22/2001 | US6234807 Circuit board connector edge with straddle pattern tab design for impedance-controlled connections |
| 05/22/2001 | US6233820 Method for manufacturing of a multilayer microwave board and boards obtained on the basis of this method |
| 05/22/2001 | US6233817 Method of forming thick-film hybrid circuit on a metal circuit board |
| 05/22/2001 | US6233816 Vibration sensitive isolation for printed circuit boards |
| 05/22/2001 | CA2206643C Chemically grafted electrical devices |
| 05/19/2001 | CA2326260A1 Installation structure of a power circuit unit, installation structure of a circuit board and installation method of a power circuit unit |
| 05/17/2001 | WO2001035704A1 Multi-layer double-sided wiring board and method of fabricating the same |
| 05/17/2001 | WO2001035456A1 Dip formation of flip-chip solder bumps |
| 05/17/2001 | WO2001035173A1 Electronic wrist watch comprising an integrated circuit incorporated in a flexible band |
| 05/17/2001 | WO2001035006A2 Metal-infiltrated ceramic seal |
| 05/17/2001 | WO2001034880A1 Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 05/17/2001 | WO2001034879A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil with carrier foil |
| 05/17/2001 | WO2001034679A1 Imide-benzoxazole polycondensate and process for producing the same |
| 05/17/2001 | WO2001034678A1 Soluble polyimide and composition comprising the same, bonding sheet, adhesive laminated film for covering accelerator beam tube, and adhesive laminated film for covering conductor wire for accelerator quench heater |
| 05/17/2001 | WO2001034382A1 Aerogel substrate and method for preparing the same |
| 05/17/2001 | US20010001214 Technique for producing interconnecting conductive links |
| 05/17/2001 | DE19953237A1 Mehrschichtige Planarspulenanordnung und Verfahren zur Herstellung einer Planarspulenanordnung Multilayer Planarspulenanordnung and method for producing a Planarspulenanordnung |
| 05/17/2001 | DE19948454A1 Foil conductor for electrical and electronic control devices used in vehicles, has coupling region with winding ferrite paths on spatially arranged conductor paths for inductive transmission on two main areas |
| 05/17/2001 | DE19948356A1 Sandwich-type multiple layered circuit board e.g. for electronic circuits of computers, controls, and telecommunications devices |
| 05/17/2001 | DE19847521C2 Geschoß mit schockgedämpft eingebauter Schaltungsplatine Basement with built-in shock-damped circuit board |
| 05/17/2001 | DE10055307A1 Dielectric ceramic composition used in the production of monolithic integrated circuits for high frequency applications contains oxides of barium, titanium and zirconium |
| 05/17/2001 | DE10049604A1 Dielectric ceramic composition used in a computer includes a glass component containing silicon oxide and boron oxide mixed with a dielectric ceramic component |
| 05/17/2001 | DE10037089A1 Befestigungsanordnung für eine flache Schaltanordnung Mounting assembly for a flat circuit arrangement |
| 05/16/2001 | EP1100298A1 Ceramic circuit board and method of manufacture thereof |
| 05/16/2001 | EP1100296A1 Wiring method and wiring device |
| 05/16/2001 | EP1100295A2 Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same |
| 05/16/2001 | EP1100294A2 Bus bar heat sink |
| 05/16/2001 | EP1100291A1 Composite substrate, thin film el element using it, and method of producing the same |
| 05/16/2001 | EP1100123A1 Dip formation of flip-chip solder bumps |
| 05/16/2001 | EP1100096A1 Electronic device and manufacture thereof |
| 05/16/2001 | EP1099362A1 A device and method for mounting electronic components on printed circuit boards |